DE69701903D1 - Optischer Druckkopf - Google Patents

Optischer Druckkopf

Info

Publication number
DE69701903D1
DE69701903D1 DE69701903T DE69701903T DE69701903D1 DE 69701903 D1 DE69701903 D1 DE 69701903D1 DE 69701903 T DE69701903 T DE 69701903T DE 69701903 T DE69701903 T DE 69701903T DE 69701903 D1 DE69701903 D1 DE 69701903D1
Authority
DE
Germany
Prior art keywords
print head
optical print
optical
head
print
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69701903T
Other languages
English (en)
Other versions
DE69701903T2 (de
Inventor
Hisashi Tsukagoshi
Minoru Teshima
Norio Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Data Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Data Corp filed Critical Oki Data Corp
Application granted granted Critical
Publication of DE69701903D1 publication Critical patent/DE69701903D1/de
Publication of DE69701903T2 publication Critical patent/DE69701903T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
DE69701903T 1996-02-13 1997-02-06 Optischer Druckkopf Expired - Lifetime DE69701903T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2537696 1996-02-13
JP25650196A JPH09277595A (ja) 1996-02-13 1996-09-27 光プリントヘッド

Publications (2)

Publication Number Publication Date
DE69701903D1 true DE69701903D1 (de) 2000-06-15
DE69701903T2 DE69701903T2 (de) 2001-02-08

Family

ID=26362972

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69701903T Expired - Lifetime DE69701903T2 (de) 1996-02-13 1997-02-06 Optischer Druckkopf

Country Status (3)

Country Link
EP (1) EP0790132B1 (de)
JP (1) JPH09277595A (de)
DE (1) DE69701903T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001162862A (ja) * 1999-12-13 2001-06-19 Kyocera Corp 光プリンタヘッド
KR20010100868A (ko) 2000-04-06 2001-11-14 이주하라 요죠우 광기록 헤드와 그 조립 방법
DE202005021522U1 (de) * 2004-09-30 2008-07-31 Heidelberger Druckmaschinen Ag Vorrichtung zur Bilderzeugung auf einem Aufzeichnungsmaterial
DE102006033502A1 (de) * 2006-05-03 2007-11-15 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterkörper mit Trägersubstrat und Verfahren zur Herstellung eines solchen
JP5363942B2 (ja) * 2009-10-23 2013-12-11 株式会社沖データ 露光装置及び画像形成装置
JP5874259B2 (ja) * 2011-09-14 2016-03-02 株式会社リコー 光プリントヘッド及び画像形成装置
JP6621591B2 (ja) * 2015-03-31 2019-12-18 株式会社沖データ ロッドレンズアレイユニット、ロッドレンズアレイユニットの製造方法、ledプリントヘッド、イメージセンサヘッド、画像形成装置、及び画像読取装置
JP2018016009A (ja) * 2016-07-29 2018-02-01 株式会社沖データ 露光装置および受光装置
US11710942B2 (en) * 2017-12-13 2023-07-25 Sony Corporation Method of manufacturing light-emitting module, light-emitting module, and device
JP2020163601A (ja) * 2019-03-28 2020-10-08 京セラ株式会社 光プリントヘッドおよびこれを備える画像形成装置
CN112083632A (zh) * 2020-09-22 2020-12-15 深圳市先地图像科技有限公司 一种基于led阵列的数字投影无掩模曝光装置及方法
CN117002160A (zh) * 2022-04-29 2023-11-07 华为技术有限公司 Led发光模块、led打印头和led打印机

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61189965A (ja) * 1985-02-19 1986-08-23 Oki Electric Ind Co Ltd 光プリントヘツド
US4951064A (en) * 1989-05-15 1990-08-21 Westinghouse Electric Corp. Thin film electroluminescent edge emitter assembly and integral packaging
KR940009023B1 (ko) * 1991-02-21 1994-09-29 삼성전자 주식회사 발광다이오드 프린트 헤드
JPH04293274A (ja) * 1991-03-22 1992-10-16 Eastman Kodak Japan Kk 発光装置
JP3232152B2 (ja) * 1992-05-14 2001-11-26 株式会社リコー 発光ダイオードアレイ
US5745153A (en) * 1992-12-07 1998-04-28 Eastman Kodak Company Optical means for using diode laser arrays in laser multibeam printers and recorders

Also Published As

Publication number Publication date
DE69701903T2 (de) 2001-02-08
EP0790132A2 (de) 1997-08-20
EP0790132A3 (de) 1998-05-27
EP0790132B1 (de) 2000-05-10
JPH09277595A (ja) 1997-10-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition