DE69523862T2 - Bleifreies Weichlot - Google Patents

Bleifreies Weichlot

Info

Publication number
DE69523862T2
DE69523862T2 DE69523862T DE69523862T DE69523862T2 DE 69523862 T2 DE69523862 T2 DE 69523862T2 DE 69523862 T DE69523862 T DE 69523862T DE 69523862 T DE69523862 T DE 69523862T DE 69523862 T2 DE69523862 T2 DE 69523862T2
Authority
DE
Germany
Prior art keywords
lead
soft solder
free soft
free
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69523862T
Other languages
English (en)
Other versions
DE69523862D1 (de
Inventor
Ryuji Ninomiya
Junichi Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26397669&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69523862(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Application granted granted Critical
Publication of DE69523862D1 publication Critical patent/DE69523862D1/de
Publication of DE69523862T2 publication Critical patent/DE69523862T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Conductive Materials (AREA)
DE69523862T 1994-11-02 1995-04-03 Bleifreies Weichlot Expired - Fee Related DE69523862T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29388094 1994-11-02
JP7056691A JP2805595B2 (ja) 1994-11-02 1995-02-21 鉛無含有半田合金

Publications (2)

Publication Number Publication Date
DE69523862D1 DE69523862D1 (de) 2001-12-20
DE69523862T2 true DE69523862T2 (de) 2002-06-27

Family

ID=26397669

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69523862T Expired - Fee Related DE69523862T2 (de) 1994-11-02 1995-04-03 Bleifreies Weichlot

Country Status (5)

Country Link
US (1) US5658528A (de)
EP (1) EP0710521B1 (de)
JP (1) JP2805595B2 (de)
DE (1) DE69523862T2 (de)
ES (1) ES2168333T3 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970687A (ja) * 1995-07-04 1997-03-18 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
JP3220635B2 (ja) * 1996-02-09 2001-10-22 松下電器産業株式会社 はんだ合金及びクリームはんだ
US6371361B1 (en) * 1996-02-09 2002-04-16 Matsushita Electric Industrial Co., Ltd. Soldering alloy, cream solder and soldering method
WO1997047425A1 (en) * 1996-06-12 1997-12-18 International Business Machines Corporation Lead-free, high tin ternary solder alloy of tin, silver, and bismuth
JPH1071488A (ja) * 1996-08-29 1998-03-17 Mitsui Mining & Smelting Co Ltd 錫−銀系半田合金
WO1998014617A1 (en) * 1996-10-04 1998-04-09 Chronix Biomedical Diagnostic detection of nucleic acids
JP3601278B2 (ja) * 1996-12-17 2004-12-15 ソニー株式会社 はんだ材料
US6649127B2 (en) 1996-12-17 2003-11-18 Sony Chemicals Corp Lead-free solder material having good wettability
GB9701819D0 (en) * 1997-01-29 1997-03-19 Alpha Fry Ltd Lead-free tin alloy
US5928404A (en) * 1997-03-28 1999-07-27 Ford Motor Company Electrical solder and method of manufacturing
JPH10328880A (ja) * 1997-06-04 1998-12-15 Mitsui Mining & Smelting Co Ltd 錫−銀系無鉛半田合金
JP3753168B2 (ja) 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
JP2001071174A (ja) * 1999-09-07 2001-03-21 Mitsui Mining & Smelting Co Ltd 錫−銀系ハンダ合金
US6429388B1 (en) 2000-05-03 2002-08-06 International Business Machines Corporation High density column grid array connections and method thereof
KR100407448B1 (ko) 2000-06-12 2003-11-28 가부시키가이샤 히타치세이사쿠쇼 전자 기기 및 반도체 장치
US6433425B1 (en) 2000-09-12 2002-08-13 International Business Machines Corporation Electronic package interconnect structure comprising lead-free solders
DK2147740T3 (en) * 2001-03-01 2015-08-03 Senju Metal Industry Co Lead-free solder paste
GB2380964B (en) 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
US6837947B2 (en) 2002-01-15 2005-01-04 National Cheng-Kung University Lead-free solder
US6805974B2 (en) 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition
US20040187976A1 (en) * 2003-03-31 2004-09-30 Fay Hua Phase change lead-free super plastic solders
US20050029675A1 (en) * 2003-03-31 2005-02-10 Fay Hua Tin/indium lead-free solders for low stress chip attachment
US7223695B2 (en) 2004-09-30 2007-05-29 Intel Corporation Methods to deposit metal alloy barrier layers
US20080157910A1 (en) * 2006-12-29 2008-07-03 Park Chang-Min Amorphous soft magnetic layer for on-die inductively coupled wires
EP2183076A1 (de) * 2007-07-23 2010-05-12 Henkel Limited Lötflussmittel
JP5339968B2 (ja) * 2009-03-04 2013-11-13 パナソニック株式会社 実装構造体及びモータ
US20140112710A1 (en) * 2011-02-25 2014-04-24 Senju Metal Industry Co., Ltd. Solder Alloy for Power Devices and Solder Joint Having a High Current Density
CN113369745B (zh) * 2021-05-21 2022-11-04 北京理工大学 四元共晶焊料及制备方法、以及焊料成分

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH80998A (fr) * 1918-08-09 1920-01-02 Gustave Ferriere Soudure pour l'aluminium
JPS5829198A (ja) * 1981-08-13 1983-02-21 Mitsubishi Electric Corp ジヨセフソン・メモリ回路
GB9103018D0 (en) * 1991-02-13 1991-03-27 Lancashire Fittings Ltd Lead free soft solder for stainless steel
JP2722917B2 (ja) * 1992-02-21 1998-03-09 松下電器産業株式会社 高温はんだ
US5256370B1 (en) * 1992-05-04 1996-09-03 Indium Corp America Lead-free alloy containing tin silver and indium
JPH0825050B2 (ja) * 1993-06-08 1996-03-13 日本アルミット株式会社 無含鉛半田合金
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
US5393489A (en) * 1993-06-16 1995-02-28 International Business Machines Corporation High temperature, lead-free, tin based solder composition

Also Published As

Publication number Publication date
JP2805595B2 (ja) 1998-09-30
US5658528A (en) 1997-08-19
ES2168333T3 (es) 2002-06-16
EP0710521B1 (de) 2001-11-14
DE69523862D1 (de) 2001-12-20
JPH08187590A (ja) 1996-07-23
EP0710521A1 (de) 1996-05-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: PFENNING MEINIG & PARTNER GBR, 80339 MUENCHEN

8328 Change in the person/name/address of the agent

Representative=s name: MAIWALD PATENTANWALTSGESELLSCHAFT MBH, 80335 MUENC

8339 Ceased/non-payment of the annual fee