DE69710048D1 - Polymialcopolymer, Formteile aus Polymialcopolymer sowie ein Verfahren zu deren Herstellung - Google Patents
Polymialcopolymer, Formteile aus Polymialcopolymer sowie ein Verfahren zu deren HerstellungInfo
- Publication number
- DE69710048D1 DE69710048D1 DE69710048T DE69710048T DE69710048D1 DE 69710048 D1 DE69710048 D1 DE 69710048D1 DE 69710048 T DE69710048 T DE 69710048T DE 69710048 T DE69710048 T DE 69710048T DE 69710048 D1 DE69710048 D1 DE 69710048D1
- Authority
- DE
- Germany
- Prior art keywords
- polymial
- copolymer
- production
- molded parts
- parts made
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/859,899 US5859171A (en) | 1997-05-21 | 1997-05-21 | Polyimide copolymer, polyimide copolymer resin molded products and their preparation |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69710048D1 true DE69710048D1 (de) | 2002-03-14 |
DE69710048T2 DE69710048T2 (de) | 2002-08-01 |
Family
ID=25332001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69710048T Expired - Fee Related DE69710048T2 (de) | 1997-05-21 | 1997-06-03 | Polymialcopolymer, Formteile aus Polymialcopolymer sowie ein Verfahren zu deren Herstellung |
Country Status (3)
Country | Link |
---|---|
US (1) | US5859171A (de) |
EP (1) | EP0879839B1 (de) |
DE (1) | DE69710048T2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6277495B1 (en) | 1997-07-18 | 2001-08-21 | E. I. Du Pont De Nemours And Company | Polyimide film, a method for its manufacture and a polyimide film containing metal laminated plate |
WO2000069948A1 (en) * | 1999-05-18 | 2000-11-23 | The Government Of The United States As Represented By The Administrator Of The National Aeronautics And Space Administration | Composition of and method for making high performance resins for infusion and transfer molding processes |
US6359107B1 (en) | 2000-05-18 | 2002-03-19 | The United States Of America As Represented By The Administrator, National Aeronautics And Space Administration | Composition of and method for making high performance resins for infusion and transfer molding processes |
JP2001274145A (ja) * | 2000-03-24 | 2001-10-05 | Mitsubishi Electric Corp | 液体原料気化装置、半導体装置および半導体装置の製造方法 |
KR100494632B1 (ko) * | 2000-08-11 | 2005-06-13 | 미쯔이카가쿠 가부시기가이샤 | 신규한 폴리이미드 및 이것으로 이루어진 회로기판 |
US6548179B2 (en) * | 2000-08-24 | 2003-04-15 | Dupont-Toray Co., Ltd. | Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate |
EP1523512B1 (de) * | 2002-07-22 | 2019-12-25 | Aspen Aerogels Inc. | Polyimid-aerogele, kohlenstoff-aerogele, und metallkarbid-aerogele und verfarhen zur herstellung |
US20040132900A1 (en) * | 2003-01-08 | 2004-07-08 | International Business Machines Corporation | Polyimide compositions and use thereof in ceramic product defect repair |
GB0709033D0 (en) | 2007-05-11 | 2007-06-20 | 3M Innovative Properties Co | Melt-Processible fluoropolymers having long-chain branches, Methods of preparing them and uses thereof |
US20090171063A1 (en) * | 2007-12-21 | 2009-07-02 | Tadashi Ishibashi | Polyimide film and methods relating thereto |
KR101444694B1 (ko) * | 2009-05-25 | 2014-10-01 | 에스케이이노베이션 주식회사 | 연성금속박적층체 및 이의 제조방법 |
US11203192B2 (en) | 2009-08-03 | 2021-12-21 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
US9631054B2 (en) | 2010-07-23 | 2017-04-25 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
US8574720B2 (en) * | 2009-08-03 | 2013-11-05 | E.I. Du Pont De Nemours & Company | Matte finish polyimide films and methods relating thereto |
US9926415B2 (en) | 2010-08-05 | 2018-03-27 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
US8541107B2 (en) * | 2009-08-13 | 2013-09-24 | E. I. Du Pont De Nemours And Company | Pigmented polyimide films and methods relating thereto |
EP2596052A1 (de) * | 2010-07-23 | 2013-05-29 | E.I. Du Pont De Nemours And Company | Polyimidfolien mit matter oberfläche und verfahren im zusammenhang damit |
US8772997B2 (en) | 2010-09-13 | 2014-07-08 | Baker Hughes Incorporated | Electrical submersible pump system having high temperature slot, end bell and phase-to-phase insulation |
JP5362752B2 (ja) * | 2011-01-26 | 2013-12-11 | Jfeケミカル株式会社 | ポリアミド酸組成物、ポリイミドおよびポリイミドフィルムならびにそれらの製造方法 |
EP3006209B1 (de) * | 2013-05-31 | 2022-12-21 | Kaneka Corporation | Isoliertes beschichtungsmaterial und verwendung davon |
US9641163B2 (en) * | 2014-05-28 | 2017-05-02 | Cree, Inc. | Bandwidth limiting methods for GaN power transistors |
CN110066620B (zh) | 2014-11-27 | 2021-06-15 | 株式会社钟化 | 耐磨耗性优越的绝缘包覆材料 |
CN107004473B (zh) | 2014-11-27 | 2019-09-13 | 株式会社钟化 | 耐磨损性优越的绝缘包覆材 |
CN106810692B (zh) * | 2015-12-02 | 2020-02-11 | 株洲时代新材料科技股份有限公司 | 聚酰胺酸溶液的制备方法和聚酰亚胺薄膜 |
CN106905527A (zh) * | 2017-03-01 | 2017-06-30 | 江阴骏友电子股份有限公司 | 低cte、高粘结性的新型双向拉伸聚酰亚胺薄膜的生产工艺 |
US11648521B2 (en) | 2019-02-27 | 2023-05-16 | Aspen Aerogels, Inc. | Carbon aerogel-based electrode materials and methods of manufacture thereof |
KR20210139359A (ko) | 2019-03-22 | 2021-11-22 | 아스펜 에어로겔, 인코포레이티드 | 리튬-황 전지를 위한 탄소 에어로겔-기반 캐소드 |
SG11202110262RA (en) | 2019-03-22 | 2021-10-28 | Aspen Aerogels Inc | Carbon aerogel-based cathodes for lithium-air batteries |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4535105A (en) * | 1983-03-08 | 1985-08-13 | Ube Industries, Ltd. | Wholly aromatic polyamic acid solution composition |
JPS59164328A (ja) * | 1983-03-08 | 1984-09-17 | Ube Ind Ltd | 芳香族ポリアミツク酸溶液組成物 |
JPS61111359A (ja) * | 1984-11-06 | 1986-05-29 | Ube Ind Ltd | ポリイミド膜 |
EP0276405B1 (de) * | 1986-11-29 | 1994-03-09 | Kanegafuchi Chemical Industry Co., Ltd. | Polyimid mit Formstabilität beim Erhitzen |
JP2744786B2 (ja) * | 1987-01-20 | 1998-04-28 | 鐘淵化学工業株式会社 | 熱的寸法安定性にすぐれたポリイミド及びそれに用いるポリアミド酸 |
US4779872A (en) * | 1987-02-17 | 1988-10-25 | Bisbee David A | Golf swing alignment device |
JPS6416834A (en) * | 1987-07-10 | 1989-01-20 | Kanegafuchi Chemical Ind | Polyamic acid copolymer, polyimide copolymer therefrom and production thereof |
JPS6416833A (en) * | 1987-07-10 | 1989-01-20 | Kanegafuchi Chemical Ind | Polyamic acid copolymer, polyimide copolymer therefrom and production thereof |
JPS6416832A (en) * | 1987-07-10 | 1989-01-20 | Kanegafuchi Chemical Ind | Production of polyamic acid copolymer |
JPH02175772A (ja) * | 1988-12-28 | 1990-07-09 | Sumitomo Bakelite Co Ltd | フレキシブルプリント回路用基板の製造方法 |
JP3001061B2 (ja) * | 1990-04-20 | 2000-01-17 | 住友ベークライト株式会社 | 低線膨張率耐熱性フィルムおよびその製造方法 |
US5166308A (en) * | 1990-04-30 | 1992-11-24 | E. I. Du Pont De Nemours And Company | Copolyimide film with improved properties |
US5196500A (en) * | 1990-12-17 | 1993-03-23 | E. I. Du Pont De Nemours And Company | Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride |
JPH06210629A (ja) * | 1991-01-31 | 1994-08-02 | Mitsui Toatsu Chem Inc | ポリイミド樹脂ペレットの製造押出方法 |
JP3048690B2 (ja) * | 1991-07-18 | 2000-06-05 | 鐘淵化学工業株式会社 | ポリイミドフィルムの製造方法 |
JPH0741558A (ja) * | 1993-07-31 | 1995-02-10 | Kanegafuchi Chem Ind Co Ltd | ポリイミド樹脂及びポリイミドフィルム |
-
1997
- 1997-05-21 US US08/859,899 patent/US5859171A/en not_active Expired - Lifetime
- 1997-06-03 DE DE69710048T patent/DE69710048T2/de not_active Expired - Fee Related
- 1997-06-03 EP EP97108876A patent/EP0879839B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0879839B1 (de) | 2002-01-23 |
US5859171A (en) | 1999-01-12 |
EP0879839A1 (de) | 1998-11-25 |
DE69710048T2 (de) | 2002-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |