DE69603079D1 - Vorrichtung zum materialbeschichten grossflächiger substrate - Google Patents
Vorrichtung zum materialbeschichten grossflächiger substrateInfo
- Publication number
- DE69603079D1 DE69603079D1 DE69603079T DE69603079T DE69603079D1 DE 69603079 D1 DE69603079 D1 DE 69603079D1 DE 69603079 T DE69603079 T DE 69603079T DE 69603079 T DE69603079 T DE 69603079T DE 69603079 D1 DE69603079 D1 DE 69603079D1
- Authority
- DE
- Germany
- Prior art keywords
- large area
- material coating
- area substrates
- substrates
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/022—Manufacture of electrodes or electrode systems of cold cathodes
- H01J9/025—Manufacture of electrodes or electrode systems of cold cathodes of field emission cathodes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9504873A FR2733253B1 (fr) | 1995-04-24 | 1995-04-24 | Dispositif pour deposer un materiau par evaporation sur des substrats de grande surface |
PCT/FR1996/000616 WO1996034123A1 (fr) | 1995-04-24 | 1996-04-23 | Dispositif pour deposer un materiau par evaporation sur des substrats de grande surface |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69603079D1 true DE69603079D1 (de) | 1999-08-05 |
DE69603079T2 DE69603079T2 (de) | 2000-03-16 |
Family
ID=9478388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69603079T Expired - Lifetime DE69603079T2 (de) | 1995-04-24 | 1996-04-23 | Vorrichtung zum materialbeschichten grossflächiger substrate |
Country Status (6)
Country | Link |
---|---|
US (1) | US6509061B1 (de) |
EP (1) | EP0824603B1 (de) |
JP (1) | JP4072570B2 (de) |
DE (1) | DE69603079T2 (de) |
FR (1) | FR2733253B1 (de) |
WO (1) | WO1996034123A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2185640A1 (en) * | 1995-11-30 | 1997-05-31 | Russell J. Hill | Electron beam evaporation apparatus and method |
US6592675B2 (en) * | 2001-08-09 | 2003-07-15 | Moore Epitaxial, Inc. | Rotating susceptor |
CN100479082C (zh) * | 2003-04-04 | 2009-04-15 | 松下电器产业株式会社 | 等离子体显示面板的制造方法 |
KR100637180B1 (ko) * | 2004-11-05 | 2006-10-23 | 삼성에스디아이 주식회사 | 증착 방법 및 이를 위한 증착 장치 |
US20100247747A1 (en) * | 2009-03-27 | 2010-09-30 | Semiconductor Energy Laboratory Co., Ltd. | Film Deposition Apparatus, Method for Depositing Film, and Method for Manufacturing Lighting Device |
CA2757872C (en) * | 2009-04-28 | 2019-03-26 | Ferrotec (Usa) Corporation | Lift-off deposition system featuring a density optimized hula substrate holder in a conical deposition chamber |
KR20120138305A (ko) * | 2011-06-14 | 2012-12-26 | 삼성디스플레이 주식회사 | 유기 박막 증착 시스템 및 유기 박막 증착 방법 |
JP2013137379A (ja) * | 2011-12-28 | 2013-07-11 | Dainippon Printing Co Ltd | フレネルレンズシートに対する蒸着方法、反射スクリーンの製造方法 |
HK1215127A2 (zh) | 2015-06-17 | 2016-08-12 | Master Dynamic Ltd | 製品塗層的設備、儀器和工藝 |
CN105088145B (zh) * | 2015-08-19 | 2017-03-29 | 京东方科技集团股份有限公司 | 用于oled蒸发源的坩埚及其制造方法 |
JP2017173742A (ja) * | 2016-03-25 | 2017-09-28 | 大日本印刷株式会社 | 偏光子の製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3244557A (en) * | 1963-09-19 | 1966-04-05 | Ibm | Process of vapor depositing and annealing vapor deposited layers of tin-germanium and indium-germanium metastable solid solutions |
US3853091A (en) * | 1973-12-03 | 1974-12-10 | Ibm | Thin film coating apparatus |
US4681773A (en) * | 1981-03-27 | 1987-07-21 | American Telephone And Telegraph Company At&T Bell Laboratories | Apparatus for simultaneous molecular beam deposition on a plurality of substrates |
US4646680A (en) * | 1985-12-23 | 1987-03-03 | General Electric Company | Crucible for use in molecular beam epitaxial processing |
FR2593953B1 (fr) | 1986-01-24 | 1988-04-29 | Commissariat Energie Atomique | Procede de fabrication d'un dispositif de visualisation par cathodoluminescence excitee par emission de champ |
JPH0745711B2 (ja) * | 1987-12-10 | 1995-05-17 | 株式会社日立製作所 | 高指向性蒸着装置 |
US5133286A (en) * | 1989-04-14 | 1992-07-28 | Samsung Electro-Mechanics Co., Ltd. | Substrate-heating device and boat structure for a vacuum-depositing apparatus |
JPH03134164A (ja) * | 1989-10-18 | 1991-06-07 | Ricoh Co Ltd | 薄膜形成装置及びこの装置を用いた超伝導薄膜形成方法 |
FR2663462B1 (fr) | 1990-06-13 | 1992-09-11 | Commissariat Energie Atomique | Source d'electrons a cathodes emissives a micropointes. |
DE4025659A1 (de) * | 1990-08-14 | 1992-02-20 | Leybold Ag | Umlaufraedergetriebe mit einem raedersatz, insbesondere fuer vorrichtungen zum beschichten von substraten |
JPH04285157A (ja) * | 1991-03-12 | 1992-10-09 | Hitachi Ltd | 金属の蒸発方法 |
DE4123342C2 (de) * | 1991-07-15 | 1999-08-19 | Leybold Ag | Reihenverdampfer für Vakuumbedampfungsanlagen |
JP3134164B2 (ja) | 1991-07-31 | 2001-02-13 | 京セラ株式会社 | 留守番電話機の録音再生方式 |
US5334302A (en) * | 1991-11-15 | 1994-08-02 | Tokyo Electron Limited | Magnetron sputtering apparatus and sputtering gun for use in the same |
US5344352A (en) * | 1992-04-02 | 1994-09-06 | U.S. Philips Corporation | Method of manufacturing a pointed electrode, and device for using said method |
US5584739A (en) * | 1993-02-10 | 1996-12-17 | Futaba Denshi Kogyo K.K | Field emission element and process for manufacturing same |
US5518548A (en) * | 1995-08-03 | 1996-05-21 | Honeywell Inc. | Deposition barrier |
-
1995
- 1995-04-24 FR FR9504873A patent/FR2733253B1/fr not_active Expired - Fee Related
-
1996
- 1996-04-23 WO PCT/FR1996/000616 patent/WO1996034123A1/fr active IP Right Grant
- 1996-04-23 DE DE69603079T patent/DE69603079T2/de not_active Expired - Lifetime
- 1996-04-23 EP EP96915075A patent/EP0824603B1/de not_active Expired - Lifetime
- 1996-04-23 JP JP53221596A patent/JP4072570B2/ja not_active Expired - Fee Related
- 1996-04-23 US US08/931,000 patent/US6509061B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2733253B1 (fr) | 1997-06-13 |
US6509061B1 (en) | 2003-01-21 |
JPH11504077A (ja) | 1999-04-06 |
FR2733253A1 (fr) | 1996-10-25 |
WO1996034123A1 (fr) | 1996-10-31 |
EP0824603A1 (de) | 1998-02-25 |
EP0824603B1 (de) | 1999-06-30 |
DE69603079T2 (de) | 2000-03-16 |
JP4072570B2 (ja) | 2008-04-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |