IL130144A0 - Thermally reworkable binders for flip-chip devices - Google Patents

Thermally reworkable binders for flip-chip devices

Info

Publication number
IL130144A0
IL130144A0 IL13014497A IL13014497A IL130144A0 IL 130144 A0 IL130144 A0 IL 130144A0 IL 13014497 A IL13014497 A IL 13014497A IL 13014497 A IL13014497 A IL 13014497A IL 130144 A0 IL130144 A0 IL 130144A0
Authority
IL
Israel
Prior art keywords
binders
flip
chip devices
thermally reworkable
reworkable
Prior art date
Application number
IL13014497A
Other languages
English (en)
Original Assignee
Shell Int Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Int Research filed Critical Shell Int Research
Publication of IL130144A0 publication Critical patent/IL130144A0/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L73/00—Compositions of macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups C08L59/00 - C08L71/00; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G67/00—Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing oxygen or oxygen and carbon, not provided for in groups C08G2/00 - C08G65/00
    • C08G67/02—Copolymers of carbon monoxide and aliphatic unsaturated compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
IL13014497A 1996-12-16 1997-12-15 Thermally reworkable binders for flip-chip devices IL130144A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/767,058 US5760337A (en) 1996-12-16 1996-12-16 Thermally reworkable binders for flip-chip devices
PCT/EP1997/007156 WO1998027160A1 (en) 1996-12-16 1997-12-15 Thermally reworkable binders for flip-chip devices

Publications (1)

Publication Number Publication Date
IL130144A0 true IL130144A0 (en) 2000-06-01

Family

ID=25078357

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13014497A IL130144A0 (en) 1996-12-16 1997-12-15 Thermally reworkable binders for flip-chip devices

Country Status (16)

Country Link
US (1) US5760337A (de)
EP (1) EP0944671B1 (de)
JP (1) JP2001506805A (de)
KR (1) KR20000069484A (de)
CN (1) CN1122083C (de)
AU (1) AU716191B2 (de)
BR (1) BR9713713A (de)
CA (1) CA2275366A1 (de)
DE (1) DE69716637T2 (de)
HU (1) HUP0000811A3 (de)
ID (1) ID21657A (de)
IL (1) IL130144A0 (de)
MY (1) MY118367A (de)
TW (1) TW513479B (de)
WO (1) WO1998027160A1 (de)
ZA (1) ZA9711196B (de)

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US6316528B1 (en) 1997-01-17 2001-11-13 Loctite (R&D) Limited Thermosetting resin compositions
US6172141B1 (en) 1998-01-07 2001-01-09 Georgia Tech Research Corporation Reworkable epoxy underfill encapsulants
US6063828A (en) * 1998-07-02 2000-05-16 National Starch And Chemical Investment Holding Corporation Underfill encapsulant compositions for use in electronic devices
US6350840B1 (en) 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
US6281314B1 (en) 1998-07-02 2001-08-28 National Starch And Chemical Investment Holding Corporation Compositions for use in the fabrication of circuit components and printed wire boards
US6316566B1 (en) 1998-07-02 2001-11-13 National Starch And Chemical Investment Holding Corporation Package encapsulant compositions for use in electronic devices
US6057381A (en) * 1998-07-02 2000-05-02 National Starch And Chemical Investment Holding Corporation Method of making an electronic component using reworkable underfill encapsulants
SG105450A1 (en) 1998-07-02 2004-08-27 Nat Starch Chem Invest Allylated amide compounds and die attach adhesives prepared therefrom
US6329832B1 (en) * 1998-10-05 2001-12-11 Micron Technology, Inc. Method for in-line testing of flip-chip semiconductor assemblies
AU3623000A (en) * 1999-03-10 2000-09-28 Tessera, Inc. Microelectronic joining processes
US20040155364A1 (en) * 1999-06-17 2004-08-12 Takahisa Doba Reworkable thermosetting resin compositions
US7332218B1 (en) 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
US20080196828A1 (en) * 1999-07-14 2008-08-21 Gilbert Michael D Electrically Disbonding Adhesive Compositions and Related Methods
US6337384B1 (en) 2000-01-18 2002-01-08 Sandia Corporation Method of making thermally removable epoxies
US6271335B1 (en) 2000-01-18 2001-08-07 Sandia Corporation Method of making thermally removable polymeric encapsulants
US6403753B1 (en) 2000-01-18 2002-06-11 Sandia Corporation Method of making thermally removable polyurethanes
US6255500B1 (en) 2000-01-21 2001-07-03 Loctite Corporation Process for the epoxidation of diene esters
US20050288458A1 (en) * 2002-07-29 2005-12-29 Klemarczyk Philip T Reworkable thermosetting resin composition
US7012120B2 (en) 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
US6680436B2 (en) 2000-07-12 2004-01-20 Seagate Technology Llc Reflow encapsulant
US6657031B1 (en) 2000-08-02 2003-12-02 Loctite Corporation Reworkable thermosetting resin compositions
US6627683B1 (en) 2000-09-05 2003-09-30 Henkel Loctite Corporation Reworkable thermosetting resin compositions and compounds useful therein
US7108920B1 (en) 2000-09-15 2006-09-19 Henkel Corporation Reworkable compositions incorporating episulfide resins
WO2002058108A2 (en) * 2000-11-14 2002-07-25 Henkel Loctite Corporation Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
US6562663B2 (en) * 2001-03-28 2003-05-13 Motorola, Inc. Microelectronic assembly with die support and method
US6574861B1 (en) 2001-04-11 2003-06-10 Applied Micro Circuits Corporation System and method for solder ball rework
US20030019576A1 (en) * 2001-06-27 2003-01-30 Loctite Corporation Electronic component removal method through application of infrared radiation
US6572980B1 (en) 2001-08-13 2003-06-03 Henkel Loctite Corporation Reworkable thermosetting resin compositions
JP3723483B2 (ja) * 2001-10-16 2005-12-07 日本電気株式会社 電子部品装置
US6887737B1 (en) 2001-12-13 2005-05-03 Henkel Corporation Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom
US6933361B2 (en) * 2002-07-12 2005-08-23 The Regents Of The University Of California Thermally re-mendable cross-linked polymers
JP3971995B2 (ja) * 2002-12-25 2007-09-05 日本電気株式会社 電子部品装置
US6768209B1 (en) * 2003-02-03 2004-07-27 Micron Technology, Inc. Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices
JP2004307859A (ja) * 2003-04-05 2004-11-04 Rohm & Haas Electronic Materials Llc 電子デバイス製造
KR20050001159A (ko) * 2003-06-27 2005-01-06 삼성전자주식회사 복수개의 플립 칩들을 갖는 멀티칩 패키지 및 그 제조방법
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US20070290378A1 (en) * 2006-06-20 2007-12-20 International Business Machines Corporation Novel reworkable underfills for ceramic mcm c4 protection
US20120018498A1 (en) * 2010-07-20 2012-01-26 Mediatek (Shenzhen) Inc. Pre-solder method and rework method for multi-row qfn chip
US8917510B2 (en) * 2011-01-14 2014-12-23 International Business Machines Corporation Reversibly adhesive thermal interface material
US8511369B2 (en) 2011-04-18 2013-08-20 International Business Machines Corporation Thermally reversible crosslinked polymer modified particles and methods for making the same
RU2601767C2 (ru) * 2012-02-17 2016-11-10 Валспар Сорсинг, Инк. Способы и материалы для функционализации полимеров и покрытия, включающие функционализированный полимер
US9085719B2 (en) 2013-03-18 2015-07-21 International Business Machines Corporation Thermally reversible thermal interface materials with improved moisture resistance
EP2976380B1 (de) * 2013-03-22 2018-10-10 Henkel IP & Holding GmbH Dien-/dienophilpaare und wärmehärtbare harzzusammensetzungen mit wiederbearbeitbarkeit
US9193139B2 (en) * 2013-05-30 2015-11-24 Xerox Corporation Reversible polymer adhesive composition
US9545011B2 (en) 2015-05-13 2017-01-10 International Business Machines Corporation Dry film solder mask composite laminate materials
US10647810B2 (en) * 2015-08-11 2020-05-12 Arizona Board Of Regents On Behalf Of The University Of Arizona Method of forming of a robust network of epoxy material through Diels-Alder reaction
US10723921B2 (en) 2016-01-29 2020-07-28 Arizona Board Of Regents On Behalf Of The University Of Arizona Coumarin-modified epoxy adhesives
KR101757584B1 (ko) 2016-03-16 2017-07-12 전자부품연구원 재제조성 방열필름용 조성물 및 그의 제조방법
EP4220707A1 (de) * 2022-01-31 2023-08-02 Vrije Universiteit Brussel Leitfähige selbstheilende kompositmaterialien
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Also Published As

Publication number Publication date
BR9713713A (pt) 2000-02-08
US5760337A (en) 1998-06-02
ID21657A (id) 1999-07-08
MY118367A (en) 2004-10-30
TW513479B (en) 2002-12-11
ZA9711196B (en) 1998-06-23
HUP0000811A3 (en) 2001-05-28
JP2001506805A (ja) 2001-05-22
KR20000069484A (ko) 2000-11-25
WO1998027160A1 (en) 1998-06-25
EP0944671B1 (de) 2002-10-23
CN1122083C (zh) 2003-09-24
CN1240465A (zh) 2000-01-05
AU716191B2 (en) 2000-02-24
HUP0000811A2 (en) 2000-07-28
AU5761298A (en) 1998-07-15
EP0944671A1 (de) 1999-09-29
CA2275366A1 (en) 1998-06-25
DE69716637D1 (de) 2002-11-28
DE69716637T2 (de) 2003-03-13

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