DE69615375D1 - Verfahren zur Herstellung von Si-Al Legierungen zur Verpackung von electronischen Bauteilen - Google Patents

Verfahren zur Herstellung von Si-Al Legierungen zur Verpackung von electronischen Bauteilen

Info

Publication number
DE69615375D1
DE69615375D1 DE69615375T DE69615375T DE69615375D1 DE 69615375 D1 DE69615375 D1 DE 69615375D1 DE 69615375 T DE69615375 T DE 69615375T DE 69615375 T DE69615375 T DE 69615375T DE 69615375 D1 DE69615375 D1 DE 69615375D1
Authority
DE
Germany
Prior art keywords
alloy
silicon
alloys
packaging
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69615375T
Other languages
English (en)
Other versions
DE69615375T2 (de
Inventor
George Leatham
Josef Ogilvy
Luis Elias
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sandvik Osprey Ltd
Original Assignee
Osprey Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osprey Metals Ltd filed Critical Osprey Metals Ltd
Application granted granted Critical
Publication of DE69615375D1 publication Critical patent/DE69615375D1/de
Publication of DE69615375T2 publication Critical patent/DE69615375T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1036—Alloys containing non-metals starting from a melt
    • C22C1/1042—Alloys containing non-metals starting from a melt by atomising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/115—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by spraying molten metal, i.e. spray sintering, spray casting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C25/00—Alloys based on beryllium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
    • C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
    • C22C32/0063—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides based on SiC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Powder Metallurgy (AREA)
  • Silicon Compounds (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Conductive Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
DE69615375T 1995-07-19 1996-07-18 Verfahren zur Herstellung von Si-Al Legierungen zur Verpackung von electronischen Bauteilen Expired - Lifetime DE69615375T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9514777.3A GB9514777D0 (en) 1995-07-19 1995-07-19 Silicon alloys for electronic packaging
PCT/GB1996/001730 WO1997003775A1 (en) 1995-07-19 1996-07-18 Silicon alloys for electronic packaging

Publications (2)

Publication Number Publication Date
DE69615375D1 true DE69615375D1 (de) 2001-10-25
DE69615375T2 DE69615375T2 (de) 2002-08-14

Family

ID=10777919

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69615375T Expired - Lifetime DE69615375T2 (de) 1995-07-19 1996-07-18 Verfahren zur Herstellung von Si-Al Legierungen zur Verpackung von electronischen Bauteilen

Country Status (9)

Country Link
US (1) US6312535B1 (de)
EP (1) EP0839078B1 (de)
JP (1) JP3892039B2 (de)
AT (1) ATE205762T1 (de)
DE (1) DE69615375T2 (de)
DK (1) DK0839078T3 (de)
ES (1) ES2164904T3 (de)
GB (2) GB9514777D0 (de)
WO (1) WO1997003775A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2319668B (en) * 1996-11-23 2001-09-12 Marconi Gec Ltd Housing for electrical apparatus
EP1028476A4 (de) * 1998-09-08 2007-11-28 Sumitomo Metal Ind Negatives elektroden-material für nichtwässerige elektroden, sekundäre batterie und verfahren für deren herstellung
JP2002294358A (ja) * 2001-04-02 2002-10-09 Taiheiyo Cement Corp 熱伝導性複合材料
US6475263B1 (en) * 2001-04-11 2002-11-05 Crucible Materials Corp. Silicon aluminum alloy of prealloyed powder and method of manufacture
US6653741B2 (en) * 2001-05-24 2003-11-25 Fry's Metals, Inc. Thermal interface material and heat sink configuration
KR101022583B1 (ko) * 2001-05-24 2011-03-16 프라이즈 메탈즈, 인크. 방열재 및 땜납 프리폼
KR100453518B1 (ko) * 2001-11-01 2004-10-20 한국과학기술연구원 반도체 소자용 박스형 구조재용 Si-Al 합금의 제조방법
US7259468B2 (en) * 2004-04-30 2007-08-21 Advanced Chip Engineering Technology Inc. Structure of package
JP4585379B2 (ja) * 2005-06-02 2010-11-24 太平洋セメント株式会社 金属−セラミックス複合材料の製造方法
US10217534B2 (en) 2011-09-23 2019-02-26 Edison Welding Institute, Inc. Method for joining silicon carbide components to one another
US20130075039A1 (en) * 2011-09-23 2013-03-28 Edison Welding Institute, Inc. System for fabricating silicon carbide assemblies
EP2606996A1 (de) * 2011-12-23 2013-06-26 EPoS S.r.L. Verfahren zum Sinter von Metallmatrixverbundmaterialien

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0183016B1 (de) * 1984-10-03 1989-09-20 Sumitomo Electric Industries Limited Werkstoff für Halbleiteranordung und Verfahren zu seiner Herstellung
WO1989012115A1 (en) * 1988-06-06 1989-12-14 Osprey Metals Limited Spray deposition
US5022455A (en) * 1989-07-31 1991-06-11 Sumitomo Electric Industries, Ltd. Method of producing aluminum base alloy containing silicon
GB9015832D0 (en) * 1990-07-19 1990-09-05 Osprey Metals Ltd Introducing means
EP0592665B1 (de) * 1990-10-31 1996-06-12 Sumitomo Electric Industries, Ltd. Übereutektisches aluminium-silikon-pulver und dessen herstellung
JPH05331635A (ja) * 1992-05-29 1993-12-14 Kobe Steel Ltd Ａｌ含有Ｓｉ基合金ターゲット材およびその製造方法
NO175543C (no) * 1992-11-18 1994-10-26 Elkem As Silisiumbasert legering, fremgangsmåte til fremstilling av slik legering samt fremgangsmåte for fremstilling av konsoliderte produkter fra silisiumbasert legering
JPH0892683A (ja) * 1994-09-27 1996-04-09 Sumitomo Electric Ind Ltd 窒素化合アルミニウム−シリコン粉末合金およびその製造方法

Also Published As

Publication number Publication date
DE69615375T2 (de) 2002-08-14
EP0839078B1 (de) 2001-09-19
JPH11509480A (ja) 1999-08-24
EP0839078A1 (de) 1998-05-06
GB9514777D0 (en) 1995-09-20
ES2164904T3 (es) 2002-03-01
US6312535B1 (en) 2001-11-06
JP3892039B2 (ja) 2007-03-14
DK0839078T3 (da) 2001-12-27
GB2317900A (en) 1998-04-08
GB9800723D0 (en) 1998-03-11
WO1997003775A1 (en) 1997-02-06
GB2317900B (en) 2000-03-01
ATE205762T1 (de) 2001-10-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SANDVIK OSPREY LTD., NEATH, WEST GLAMORGAN, GB