DE69604148D1 - Transport-vorrichtung für dünnschicht-sputteranlage - Google Patents

Transport-vorrichtung für dünnschicht-sputteranlage

Info

Publication number
DE69604148D1
DE69604148D1 DE69604148T DE69604148T DE69604148D1 DE 69604148 D1 DE69604148 D1 DE 69604148D1 DE 69604148 T DE69604148 T DE 69604148T DE 69604148 T DE69604148 T DE 69604148T DE 69604148 D1 DE69604148 D1 DE 69604148D1
Authority
DE
Germany
Prior art keywords
thin
transport device
sputter system
layer sputter
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69604148T
Other languages
English (en)
Other versions
DE69604148T2 (de
Inventor
Thomas Gruber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seagate Technology LLC
Original Assignee
Seagate Technology LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seagate Technology LLC filed Critical Seagate Technology LLC
Application granted granted Critical
Publication of DE69604148D1 publication Critical patent/DE69604148D1/de
Publication of DE69604148T2 publication Critical patent/DE69604148T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Mechanical Conveyors (AREA)
DE69604148T 1995-05-10 1996-05-08 Transport-vorrichtung für dünnschicht-sputteranlage Expired - Fee Related DE69604148T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/437,914 US5660114A (en) 1995-05-10 1995-05-10 Transport system for thin film sputtering system
PCT/US1996/006484 WO1996035823A1 (en) 1995-05-10 1996-05-08 Transport system for thin film sputtering system

Publications (2)

Publication Number Publication Date
DE69604148D1 true DE69604148D1 (de) 1999-10-14
DE69604148T2 DE69604148T2 (de) 2000-02-03

Family

ID=23738445

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69604148T Expired - Fee Related DE69604148T2 (de) 1995-05-10 1996-05-08 Transport-vorrichtung für dünnschicht-sputteranlage

Country Status (6)

Country Link
US (1) US5660114A (de)
EP (1) EP0777760B1 (de)
JP (1) JPH11508323A (de)
KR (1) KR970704905A (de)
DE (1) DE69604148T2 (de)
WO (1) WO1996035823A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE507457C2 (sv) * 1996-10-15 1998-06-08 Berendsen S Ab Anordning vid hänglasttransportör
US6254747B1 (en) * 1996-12-25 2001-07-03 Nihon Shinku Gijutsu Kabushiki Kaisha Magnetron sputtering source enclosed by a mirror-finished metallic cover
JP3468056B2 (ja) * 1997-09-23 2003-11-17 東京エレクトロン株式会社 基板検出装置
US6849153B2 (en) * 1998-04-16 2005-02-01 Siemens Aktiengesellschaft Removal of post-rie polymer on A1/CU metal line
GB2350374B (en) * 1999-05-11 2003-09-24 Trikon Holdings Ltd Deposition apparatus
WO2004013373A2 (en) * 2002-08-02 2004-02-12 Seagate Technology Llc Apparatus and method to control bias during sputtering
WO2004056681A1 (ja) * 2002-12-20 2004-07-08 Honda Motor Co., Ltd. 搬送システム
US6962648B2 (en) * 2003-09-15 2005-11-08 Global Silicon Net Corp. Back-biased face target sputtering
SE529079C2 (sv) 2005-08-05 2007-04-24 Eton Systems Ab Byggelement för en anordning för framtagning av produktbärare samt anordning innefattande ett sådant byggelement
US20080302656A1 (en) * 2007-06-06 2008-12-11 Jurgen Henrich Vacuum coating installation with transport rollers for the transport of a planar substrate
US9782949B2 (en) 2008-05-30 2017-10-10 Corning Incorporated Glass laminated articles and layered articles
US8432603B2 (en) * 2009-03-31 2013-04-30 View, Inc. Electrochromic devices
US8406918B2 (en) * 2009-12-21 2013-03-26 WD Media, LLC Master teaching jig
KR101359682B1 (ko) * 2010-04-02 2014-02-06 무라다기카이가부시끼가이샤 천장을 주행하는 반송차의 사이드 버퍼 및 반송차 시스템
CN104011588B (zh) 2011-12-12 2021-06-22 唯景公司 薄膜装置和制造
DE102015116738A1 (de) * 2015-10-02 2017-04-06 Von Ardenne Gmbh Substratträger, Transportsystemanordnung und Substratbehandlungsanlage
DE102015116781A1 (de) * 2015-10-02 2017-04-06 Von Ardenne Gmbh Transportsystemanordnung und Prozessieranlage
US9856557B1 (en) 2016-01-22 2018-01-02 Seagate Technology Llc Fabrication of a multi-layered magnetic element
WO2019121289A1 (en) 2017-12-21 2019-06-27 Agc Glass Europe Surface treatment chamber transport system
CN114641435A (zh) * 2020-05-13 2022-06-17 应用材料公司 辊子运输系统载体、辊子运输系统和真空处理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3610393A (en) * 1970-02-11 1971-10-05 Ppg Industries Inc Lifter for use with automatic tong unloader
US4042128A (en) * 1975-11-26 1977-08-16 Airco, Inc. Substrate transfer apparatus for a vacuum coating system
US4274936A (en) * 1979-04-30 1981-06-23 Advanced Coating Technology, Inc. Vacuum deposition system and method
DE3017941C2 (de) * 1980-05-10 1985-10-31 Ipsen Industries International Gmbh, 4190 Kleve Vorrichtung zum Transport von Chargengestellen durch einen Mehrkammerofen
DE3623970A1 (de) * 1986-07-16 1988-01-28 Leybold Heraeus Gmbh & Co Kg Transporteinrichtung mit rollensystemen fuer vakuum-beschichtungsanlagen
JPH01268870A (ja) * 1988-04-18 1989-10-26 Anelva Corp 縦トレイ搬送式スパッタ装置
EP0577766B1 (de) * 1991-04-04 1999-12-29 Seagate Technology, Inc. Verfahren und vorrichtung zum sputtern mit hoher geschwindigkeit
DE4224816C1 (de) * 1992-07-27 1993-09-02 Electro Pneumatic International Gmbh, 83734 Hausham, De

Also Published As

Publication number Publication date
US5660114A (en) 1997-08-26
EP0777760A1 (de) 1997-06-11
DE69604148T2 (de) 2000-02-03
JPH11508323A (ja) 1999-07-21
EP0777760B1 (de) 1999-09-08
KR970704905A (ko) 1997-09-06
WO1996035823A1 (en) 1996-11-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SEAGATE TECHNOLOGY LLC, SCOTTS VALLEY, CALIF., US

8339 Ceased/non-payment of the annual fee