IL115932A0 - Damage-free laser surface treatment method - Google Patents

Damage-free laser surface treatment method

Info

Publication number
IL115932A0
IL115932A0 IL11593295A IL11593295A IL115932A0 IL 115932 A0 IL115932 A0 IL 115932A0 IL 11593295 A IL11593295 A IL 11593295A IL 11593295 A IL11593295 A IL 11593295A IL 115932 A0 IL115932 A0 IL 115932A0
Authority
IL
Israel
Prior art keywords
damage
surface treatment
treatment method
laser surface
free laser
Prior art date
Application number
IL11593295A
Other languages
English (en)
Original Assignee
Oramir Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oramir Semiconductor Ltd filed Critical Oramir Semiconductor Ltd
Priority to IL11593295A priority Critical patent/IL115932A0/xx
Publication of IL115932A0 publication Critical patent/IL115932A0/xx
Priority to IL12413596A priority patent/IL124135A/en
Priority to KR10-1998-0703444A priority patent/KR100483820B1/ko
Priority to EP96935312A priority patent/EP0879113B1/de
Priority to DE69632596T priority patent/DE69632596T2/de
Priority to PCT/IL1996/000139 priority patent/WO1997017164A1/en
Priority to AU73310/96A priority patent/AU7331096A/en
Priority to JP9518031A priority patent/JP2000500283A/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
IL11593295A 1995-11-09 1995-11-09 Damage-free laser surface treatment method IL115932A0 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IL11593295A IL115932A0 (en) 1995-11-09 1995-11-09 Damage-free laser surface treatment method
IL12413596A IL124135A (en) 1995-11-09 1996-11-04 Damage-free laser surface treatment method
KR10-1998-0703444A KR100483820B1 (ko) 1995-11-09 1996-11-04 표면손상을방지하기위한표면처리방법및장치
EP96935312A EP0879113B1 (de) 1995-11-09 1996-11-04 Schonendes laser-flächenbearbeitungsverfahren
DE69632596T DE69632596T2 (de) 1995-11-09 1996-11-04 Schonendes laser-flächenbearbeitungsverfahren
PCT/IL1996/000139 WO1997017164A1 (en) 1995-11-09 1996-11-04 Damage-free laser surface treatment method
AU73310/96A AU7331096A (en) 1995-11-09 1996-11-04 Damage-free laser surface treatment method
JP9518031A JP2000500283A (ja) 1995-11-09 1996-11-04 損傷を与えないレーザー表面処理法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL11593295A IL115932A0 (en) 1995-11-09 1995-11-09 Damage-free laser surface treatment method

Publications (1)

Publication Number Publication Date
IL115932A0 true IL115932A0 (en) 1996-01-31

Family

ID=11068162

Family Applications (1)

Application Number Title Priority Date Filing Date
IL11593295A IL115932A0 (en) 1995-11-09 1995-11-09 Damage-free laser surface treatment method

Country Status (7)

Country Link
EP (1) EP0879113B1 (de)
JP (1) JP2000500283A (de)
KR (1) KR100483820B1 (de)
AU (1) AU7331096A (de)
DE (1) DE69632596T2 (de)
IL (1) IL115932A0 (de)
WO (1) WO1997017164A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL119246A (en) 1996-09-12 2000-10-31 Oramir Semiconductor Ltd Laser removal of foreign materials from surfaces
US8066819B2 (en) 1996-12-19 2011-11-29 Best Label Co., Inc. Method of removing organic materials from substrates
IL123416A0 (en) 1998-02-23 1998-09-24 Oramir Semiconductor Ltd Multi laser surface treatment in ambient fast flowing photoreactive gases
GB2347788A (en) * 1999-03-06 2000-09-13 Secr Defence Forming devices such as ferroelectric infra-red sensors by annealing
DE102008041059A1 (de) * 2008-08-06 2010-02-04 Q-Cells Ag Verfahren zur Herstellung einer strukturiert prozessierten oder strukturiert beschichteten Substratoberfläche
US12074026B2 (en) * 2022-05-19 2024-08-27 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated photoresist removal and laser annealing

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL84255A (en) * 1987-10-23 1993-02-21 Galram Technology Ind Ltd Process for removal of post- baked photoresist layer
US5312396A (en) * 1990-09-06 1994-05-17 Massachusetts Institute Of Technology Pulsed laser system for the surgical removal of tissue

Also Published As

Publication number Publication date
DE69632596T2 (de) 2005-06-23
WO1997017164A1 (en) 1997-05-15
AU7331096A (en) 1997-05-29
JP2000500283A (ja) 2000-01-11
KR100483820B1 (ko) 2005-08-17
EP0879113B1 (de) 2004-05-26
EP0879113A1 (de) 1998-11-25
KR19990067433A (ko) 1999-08-16
DE69632596D1 (de) 2004-07-01

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