DE69706002T2 - Wärmetauscher - Google Patents

Wärmetauscher

Info

Publication number
DE69706002T2
DE69706002T2 DE69706002T DE69706002T DE69706002T2 DE 69706002 T2 DE69706002 T2 DE 69706002T2 DE 69706002 T DE69706002 T DE 69706002T DE 69706002 T DE69706002 T DE 69706002T DE 69706002 T2 DE69706002 T2 DE 69706002T2
Authority
DE
Germany
Prior art keywords
heat exchangers
exchangers
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69706002T
Other languages
English (en)
Other versions
DE69706002D1 (de
Inventor
Gary R Kenny
Dean Leonard Smith
Roger Stanley Kerr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Application granted granted Critical
Publication of DE69706002D1 publication Critical patent/DE69706002D1/de
Publication of DE69706002T2 publication Critical patent/DE69706002T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69706002T 1996-06-28 1997-06-16 Wärmetauscher Expired - Fee Related DE69706002T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/674,221 US5832986A (en) 1996-06-28 1996-06-28 Heat exchanger

Publications (2)

Publication Number Publication Date
DE69706002D1 DE69706002D1 (de) 2001-09-13
DE69706002T2 true DE69706002T2 (de) 2002-04-18

Family

ID=24705797

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69706002T Expired - Fee Related DE69706002T2 (de) 1996-06-28 1997-06-16 Wärmetauscher

Country Status (4)

Country Link
US (1) US5832986A (de)
EP (1) EP0817553B1 (de)
JP (1) JPH1062094A (de)
DE (1) DE69706002T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005004777A1 (de) * 2005-02-01 2006-08-10 Behr Industry Gmbh & Co. Kg Kühler

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5936646A (en) * 1996-06-28 1999-08-10 Eastman Kodak Company Image processing equipment with thermally efficient heat dissipating element
JP3942248B2 (ja) * 1997-02-24 2007-07-11 富士通株式会社 ヒートシンクおよびそれを搭載した情報処理装置
US5995367A (en) * 1997-12-18 1999-11-30 Eastman Kodak Company Heat exchanger having an extruded, tiered heat sink
US6244331B1 (en) 1999-10-22 2001-06-12 Intel Corporation Heatsink with integrated blower for improved heat transfer
US6349760B1 (en) 1999-10-22 2002-02-26 Intel Corporation Method and apparatus for improving the thermal performance of heat sinks
US6293760B1 (en) * 2000-03-14 2001-09-25 Motorola, Inc. Pump and motor unit and method for pumping fluids
US7431568B2 (en) * 2004-05-17 2008-10-07 Brown Fred A Draft inducer having a backward curved impeller
CA2541945A1 (en) * 2003-09-03 2005-03-17 Comair Rotron, Inc. Apparatus and method for maintaining an operating condition for a blower
CA2537192A1 (en) * 2003-09-03 2005-03-17 Comair Rotron, Inc. Draft inducer performance control
US20050189088A1 (en) * 2004-02-26 2005-09-01 Wang Chin W. Circulation structure of heat dissipation device
US7472742B2 (en) * 2005-12-01 2009-01-06 General Electric Company Heat sink assembly
TWI440424B (zh) * 2008-10-17 2014-06-01 Sunonwealth Electr Mach Ind Co 超薄散熱風扇
US11950354B2 (en) * 2022-03-04 2024-04-02 Apple Inc. Internal architecture of a computing device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3592260A (en) * 1969-12-05 1971-07-13 Espey Mfg & Electronics Corp Heat exchanger with inner guide strip
US3970411A (en) * 1973-04-02 1976-07-20 Knut Olof Lennart Wallman Impellers for cross-flow fans
CH612736A5 (de) * 1976-04-27 1979-08-15 Papst Motoren Kg
JPS5331206A (en) * 1976-09-06 1978-03-24 Hitachi Ltd Fan with forward blades
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
AT384343B (de) * 1985-04-16 1987-10-27 Siemens Ag Oesterreich Gehaeuseanordnung fuer belueftete geraete, vorzugsweise der leistungselektronik
US4666373A (en) * 1986-03-20 1987-05-19 Eiichi Sugiura Impeller for rotary fluid machine
US4768581A (en) * 1987-04-06 1988-09-06 International Business Machines Corporation Cooling system for semiconductor modules
US4879891A (en) * 1987-04-27 1989-11-14 Thermalloy Incorporated Method of manufacturing heat sink apparatus
GB2204181B (en) * 1987-04-27 1990-03-21 Thermalloy Inc Heat sink apparatus and method of manufacture
US5146144A (en) 1990-06-08 1992-09-08 Eastman Kodak Company Electric motor
DE9404388U1 (de) * 1994-03-16 1994-05-19 Chiou Ming Der Kühleinrichtung für eine CPU
US5494098A (en) * 1994-06-17 1996-02-27 Wakefield Engineering, Inc. Fan driven heat sink
JPH0898461A (ja) * 1994-09-19 1996-04-12 Tokyo Parts Ind Co Ltd ヒートシンク付きファンモータ
US5526875A (en) * 1994-10-14 1996-06-18 Lin; Shih-Jen Cooling device for CPU
US5535094A (en) * 1995-04-26 1996-07-09 Intel Corporation Integrated circuit package with an integral heat sink and fan

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005004777A1 (de) * 2005-02-01 2006-08-10 Behr Industry Gmbh & Co. Kg Kühler

Also Published As

Publication number Publication date
EP0817553B1 (de) 2001-08-08
US5832986A (en) 1998-11-10
DE69706002D1 (de) 2001-09-13
JPH1062094A (ja) 1998-03-06
EP0817553A1 (de) 1998-01-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: BLICKLE, K., DIPL.-ING., PAT.-ASS., 70327 STUTTGAR

8328 Change in the person/name/address of the agent

Representative=s name: DR. KUEHNER, H., RECHTSANW., 70327 STUTTGART

8339 Ceased/non-payment of the annual fee