DE69632596D1 - Schonendes laser-flächenbearbeitungsverfahren - Google Patents

Schonendes laser-flächenbearbeitungsverfahren

Info

Publication number
DE69632596D1
DE69632596D1 DE69632596T DE69632596T DE69632596D1 DE 69632596 D1 DE69632596 D1 DE 69632596D1 DE 69632596 T DE69632596 T DE 69632596T DE 69632596 T DE69632596 T DE 69632596T DE 69632596 D1 DE69632596 D1 DE 69632596D1
Authority
DE
Germany
Prior art keywords
processing process
surface processing
laser surface
gentle
gentle laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69632596T
Other languages
English (en)
Other versions
DE69632596T2 (de
Inventor
Buyaner Boris Livshits
Menachem Genut
Ofer Tehar-Zahav
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oramir Semiconductor Equipment Ltd
Original Assignee
Oramir Semiconductor Equipment Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oramir Semiconductor Equipment Ltd filed Critical Oramir Semiconductor Equipment Ltd
Publication of DE69632596D1 publication Critical patent/DE69632596D1/de
Application granted granted Critical
Publication of DE69632596T2 publication Critical patent/DE69632596T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Laser Beam Processing (AREA)
DE69632596T 1995-11-09 1996-11-04 Schonendes laser-flächenbearbeitungsverfahren Expired - Fee Related DE69632596T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IL11593295A IL115932A0 (en) 1995-11-09 1995-11-09 Damage-free laser surface treatment method
IL11593295 1995-11-09
PCT/IL1996/000139 WO1997017164A1 (en) 1995-11-09 1996-11-04 Damage-free laser surface treatment method

Publications (2)

Publication Number Publication Date
DE69632596D1 true DE69632596D1 (de) 2004-07-01
DE69632596T2 DE69632596T2 (de) 2005-06-23

Family

ID=11068162

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69632596T Expired - Fee Related DE69632596T2 (de) 1995-11-09 1996-11-04 Schonendes laser-flächenbearbeitungsverfahren

Country Status (7)

Country Link
EP (1) EP0879113B1 (de)
JP (1) JP2000500283A (de)
KR (1) KR100483820B1 (de)
AU (1) AU7331096A (de)
DE (1) DE69632596T2 (de)
IL (1) IL115932A0 (de)
WO (1) WO1997017164A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL119246A (en) 1996-09-12 2000-10-31 Oramir Semiconductor Ltd Laser removal of foreign materials from surfaces
US8066819B2 (en) 1996-12-19 2011-11-29 Best Label Co., Inc. Method of removing organic materials from substrates
IL123416A0 (en) 1998-02-23 1998-09-24 Oramir Semiconductor Ltd Multi laser surface treatment in ambient fast flowing photoreactive gases
GB2347788A (en) * 1999-03-06 2000-09-13 Secr Defence Forming devices such as ferroelectric infra-red sensors by annealing
DE102008041059A1 (de) * 2008-08-06 2010-02-04 Q-Cells Ag Verfahren zur Herstellung einer strukturiert prozessierten oder strukturiert beschichteten Substratoberfläche
US20230377884A1 (en) * 2022-05-19 2023-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated photoresist removal and laser annealing

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL84255A (en) * 1987-10-23 1993-02-21 Galram Technology Ind Ltd Process for removal of post- baked photoresist layer
US5312396A (en) * 1990-09-06 1994-05-17 Massachusetts Institute Of Technology Pulsed laser system for the surgical removal of tissue

Also Published As

Publication number Publication date
EP0879113A1 (de) 1998-11-25
KR100483820B1 (ko) 2005-08-17
AU7331096A (en) 1997-05-29
JP2000500283A (ja) 2000-01-11
IL115932A0 (en) 1996-01-31
DE69632596T2 (de) 2005-06-23
WO1997017164A1 (en) 1997-05-15
KR19990067433A (ko) 1999-08-16
EP0879113B1 (de) 2004-05-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee