DE69716637D1 - Thermisch wiederaufbereitbare bindemittel für flip chips - Google Patents

Thermisch wiederaufbereitbare bindemittel für flip chips

Info

Publication number
DE69716637D1
DE69716637D1 DE69716637T DE69716637T DE69716637D1 DE 69716637 D1 DE69716637 D1 DE 69716637D1 DE 69716637 T DE69716637 T DE 69716637T DE 69716637 T DE69716637 T DE 69716637T DE 69716637 D1 DE69716637 D1 DE 69716637D1
Authority
DE
Germany
Prior art keywords
reprocessable
binders
thermal
flip chips
flip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69716637T
Other languages
English (en)
Other versions
DE69716637T2 (de
Inventor
Ratnaswamy Iyer
Kwan Wong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resolution Research Nederland Bv Amsterdam
Resolution Research Nederland BV
Original Assignee
Resolution Research Nederland Bv Amsterdam
Resolution Research Nederland BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resolution Research Nederland Bv Amsterdam, Resolution Research Nederland BV filed Critical Resolution Research Nederland Bv Amsterdam
Publication of DE69716637D1 publication Critical patent/DE69716637D1/de
Application granted granted Critical
Publication of DE69716637T2 publication Critical patent/DE69716637T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L73/00—Compositions of macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups C08L59/00 - C08L71/00; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G67/00—Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing oxygen or oxygen and carbon, not provided for in groups C08G2/00 - C08G65/00
    • C08G67/02—Copolymers of carbon monoxide and aliphatic unsaturated compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
DE69716637T 1996-12-16 1997-12-15 Thermisch wiederaufbereitbare bindemittel für flip chips Expired - Fee Related DE69716637T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/767,058 US5760337A (en) 1996-12-16 1996-12-16 Thermally reworkable binders for flip-chip devices
PCT/EP1997/007156 WO1998027160A1 (en) 1996-12-16 1997-12-15 Thermally reworkable binders for flip-chip devices

Publications (2)

Publication Number Publication Date
DE69716637D1 true DE69716637D1 (de) 2002-11-28
DE69716637T2 DE69716637T2 (de) 2003-03-13

Family

ID=25078357

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69716637T Expired - Fee Related DE69716637T2 (de) 1996-12-16 1997-12-15 Thermisch wiederaufbereitbare bindemittel für flip chips

Country Status (16)

Country Link
US (1) US5760337A (de)
EP (1) EP0944671B1 (de)
JP (1) JP2001506805A (de)
KR (1) KR20000069484A (de)
CN (1) CN1122083C (de)
AU (1) AU716191B2 (de)
BR (1) BR9713713A (de)
CA (1) CA2275366A1 (de)
DE (1) DE69716637T2 (de)
HU (1) HUP0000811A3 (de)
ID (1) ID21657A (de)
IL (1) IL130144A0 (de)
MY (1) MY118367A (de)
TW (1) TW513479B (de)
WO (1) WO1998027160A1 (de)
ZA (1) ZA9711196B (de)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7645899B1 (en) 1994-09-02 2010-01-12 Henkel Corporation Vinyl compounds
US5912282A (en) * 1996-12-16 1999-06-15 Shell Oil Company Die attach adhesive compositions
US6316528B1 (en) 1997-01-17 2001-11-13 Loctite (R&D) Limited Thermosetting resin compositions
US6274389B1 (en) 1997-01-17 2001-08-14 Loctite (R&D) Ltd. Mounting structure and mounting process from semiconductor devices
WO1999035187A1 (en) 1998-01-07 1999-07-15 Georgia Tech Research Corporation Reworkable epoxy underfill encapsulants
SG105450A1 (en) 1998-07-02 2004-08-27 Nat Starch Chem Invest Allylated amide compounds and die attach adhesives prepared therefrom
US6350840B1 (en) 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
US6316566B1 (en) 1998-07-02 2001-11-13 National Starch And Chemical Investment Holding Corporation Package encapsulant compositions for use in electronic devices
US6057381A (en) * 1998-07-02 2000-05-02 National Starch And Chemical Investment Holding Corporation Method of making an electronic component using reworkable underfill encapsulants
US6281314B1 (en) 1998-07-02 2001-08-28 National Starch And Chemical Investment Holding Corporation Compositions for use in the fabrication of circuit components and printed wire boards
US6063828A (en) * 1998-07-02 2000-05-16 National Starch And Chemical Investment Holding Corporation Underfill encapsulant compositions for use in electronic devices
US6329832B1 (en) * 1998-10-05 2001-12-11 Micron Technology, Inc. Method for in-line testing of flip-chip semiconductor assemblies
US6543131B1 (en) * 1999-03-10 2003-04-08 Tessera, Inc. Microelectronic joining processes with temporary securement
US20040155364A1 (en) * 1999-06-17 2004-08-12 Takahisa Doba Reworkable thermosetting resin compositions
US7332218B1 (en) * 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
US20080196828A1 (en) * 1999-07-14 2008-08-21 Gilbert Michael D Electrically Disbonding Adhesive Compositions and Related Methods
US6403753B1 (en) 2000-01-18 2002-06-11 Sandia Corporation Method of making thermally removable polyurethanes
US6271335B1 (en) 2000-01-18 2001-08-07 Sandia Corporation Method of making thermally removable polymeric encapsulants
US6337384B1 (en) 2000-01-18 2002-01-08 Sandia Corporation Method of making thermally removable epoxies
US6255500B1 (en) 2000-01-21 2001-07-03 Loctite Corporation Process for the epoxidation of diene esters
US20050288458A1 (en) * 2002-07-29 2005-12-29 Klemarczyk Philip T Reworkable thermosetting resin composition
US7012120B2 (en) 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
US6680436B2 (en) 2000-07-12 2004-01-20 Seagate Technology Llc Reflow encapsulant
US6657031B1 (en) 2000-08-02 2003-12-02 Loctite Corporation Reworkable thermosetting resin compositions
US6627683B1 (en) 2000-09-05 2003-09-30 Henkel Loctite Corporation Reworkable thermosetting resin compositions and compounds useful therein
US7108920B1 (en) 2000-09-15 2006-09-19 Henkel Corporation Reworkable compositions incorporating episulfide resins
JP2004523893A (ja) * 2000-11-14 2004-08-05 ヘンケル　ロックタイト　コーポレイション ウェーハ塗布用融剤兼アンダーフィル材、ならびにそれを用いて製造された積層電子組立体
US6562663B2 (en) * 2001-03-28 2003-05-13 Motorola, Inc. Microelectronic assembly with die support and method
US6574861B1 (en) 2001-04-11 2003-06-10 Applied Micro Circuits Corporation System and method for solder ball rework
US20030019576A1 (en) * 2001-06-27 2003-01-30 Loctite Corporation Electronic component removal method through application of infrared radiation
US6572980B1 (en) 2001-08-13 2003-06-03 Henkel Loctite Corporation Reworkable thermosetting resin compositions
JP3723483B2 (ja) * 2001-10-16 2005-12-07 日本電気株式会社 電子部品装置
US6887737B1 (en) 2001-12-13 2005-05-03 Henkel Corporation Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom
US6933361B2 (en) * 2002-07-12 2005-08-23 The Regents Of The University Of California Thermally re-mendable cross-linked polymers
JP3971995B2 (ja) * 2002-12-25 2007-09-05 日本電気株式会社 電子部品装置
US6768209B1 (en) * 2003-02-03 2004-07-27 Micron Technology, Inc. Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices
JP2004307859A (ja) * 2003-04-05 2004-11-04 Rohm & Haas Electronic Materials Llc 電子デバイス製造
KR20050001159A (ko) * 2003-06-27 2005-01-06 삼성전자주식회사 복수개의 플립 칩들을 갖는 멀티칩 패키지 및 그 제조방법
US20070269659A1 (en) * 2006-05-17 2007-11-22 Eic Laboratories, Inc. Electrically disbondable compositions and related methods
US20070290378A1 (en) * 2006-06-20 2007-12-20 International Business Machines Corporation Novel reworkable underfills for ceramic mcm c4 protection
US20120018498A1 (en) * 2010-07-20 2012-01-26 Mediatek (Shenzhen) Inc. Pre-solder method and rework method for multi-row qfn chip
US8917510B2 (en) * 2011-01-14 2014-12-23 International Business Machines Corporation Reversibly adhesive thermal interface material
US8511369B2 (en) 2011-04-18 2013-08-20 International Business Machines Corporation Thermally reversible crosslinked polymer modified particles and methods for making the same
MX352032B (es) * 2012-02-17 2017-11-07 Valspar Sourcing Inc Metodos y materiales para la funcionalizacion de polimeros y revestimientos que incluyen polimero funcionalizado.
US9085719B2 (en) 2013-03-18 2015-07-21 International Business Machines Corporation Thermally reversible thermal interface materials with improved moisture resistance
JP6596412B2 (ja) 2013-03-22 2019-10-23 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ジエン／ジエノフィル対および補修性を有する熱硬化性樹脂組成物
US9193139B2 (en) * 2013-05-30 2015-11-24 Xerox Corporation Reversible polymer adhesive composition
US9545011B2 (en) 2015-05-13 2017-01-10 International Business Machines Corporation Dry film solder mask composite laminate materials
WO2017027525A1 (en) * 2015-08-11 2017-02-16 The Arizona Board Of Regents On Behalf Of The University Of Arizona Method of forming of a robust network of epoxy material through diels-alder reaction
US10723921B2 (en) 2016-01-29 2020-07-28 Arizona Board Of Regents On Behalf Of The University Of Arizona Coumarin-modified epoxy adhesives
KR101757584B1 (ko) 2016-03-16 2017-07-12 전자부품연구원 재제조성 방열필름용 조성물 및 그의 제조방법
EP4220707A1 (de) * 2022-01-31 2023-08-02 Vrije Universiteit Brussel Leitfähige selbstheilende kompositmaterialien

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979373A (en) * 1975-06-13 1976-09-07 Shell Oil Company Polymeric furan derivative
US4826932A (en) * 1987-12-29 1989-05-02 Shell Oil Company Dioxolane containing polymer
EP0340492A3 (de) * 1988-05-02 1990-07-04 International Business Machines Corporation Konforme Versieglung und interplanare Verkapselung elektronischer Anordnungsstrukturen
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
JPH03247620A (ja) * 1990-02-26 1991-11-05 Sumitomo Chem Co Ltd 熱硬化性樹脂組成物およびそれを用いた電子部品
US5121190A (en) * 1990-03-14 1992-06-09 International Business Machines Corp. Solder interconnection structure on organic substrates
US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5274913A (en) * 1991-10-25 1994-01-04 International Business Machines Corporation Method of fabricating a reworkable module
US5233046A (en) * 1991-11-04 1993-08-03 Hay Allan S Diarylacetylenes, enamines and acetylenic polymers and their production
US5390082A (en) * 1992-07-06 1995-02-14 International Business Machines, Corp. Chip carrier with protective coating for circuitized surface
TW338044B (en) * 1994-11-15 1998-08-11 Shell Internattonale Res Mij B V A cross linked resin
US5659203A (en) * 1995-06-07 1997-08-19 International Business Machines Corporation Reworkable polymer chip encapsulant

Also Published As

Publication number Publication date
CA2275366A1 (en) 1998-06-25
EP0944671B1 (de) 2002-10-23
US5760337A (en) 1998-06-02
CN1240465A (zh) 2000-01-05
JP2001506805A (ja) 2001-05-22
TW513479B (en) 2002-12-11
AU5761298A (en) 1998-07-15
IL130144A0 (en) 2000-06-01
AU716191B2 (en) 2000-02-24
EP0944671A1 (de) 1999-09-29
ID21657A (id) 1999-07-08
HUP0000811A3 (en) 2001-05-28
HUP0000811A2 (en) 2000-07-28
ZA9711196B (en) 1998-06-23
MY118367A (en) 2004-10-30
WO1998027160A1 (en) 1998-06-25
KR20000069484A (ko) 2000-11-25
BR9713713A (pt) 2000-02-08
CN1122083C (zh) 2003-09-24
DE69716637T2 (de) 2003-03-13

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