DE69527034D1 - Zylindrische Verbundrückwandleiterplatte - Google Patents
Zylindrische VerbundrückwandleiterplatteInfo
- Publication number
- DE69527034D1 DE69527034D1 DE69527034T DE69527034T DE69527034D1 DE 69527034 D1 DE69527034 D1 DE 69527034D1 DE 69527034 T DE69527034 T DE 69527034T DE 69527034 T DE69527034 T DE 69527034T DE 69527034 D1 DE69527034 D1 DE 69527034D1
- Authority
- DE
- Germany
- Prior art keywords
- cylindrical composite
- composite backplane
- backplane
- cylindrical
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1439—Back panel mother boards
- H05K7/1442—Back panel mother boards with a radial structure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/409—Mechanical coupling
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/362,064 US5519584A (en) | 1994-12-22 | 1994-12-22 | Laminated cylindrical backplane |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69527034D1 true DE69527034D1 (de) | 2002-07-18 |
DE69527034T2 DE69527034T2 (de) | 2003-02-06 |
Family
ID=23424546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69527034T Expired - Fee Related DE69527034T2 (de) | 1994-12-22 | 1995-12-06 | Zylindrische Verbundrückwandleiterplatte |
Country Status (6)
Country | Link |
---|---|
US (1) | US5519584A (de) |
EP (1) | EP0718931B1 (de) |
JP (1) | JPH08236969A (de) |
KR (1) | KR100375311B1 (de) |
CA (1) | CA2164351C (de) |
DE (1) | DE69527034T2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10208791A (ja) * | 1997-01-21 | 1998-08-07 | Canon Inc | 筐体内部のフレームグラウンド間接続方法 |
JP4397109B2 (ja) | 2000-08-14 | 2010-01-13 | 富士通株式会社 | 情報処理装置及びクロスバーボードユニット・バックパネル組立体の製造方法 |
DE10130592C1 (de) * | 2001-06-27 | 2002-10-24 | Infineon Technologies Ag | Modulbaugruppe für Speicher-Module und Verfahren zu ihrer Herstellung |
WO2009032144A2 (en) * | 2007-08-28 | 2009-03-12 | General Dynamics Advanced Information Systems, Inc. | System and method for interconnecting circuit boards |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4679872A (en) * | 1986-01-27 | 1987-07-14 | Coe Larry D | Cylindrical back plane structure for receiving printed circuit boards |
JP2591677B2 (ja) * | 1989-04-21 | 1997-03-19 | 株式会社 グラフィコ | 放射型・パラレル・システムバス |
JP2545467B2 (ja) * | 1989-09-26 | 1996-10-16 | 株式会社日立製作所 | 電子装置の放熱構造 |
US5119273A (en) * | 1990-01-29 | 1992-06-02 | The United States Of America As Represented By The Secretary Of The Navy | High speed parallel backplane |
JP2700837B2 (ja) * | 1990-10-19 | 1998-01-21 | 株式会社 グラフィコ | 放射型・パラレル・システムバスにおける基板接続装置 |
IL99978A0 (en) * | 1990-11-16 | 1992-08-18 | Graphico Corp | Improved parallel processing system |
JPH04320509A (ja) * | 1991-04-19 | 1992-11-11 | Gurafuiko:Kk | 並列処理装置 |
JPH06177562A (ja) * | 1992-12-01 | 1994-06-24 | Hitachi Ltd | プリント板装置及び遠方監視制御装置 |
-
1994
- 1994-12-22 US US08/362,064 patent/US5519584A/en not_active Expired - Lifetime
-
1995
- 1995-12-04 CA CA002164351A patent/CA2164351C/en not_active Expired - Fee Related
- 1995-12-06 DE DE69527034T patent/DE69527034T2/de not_active Expired - Fee Related
- 1995-12-06 EP EP95308845A patent/EP0718931B1/de not_active Expired - Lifetime
- 1995-12-19 KR KR1019950052125A patent/KR100375311B1/ko not_active IP Right Cessation
- 1995-12-22 JP JP7334792A patent/JPH08236969A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0718931A2 (de) | 1996-06-26 |
CA2164351A1 (en) | 1996-06-23 |
KR960026537A (ko) | 1996-07-22 |
JPH08236969A (ja) | 1996-09-13 |
CA2164351C (en) | 2000-03-07 |
EP0718931B1 (de) | 2002-06-12 |
EP0718931A3 (de) | 1999-03-31 |
KR100375311B1 (ko) | 2003-08-21 |
DE69527034T2 (de) | 2003-02-06 |
US5519584A (en) | 1996-05-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |