DE69711321D1 - Schwingstabbeschleunigungsmesser und Methode zu seiner Herstellung - Google Patents
Schwingstabbeschleunigungsmesser und Methode zu seiner HerstellungInfo
- Publication number
- DE69711321D1 DE69711321D1 DE69711321T DE69711321T DE69711321D1 DE 69711321 D1 DE69711321 D1 DE 69711321D1 DE 69711321 T DE69711321 T DE 69711321T DE 69711321 T DE69711321 T DE 69711321T DE 69711321 D1 DE69711321 D1 DE 69711321D1
- Authority
- DE
- Germany
- Prior art keywords
- accelerometer
- manufacture
- vibrating rod
- vibrating
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0081—Thermal properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B81C2201/0135—Controlling etch progression
- B81C2201/014—Controlling etch progression by depositing an etch stop layer, e.g. silicon nitride, silicon oxide, metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/019—Bonding or gluing multiple substrate layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/735,299 US5948981A (en) | 1996-05-21 | 1996-10-22 | Vibrating beam accelerometer |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69711321D1 true DE69711321D1 (de) | 2002-05-02 |
DE69711321T2 DE69711321T2 (de) | 2002-10-31 |
Family
ID=24955196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69711321T Expired - Fee Related DE69711321T2 (de) | 1996-10-22 | 1997-09-08 | Schwingstabbeschleunigungsmesser und Methode zu seiner Herstellung |
Country Status (3)
Country | Link |
---|---|
US (3) | US5948981A (de) |
EP (1) | EP0840128B1 (de) |
DE (1) | DE69711321T2 (de) |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5948981A (en) * | 1996-05-21 | 1999-09-07 | Alliedsignal Inc. | Vibrating beam accelerometer |
US6282959B1 (en) * | 1996-06-11 | 2001-09-04 | Alliedsignal | Compensation of second-order non-linearity in sensors employing double-ended tuning forks |
GB9815232D0 (en) * | 1998-07-15 | 1998-09-09 | Hydramotion Ltd | Diagnostic sensor |
US6269698B1 (en) | 1999-03-25 | 2001-08-07 | Alliedsignal Inc. | Vibrating beam force sensor |
US6257060B1 (en) * | 1999-06-22 | 2001-07-10 | Alliedsignal Inc. | Combined enhanced shock load capability and stress isolation structure for an improved performance silicon micro-machined accelerometer |
US6453744B2 (en) * | 2000-05-10 | 2002-09-24 | Honeywell International, Inc. | Low radiation capture cross-section electrode material for prompt radiation environments |
US20020118850A1 (en) * | 2000-08-02 | 2002-08-29 | Yeh Jer-Liang (Andrew) | Micromachine directional microphone and associated method |
US6662655B2 (en) * | 2000-10-31 | 2003-12-16 | Honeywell International, Inc. | Net zero isolator |
CN1656382A (zh) | 2001-05-15 | 2005-08-17 | 霍尼韦尔国际公司 | 加速度计应变消除结构 |
US6672169B2 (en) * | 2001-05-18 | 2004-01-06 | Clymer Technologies, Llc | Performance measuring system and method for analyzing performance characteristics of rotating shafts |
US6619123B2 (en) * | 2001-06-04 | 2003-09-16 | Wisconsin Alumni Research Foundation | Micromachined shock sensor |
WO2002103369A1 (en) | 2001-06-18 | 2002-12-27 | Honeywell International Inc. | Small size, high capacitance readout silicon based mems accelerometer |
DE60232250D1 (de) * | 2001-08-20 | 2009-06-18 | Honeywell Int Inc | Bogenförmige federelemente für mikro-elektromechanischen beschleunigungssensor |
EP1423713A1 (de) * | 2001-08-24 | 2004-06-02 | Honeywell International Inc. | Hermetisch abgedichtetes, mikromechanisch hergestelltes elektromechanisches system (mems) mit eindiffundierten leiterbahnen |
JP3724403B2 (ja) * | 2001-10-02 | 2005-12-07 | 株式会社村田製作所 | 振動子およびそれを用いた振動ジャイロおよびそれを用いた電子装置 |
US6940370B2 (en) * | 2002-05-06 | 2005-09-06 | The Regents Of The University Of California | MEMS resonator and method of making same |
US6904805B2 (en) * | 2003-06-03 | 2005-06-14 | Cherry Corporation | Accelerometer |
US6874363B1 (en) * | 2003-10-31 | 2005-04-05 | Honeywell International, Inc. | Trapped charge field bias vibrating beam accelerometer |
US6938334B2 (en) * | 2003-10-31 | 2005-09-06 | Honeywell International, Inc. | Vibrating beam accelerometer two-wafer fabrication process |
US6949807B2 (en) * | 2003-12-24 | 2005-09-27 | Honeywell International, Inc. | Signal routing in a hermetically sealed MEMS device |
US7073380B2 (en) * | 2004-02-17 | 2006-07-11 | Honeywell International, Inc. | Pyramid socket suspension |
US7267006B2 (en) * | 2004-02-27 | 2007-09-11 | Bae Systems Plc | Accelerometer |
DE602004007877T2 (de) * | 2004-03-02 | 2008-04-24 | Colibrys S.A. | Mikroelektromechanisches System |
US20050205951A1 (en) * | 2004-03-18 | 2005-09-22 | Honeywell Internatioanl, Inc. | Flip chip bonded micro-electromechanical system (MEMS) device |
EP1617178B1 (de) * | 2004-07-12 | 2017-04-12 | STMicroelectronics Srl | Mikroelektromechanische Struktur mit elektrisch isolierten Gebieten und Verfahren zu ihrer Herstellung |
JP4534741B2 (ja) * | 2004-12-10 | 2010-09-01 | 株式会社デンソー | ジャイロセンサ |
WO2006102437A2 (en) * | 2005-03-24 | 2006-09-28 | Yale University | Power harvesting scheme based piezoelectricity and nonlinear deflections |
FR2887989B1 (fr) * | 2005-07-04 | 2007-09-07 | Sagem Defense Securite | Capteur inertiel a courant perturbateur reduit par branches de compensation |
JP2007114078A (ja) * | 2005-10-21 | 2007-05-10 | Sony Corp | Memsセンサの駆動装置およびその駆動方法、並びにmemsを用いたアクティブセンサ |
KR100944426B1 (ko) * | 2005-11-22 | 2010-02-25 | 키오닉스, 인크. | 3축 가속도계 |
US7467553B2 (en) | 2005-12-22 | 2008-12-23 | Honeywell International Inc. | Capacitively coupled resonator drive |
US7640805B2 (en) * | 2006-12-18 | 2010-01-05 | Akustica, Inc. | Proof-mass with supporting structure on integrated circuit-MEMS platform |
US8191421B2 (en) | 2007-05-07 | 2012-06-05 | Raytheon Company | Digital ballistic impact detection system |
EP2156197B1 (de) | 2007-05-07 | 2010-09-22 | Raytheon Sarcos, LLC | Digitales system zur detektion von verwundungen |
JP2009049113A (ja) * | 2007-08-17 | 2009-03-05 | Oki Electric Ind Co Ltd | Soi基板、soi基板の製造方法及び、半導体加速度センサ |
US8117917B2 (en) * | 2008-03-27 | 2012-02-21 | Honeywell International Inc. | Vibrating beam accelerometer with improved performance in vibration environments |
US8096182B2 (en) * | 2008-05-29 | 2012-01-17 | Freescale Semiconductor, Inc. | Capacitive sensor with stress relief that compensates for package stress |
JP5024803B2 (ja) * | 2008-06-05 | 2012-09-12 | 国立大学法人静岡大学 | 検知センサ |
DE102008041178B4 (de) | 2008-08-12 | 2018-11-15 | Robert Bosch Gmbh | Herstellungsverfahren für ein mikromechanisches Bauteil |
US8307710B2 (en) * | 2009-07-09 | 2012-11-13 | Honeywell International Inc. | Translational mass in-plane MEMS accelerometer |
JP2011117944A (ja) * | 2009-10-29 | 2011-06-16 | Seiko Epson Corp | 加速度センサー |
GB201009062D0 (en) * | 2010-05-28 | 2010-07-14 | Cambridge Entpr Ltd | MEMS inertial sensor and method of inertial sensing |
US8319254B2 (en) | 2011-02-14 | 2012-11-27 | Kionix, Inc. | Micro-electromechanical system devices |
US8664731B2 (en) | 2011-02-14 | 2014-03-04 | Kionix, Inc. | Strengthened micro-electromechanical system devices and methods of making thereof |
US9121785B2 (en) | 2012-04-24 | 2015-09-01 | Sarcos Lc | Non-powered impact recorder |
US20130320466A1 (en) * | 2012-05-31 | 2013-12-05 | Analog Devices, Inc. | Package for Damping Inertial Sensor |
US9297824B2 (en) * | 2012-09-14 | 2016-03-29 | Intel Corporation | Techniques, systems and devices related to acceleration measurement |
US9096419B2 (en) * | 2012-10-01 | 2015-08-04 | Qualcomm Mems Technologies, Inc. | Electromechanical systems device with protrusions to provide additional stable states |
CN102897704B (zh) * | 2012-10-17 | 2015-03-04 | 东南大学 | 一种静电力调变齿间隙的微机电梳齿机构 |
RU2545324C1 (ru) * | 2013-10-07 | 2015-03-27 | Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" | Датчик резонаторный |
US9689888B2 (en) | 2014-11-14 | 2017-06-27 | Honeywell International Inc. | In-plane vibrating beam accelerometer |
US10823754B2 (en) | 2014-11-14 | 2020-11-03 | Honeywell International Inc. | Accelerometer with strain compensation |
WO2017040174A1 (en) | 2015-09-04 | 2017-03-09 | Ut-Battelle, Llc | Direct write sensors |
CN108431637B (zh) | 2015-10-30 | 2021-04-13 | 离子地球物理学公司 | 多轴单质量体加速度计 |
US11161733B2 (en) | 2017-05-08 | 2021-11-02 | Safran Colibrys Sa | Decoupling structure for accelerometer |
US11332362B2 (en) * | 2018-02-20 | 2022-05-17 | Bliley Technologies, Inc. | Vibration isolator platform with electronic acceleration compensation |
CN112955752A (zh) | 2018-09-13 | 2021-06-11 | 离子地球物理学公司 | 多轴线、单质量加速度计 |
US11079227B2 (en) | 2019-04-01 | 2021-08-03 | Honeywell International Inc. | Accelerometer system enclosing gas |
US11119116B2 (en) | 2019-04-01 | 2021-09-14 | Honeywell International Inc. | Accelerometer for determining an acceleration based on modulated optical signals |
US11119114B2 (en) * | 2019-07-17 | 2021-09-14 | Honeywell International Inc. | Anchor structure for securing optomechanical structure |
US11408911B2 (en) | 2019-07-17 | 2022-08-09 | Honeywell International Inc. | Optomechanical structure with corrugated edge |
US11287441B2 (en) * | 2019-11-07 | 2022-03-29 | Honeywell International Inc. | Resonator including one or more mechanical beams with added mass |
US11567100B2 (en) | 2019-11-07 | 2023-01-31 | Honeywell International Inc. | Vibrating beam accelerometer with additional support flexures to avoid nonlinear mechanical coupling |
US11692825B2 (en) | 2020-06-08 | 2023-07-04 | Analog Devices, Inc. | Drive and sense stress relief apparatus |
US11686581B2 (en) * | 2020-06-08 | 2023-06-27 | Analog Devices, Inc. | Stress-relief MEMS gyroscope |
US11698257B2 (en) | 2020-08-24 | 2023-07-11 | Analog Devices, Inc. | Isotropic attenuated motion gyroscope |
IT202100023795A1 (it) * | 2021-09-15 | 2023-03-15 | St Microelectronics Srl | Accelerometro risonante ad asse z con struttura di rilevamento avente prestazioni migliorate |
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JP3385688B2 (ja) * | 1993-12-13 | 2003-03-10 | 株式会社デンソー | 半導体ヨーレートセンサおよびその製造方法 |
DE4424635B4 (de) * | 1994-07-13 | 2004-11-04 | Robert Bosch Gmbh | Mikromechanischer Beschleunigungssensor |
US5948981A (en) * | 1996-05-21 | 1999-09-07 | Alliedsignal Inc. | Vibrating beam accelerometer |
US6041655A (en) * | 1997-04-22 | 2000-03-28 | Alliedsignal, Inc. | Active cover accelerometer |
-
1996
- 1996-10-22 US US08/735,299 patent/US5948981A/en not_active Expired - Lifetime
-
1997
- 1997-09-08 DE DE69711321T patent/DE69711321T2/de not_active Expired - Fee Related
- 1997-09-08 EP EP97115499A patent/EP0840128B1/de not_active Expired - Lifetime
-
1999
- 1999-03-30 US US09/281,755 patent/US6119520A/en not_active Expired - Lifetime
- 1999-09-20 US US09/398,719 patent/US6484578B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20010047688A1 (en) | 2001-12-06 |
EP0840128A1 (de) | 1998-05-06 |
EP0840128B1 (de) | 2002-03-27 |
US5948981A (en) | 1999-09-07 |
US6484578B2 (en) | 2002-11-26 |
US6119520A (en) | 2000-09-19 |
DE69711321T2 (de) | 2002-10-31 |
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