DE69633001D1 - Aufhängungssystem für elektrische schaltung - Google Patents

Aufhängungssystem für elektrische schaltung

Info

Publication number
DE69633001D1
DE69633001D1 DE69633001T DE69633001T DE69633001D1 DE 69633001 D1 DE69633001 D1 DE 69633001D1 DE 69633001 T DE69633001 T DE 69633001T DE 69633001 T DE69633001 T DE 69633001T DE 69633001 D1 DE69633001 D1 DE 69633001D1
Authority
DE
Germany
Prior art keywords
electrical
suspension system
electrical switching
avionics
distension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69633001T
Other languages
English (en)
Other versions
DE69633001T2 (de
Inventor
J Miller
G Foreman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quell Corp
Original Assignee
Quell Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quell Corp filed Critical Quell Corp
Application granted granted Critical
Publication of DE69633001D1 publication Critical patent/DE69633001D1/de
Publication of DE69633001T2 publication Critical patent/DE69633001T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
DE69633001T 1995-01-06 1996-01-04 Aufhängungssystem für elektrische schaltung Expired - Lifetime DE69633001T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US369377 1995-01-06
US08/369,377 US5686697A (en) 1995-01-06 1995-01-06 Electrical circuit suspension system
PCT/US1996/000159 WO1996021245A1 (en) 1995-01-06 1996-01-04 Electrical circuit suspension system

Publications (2)

Publication Number Publication Date
DE69633001D1 true DE69633001D1 (de) 2004-09-02
DE69633001T2 DE69633001T2 (de) 2005-08-04

Family

ID=23455218

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69633001T Expired - Lifetime DE69633001T2 (de) 1995-01-06 1996-01-04 Aufhängungssystem für elektrische schaltung

Country Status (8)

Country Link
US (2) US5686697A (de)
EP (1) EP0801815B1 (de)
AT (1) ATE272250T1 (de)
AU (1) AU4654196A (de)
CA (1) CA2209660C (de)
DE (1) DE69633001T2 (de)
ES (1) ES2225867T3 (de)
WO (1) WO1996021245A1 (de)

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US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
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EP2650907A3 (de) 2004-06-04 2014-10-08 The Board of Trustees of the University of Illinois Verfahren und Einrichtungen zum Herstellen und Zusammenbauen von druckbaren Halbleiterelementen
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US8643772B2 (en) 2010-11-05 2014-02-04 Emprimus, Llc Electromagnetically shielded video camera and shielded enclosure for image capture devices
US8754980B2 (en) 2010-11-05 2014-06-17 Emprimus, Llc Electromagnetically shielded camera and shielded enclosure for image capture devices
US9420219B2 (en) 2010-12-20 2016-08-16 Emprimus, Llc Integrated security video and electromagnetic pulse detector
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US9765934B2 (en) 2011-05-16 2017-09-19 The Board Of Trustees Of The University Of Illinois Thermally managed LED arrays assembled by printing
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TWI439700B (zh) * 2012-01-19 2014-06-01 Ind Tech Res Inst 用於具有雙導線之電力電纜線的電力感測裝置
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US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
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Also Published As

Publication number Publication date
CA2209660C (en) 2001-12-18
US5686697A (en) 1997-11-11
EP0801815A1 (de) 1997-10-22
WO1996021245A1 (en) 1996-07-11
AU4654196A (en) 1996-07-24
CA2209660A1 (en) 1996-07-11
US6613979B1 (en) 2003-09-02
EP0801815B1 (de) 2004-07-28
ATE272250T1 (de) 2004-08-15
DE69633001T2 (de) 2005-08-04
EP0801815A4 (de) 1998-08-19
ES2225867T3 (es) 2005-03-16

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