DE69605782T2 - Poliertuch und verfahren zum befestigen oder lösen des poliertuches an/aus die grundplatte einer poliervorrichtung - Google Patents

Poliertuch und verfahren zum befestigen oder lösen des poliertuches an/aus die grundplatte einer poliervorrichtung

Info

Publication number
DE69605782T2
DE69605782T2 DE69605782T DE69605782T DE69605782T2 DE 69605782 T2 DE69605782 T2 DE 69605782T2 DE 69605782 T DE69605782 T DE 69605782T DE 69605782 T DE69605782 T DE 69605782T DE 69605782 T2 DE69605782 T2 DE 69605782T2
Authority
DE
Germany
Prior art keywords
polishing
towel
releasing
attaching
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69605782T
Other languages
English (en)
Other versions
DE69605782D1 (de
Inventor
Hideyuki Rodel Nitta Com Ishii
Yoshitane Rodel Nitta Shigeta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitta Corp
Original Assignee
Nitta Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitta Corp filed Critical Nitta Corp
Publication of DE69605782D1 publication Critical patent/DE69605782D1/de
Application granted granted Critical
Publication of DE69605782T2 publication Critical patent/DE69605782T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/001—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as supporting member
    • B24D3/002—Flexible supporting members, e.g. paper, woven, plastic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C09J2400/243—Presence of a foam in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/26—Presence of textile or fabric
    • C09J2400/263—Presence of textile or fabric in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S451/00—Abrading
    • Y10S451/921—Pad for lens shaping tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1462—Polymer derived from material having at least one acrylic or alkacrylic group or the nitrile or amide derivative thereof [e.g., acrylamide, acrylate ester, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1476—Release layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE69605782T 1995-04-25 1996-04-24 Poliertuch und verfahren zum befestigen oder lösen des poliertuches an/aus die grundplatte einer poliervorrichtung Expired - Fee Related DE69605782T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10137995A JP3354744B2 (ja) 1995-04-25 1995-04-25 研磨布及びその研磨布の研磨機定盤への脱着方法
PCT/JP1996/001110 WO1996033842A1 (en) 1995-04-25 1996-04-24 A polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine

Publications (2)

Publication Number Publication Date
DE69605782D1 DE69605782D1 (de) 2000-01-27
DE69605782T2 true DE69605782T2 (de) 2000-05-31

Family

ID=14299163

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69605782T Expired - Fee Related DE69605782T2 (de) 1995-04-25 1996-04-24 Poliertuch und verfahren zum befestigen oder lösen des poliertuches an/aus die grundplatte einer poliervorrichtung

Country Status (9)

Country Link
US (1) US6190746B1 (de)
EP (1) EP0822884B1 (de)
JP (1) JP3354744B2 (de)
KR (1) KR19990008033A (de)
DE (1) DE69605782T2 (de)
ES (1) ES2143194T3 (de)
MY (1) MY113123A (de)
TW (1) TW318161B (de)
WO (1) WO1996033842A1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5957750A (en) 1997-12-18 1999-09-28 Micron Technology, Inc. Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
WO1999062673A1 (en) * 1998-06-02 1999-12-09 Scapa Group Plc Improved polishing pad with reduced moisture absorption
JP2000071170A (ja) * 1998-08-28 2000-03-07 Nitta Ind Corp 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法
JP2000077366A (ja) 1998-08-28 2000-03-14 Nitta Ind Corp 研磨布及びその研磨布の研磨機定盤への脱着方法
WO2000013854A1 (en) * 1998-09-08 2000-03-16 Struers A/S Support for temporary fixation of a self-sticking abrasive and/or polishing sheet
JP2000160117A (ja) * 1998-09-21 2000-06-13 Toyo Ink Mfg Co Ltd 両面粘着シ―ト、その製造方法、およびその粘着力の調整方法
JP3697963B2 (ja) * 1999-08-30 2005-09-21 富士電機デバイステクノロジー株式会社 研磨布および平面研磨加工方法
KR100390923B1 (ko) * 2000-05-24 2003-07-10 고려연마공업 주식회사 기재가 없는 연마제품의 제조방법
KR20030028482A (ko) * 2000-08-03 2003-04-08 가부시키가이샤 니콘 화학 기계 연마 장치, 연마 패드 및 반도체 소자의 제조방법
JP2002066454A (ja) * 2000-08-24 2002-03-05 Sekisui Chem Co Ltd 粘着シートの製造方法
JP4743958B2 (ja) * 2000-12-25 2011-08-10 東洋ゴム工業株式会社 研磨パッド
JP4912548B2 (ja) * 2001-09-25 2012-04-11 株式会社Ｆｉｌｗｅｌ 被研磨部材の保持材の製造方法
FR2830783B1 (fr) * 2001-10-16 2004-01-16 Sarl Capital Innovation Dispositif pour le poncage ou le polissage comportant un support presentant une surface a adherence renouvelable
KR100877390B1 (ko) * 2001-11-13 2009-01-07 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
CN101130231A (zh) * 2001-11-13 2008-02-27 东洋橡胶工业株式会社 研磨垫及其制造方法
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
JP4351007B2 (ja) * 2003-09-08 2009-10-28 東洋ゴム工業株式会社 研磨パッド
JP2005103702A (ja) * 2003-09-30 2005-04-21 Toyo Tire & Rubber Co Ltd Ｃｍｐ用研磨パッド及びその梱包方法
CN102990530B (zh) * 2006-07-14 2016-02-10 圣戈本磨料股份有限公司 无背衬研磨制品
MX2012007288A (es) * 2009-12-29 2012-07-30 Saint Gobain Abrasifs Sa Metodo para limpiar una superficie domestica.
JP5479189B2 (ja) * 2010-03-31 2014-04-23 富士紡ホールディングス株式会社 シート材の選択方法
JP2011224701A (ja) * 2010-04-19 2011-11-10 Teijin Cordley Ltd 研磨パッド用素材の製造方法
JP5851124B2 (ja) * 2011-06-13 2016-02-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨用構造体
RU2506296C2 (ru) * 2012-02-28 2014-02-10 федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Ивановский государственный политехнический университет" (ИВГПУ) Многослойный клеевой материал
GB2537161B (en) * 2015-04-10 2019-06-19 Reckitt Benckiser Brands Ltd Novel material
JP7088647B2 (ja) * 2017-09-21 2022-06-21 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3954697A (en) 1975-03-31 1976-05-04 Eastman Kodak Company Poly(higher-1-olefin-co-propylene) copolymers as hot-melt, pressure-sensitive adhesives
US4217428A (en) 1975-03-31 1980-08-12 Eastman Kodak Company Blends of substantially amorphous higher 1-olefin copolymers and tackifying resins useful as pressure-sensitive adhesives
US4979337A (en) * 1986-10-03 1990-12-25 Duppstadt Arthur G Polishing tool for contact lenses and associated method
US4895033A (en) * 1987-12-21 1990-01-23 Voss Jorgen T Sample holder for use in the grinding or polishing of samples
US5156911A (en) 1989-05-11 1992-10-20 Landec Labs Inc. Skin-activated temperature-sensitive adhesive assemblies
ATE142557T1 (de) 1989-05-11 1996-09-15 Landec Corp Von der temperatur aktivierte bindemitteleinheiten
US4988554A (en) * 1989-06-23 1991-01-29 Minnesota Mining And Manufacturing Company Abrasive article coated with a lithium salt of a fatty acid
AU638736B2 (en) * 1989-09-15 1993-07-08 Minnesota Mining And Manufacturing Company A coated abrasive containing a pressure-sensitive adhesive coatable from water
US5163976A (en) * 1991-05-13 1992-11-17 Norton Company Hot melt pressure sensitive adhesives

Also Published As

Publication number Publication date
US6190746B1 (en) 2001-02-20
JPH08293477A (ja) 1996-11-05
DE69605782D1 (de) 2000-01-27
MY113123A (en) 2001-11-30
EP0822884A1 (de) 1998-02-11
EP0822884B1 (de) 1999-12-22
TW318161B (de) 1997-10-21
WO1996033842A1 (en) 1996-10-31
JP3354744B2 (ja) 2002-12-09
KR19990008033A (ko) 1999-01-25
ES2143194T3 (es) 2000-05-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee