DE69700230D1 - Laserlichtquelle - Google Patents
LaserlichtquelleInfo
- Publication number
- DE69700230D1 DE69700230D1 DE69700230T DE69700230T DE69700230D1 DE 69700230 D1 DE69700230 D1 DE 69700230D1 DE 69700230 T DE69700230 T DE 69700230T DE 69700230 T DE69700230 T DE 69700230T DE 69700230 D1 DE69700230 D1 DE 69700230D1
- Authority
- DE
- Germany
- Prior art keywords
- light source
- laser light
- laser
- source
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
- H01S5/0264—Photo-diodes, e.g. transceiver devices, bidirectional devices for monitoring the laser-output
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/591,846 US5835514A (en) | 1996-01-25 | 1996-01-25 | Laser-based controlled-intensity light source using reflection from a convex surface and method of making same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69700230D1 true DE69700230D1 (de) | 1999-07-01 |
DE69700230T2 DE69700230T2 (de) | 1999-09-30 |
Family
ID=24368194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69700230T Expired - Lifetime DE69700230T2 (de) | 1996-01-25 | 1997-01-24 | Laserlichtquelle |
Country Status (3)
Country | Link |
---|---|
US (1) | US5835514A (de) |
EP (1) | EP0786836B1 (de) |
DE (1) | DE69700230T2 (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6123465A (en) * | 1996-03-21 | 2000-09-26 | Nippon Sheet Glass Company Ltd | Optical module |
AU747260B2 (en) | 1997-07-25 | 2002-05-09 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
US5940564A (en) * | 1997-08-05 | 1999-08-17 | Picolight, Inc. | Device for coupling a light source or receiver to an optical waveguide |
US6069905A (en) * | 1997-12-31 | 2000-05-30 | Honeywell Inc. | Vertical cavity surface emitting laser having intensity control |
JP3792040B2 (ja) * | 1998-03-06 | 2006-06-28 | 松下電器産業株式会社 | 双方向光半導体装置 |
JP3770014B2 (ja) | 1999-02-09 | 2006-04-26 | 日亜化学工業株式会社 | 窒化物半導体素子 |
EP1168539B1 (de) | 1999-03-04 | 2009-12-16 | Nichia Corporation | Nitridhalbleiterlaserelement |
EP1047051A3 (de) * | 1999-04-19 | 2001-01-24 | Samsung Electronics Co., Ltd. | Lichtemittierendes Modul und kompatibles optisches Abtastgerät dafür |
US6368890B1 (en) * | 1999-05-05 | 2002-04-09 | Mitel Semiconductor Ab | Top contact VCSEL with monitor |
US7004644B1 (en) | 1999-06-29 | 2006-02-28 | Finisar Corporation | Hermetic chip-scale package for photonic devices |
DE19935496C1 (de) * | 1999-07-28 | 2001-01-18 | Siemens Ag | Optoelektronisches Bauelement und Verfahren zur Herstellung |
US6522673B1 (en) * | 1999-12-22 | 2003-02-18 | New Focus, Inc. | Method and apparatus for optical transmission |
JP2002084027A (ja) * | 2000-09-07 | 2002-03-22 | Sony Corp | 半導体発光装置 |
JP3979562B2 (ja) * | 2000-09-22 | 2007-09-19 | パイオニア株式会社 | 光ピックアップ装置 |
JP2002100068A (ja) * | 2000-09-26 | 2002-04-05 | Pioneer Electronic Corp | 光ピックアップ装置 |
US6888169B2 (en) * | 2000-09-29 | 2005-05-03 | Optical Communication Products, Inc. | High speed optical subassembly with ceramic carrier |
US6526076B2 (en) * | 2000-12-15 | 2003-02-25 | Agilent Technologies, Inc. | Integrated parallel channel optical monitoring for parallel optics transmitter |
TW500268U (en) * | 2001-06-29 | 2002-08-21 | Hon Hai Prec Ind Co Ltd | Package for light source |
TW499747B (en) * | 2001-08-17 | 2002-08-21 | Truelight Corp | Common packaging structure for laser diode and PIN detector |
US6925099B2 (en) * | 2001-11-01 | 2005-08-02 | Stratos International, Inc. | Control of VCSEL emission for better high-speed performance |
US7343535B2 (en) | 2002-02-06 | 2008-03-11 | Avago Technologies General Ip Dte Ltd | Embedded testing capability for integrated serializer/deserializers |
KR20040085179A (ko) * | 2002-02-13 | 2004-10-07 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 통합된 반도체 광학 디바이스, 이러한 디바이스를제조하는 방법 및 장치 |
TW531049U (en) * | 2002-04-18 | 2003-05-01 | Hon Hai Prec Ind Co Ltd | Optical sealing cap |
US6642068B1 (en) | 2002-05-03 | 2003-11-04 | Donald J. Hayes | Method for producing a fiber optic switch |
GB0210411D0 (en) * | 2002-05-08 | 2002-06-12 | Zarlink Semiconductor Ab | Photonic device with monitor |
JP4645008B2 (ja) * | 2002-06-10 | 2011-03-09 | 日亜化学工業株式会社 | 半導体レーザ装置 |
US7418016B2 (en) * | 2003-02-13 | 2008-08-26 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Method and apparatus for modifying the spread of a laser beam |
JP2004271921A (ja) * | 2003-03-10 | 2004-09-30 | Matsushita Electric Ind Co Ltd | 双方向光モジュール及び光伝送装置 |
US7061025B2 (en) | 2003-03-10 | 2006-06-13 | Mccolloch Lawrence R | Optoelectronic device packaging assemblies and methods of making the same |
US6953990B2 (en) | 2003-09-19 | 2005-10-11 | Agilent Technologies, Inc. | Wafer-level packaging of optoelectronic devices |
US6982437B2 (en) * | 2003-09-19 | 2006-01-03 | Agilent Technologies, Inc. | Surface emitting laser package having integrated optical element and alignment post |
US7520679B2 (en) | 2003-09-19 | 2009-04-21 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Optical device package with turning mirror and alignment post |
US20050063431A1 (en) | 2003-09-19 | 2005-03-24 | Gallup Kendra J. | Integrated optics and electronics |
US6998691B2 (en) * | 2003-09-19 | 2006-02-14 | Agilent Technologies, Inc. | Optoelectronic device packaging with hermetically sealed cavity and integrated optical element |
US7403640B2 (en) * | 2003-10-27 | 2008-07-22 | Hewlett-Packard Development Company, L.P. | System and method for employing an object-oriented motion detector to capture images |
TWM253992U (en) * | 2003-11-14 | 2004-12-21 | Arima Optoelectronics Corp | Laser diode unit |
US20070002913A1 (en) * | 2005-07-01 | 2007-01-04 | Unity Opto Technology Co., Ltd. | Structure of laser |
US7767947B2 (en) * | 2005-09-20 | 2010-08-03 | Downing Jr John P | Semiconductor light source with optical feedback |
JP2008010710A (ja) * | 2006-06-30 | 2008-01-17 | Oki Electric Ind Co Ltd | 半導体レーザ装置 |
JP2008193002A (ja) * | 2007-02-07 | 2008-08-21 | Mitsubishi Electric Corp | 光送受信モジュール |
TWI362769B (en) | 2008-05-09 | 2012-04-21 | Univ Nat Chiao Tung | Light emitting device and fabrication method therefor |
US8177394B2 (en) * | 2008-11-07 | 2012-05-15 | Endure Medical, Inc. | Stereoscopic illumination system for microscope |
US20110317965A1 (en) * | 2009-05-12 | 2011-12-29 | Sumitomo Electric Industries, Ltd. | Optical subassembly with optical device having ceramic package |
US8502452B2 (en) | 2010-07-28 | 2013-08-06 | Usl Technologies, Llc | High-stability light source system and method of manufacturing |
TW201508361A (zh) * | 2013-08-27 | 2015-03-01 | 鴻海精密工業股份有限公司 | 透鏡單元以及光通訊模組 |
US20160124240A1 (en) * | 2014-10-31 | 2016-05-05 | Everready Precision Ind. Corp. | Surface mount device type laser module |
CN111133641A (zh) * | 2017-02-24 | 2020-05-08 | 普林斯顿光电子公司 | 人眼安全vcsel照明器封装件 |
WO2019108766A1 (en) | 2017-11-29 | 2019-06-06 | Vixar Inc. | Power monitoring approach for vcsels and vcsel arrays |
US20190296522A1 (en) * | 2018-03-20 | 2019-09-26 | Vixar, Inc. | Eye safe optical modules |
WO2020107164A1 (zh) * | 2018-11-26 | 2020-06-04 | 深圳市大疆创新科技有限公司 | 激光二极管封装模块及距离探测装置、电子设备 |
JP2021190463A (ja) * | 2020-05-26 | 2021-12-13 | 日亜化学工業株式会社 | 発光装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60158682A (ja) * | 1984-01-27 | 1985-08-20 | Toshiba Corp | 半導体レ−ザ装置 |
JPH07105560B2 (ja) * | 1988-04-11 | 1995-11-13 | 日本電気株式会社 | 発光素子モジュール |
JPH01286379A (ja) * | 1988-05-12 | 1989-11-17 | Mitsubishi Electric Corp | 半導体レーザ装置 |
JPH02165684A (ja) * | 1988-12-20 | 1990-06-26 | Toshiba Corp | 半導体レーザ装置 |
US5542018A (en) * | 1990-08-31 | 1996-07-30 | Kuhara; Yoshiki | Semiconductor laser device making use of photodiode chip |
JPH04199890A (ja) * | 1990-11-29 | 1992-07-21 | Mitsubishi Electric Corp | 半導体レーザ装置 |
US5247167A (en) * | 1992-08-06 | 1993-09-21 | International Business Machines Corporation | Multiple beam power monitoring system and method with radiation detection and focusing means of overlapping beams |
JPH06209138A (ja) * | 1993-01-08 | 1994-07-26 | Seiko Epson Corp | 光素子およびその製造方法およびその実装方法 |
US5555334A (en) * | 1993-10-07 | 1996-09-10 | Hitachi, Ltd. | Optical transmission and receiving module and optical communication system using the same |
-
1996
- 1996-01-25 US US08/591,846 patent/US5835514A/en not_active Expired - Lifetime
-
1997
- 1997-01-24 EP EP97300439A patent/EP0786836B1/de not_active Expired - Lifetime
- 1997-01-24 DE DE69700230T patent/DE69700230T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0786836A3 (de) | 1997-10-29 |
EP0786836A2 (de) | 1997-07-30 |
DE69700230T2 (de) | 1999-09-30 |
US5835514A (en) | 1998-11-10 |
EP0786836B1 (de) | 1999-05-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE), |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: AVAGO TECHNOLOGIES GENERAL IP ( SINGAPORE) PTE. LT |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELLSCHA |