DE69515560D1 - Vorrichtung und Verfahren zum Schutz einer integrierten Schaltung - Google Patents

Vorrichtung und Verfahren zum Schutz einer integrierten Schaltung

Info

Publication number
DE69515560D1
DE69515560D1 DE69515560T DE69515560T DE69515560D1 DE 69515560 D1 DE69515560 D1 DE 69515560D1 DE 69515560 T DE69515560 T DE 69515560T DE 69515560 T DE69515560 T DE 69515560T DE 69515560 D1 DE69515560 D1 DE 69515560D1
Authority
DE
Germany
Prior art keywords
protecting
integrated circuit
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69515560T
Other languages
English (en)
Other versions
DE69515560T2 (de
Inventor
Hoang Nguyen
John D Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics America Inc filed Critical Hyundai Electronics America Inc
Publication of DE69515560D1 publication Critical patent/DE69515560D1/de
Application granted granted Critical
Publication of DE69515560T2 publication Critical patent/DE69515560T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0259—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using bipolar transistors as protective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE69515560T 1994-06-13 1995-06-01 Vorrichtung und Verfahren zum Schutz einer integrierten Schaltung Expired - Fee Related DE69515560T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/259,240 US5616943A (en) 1993-09-29 1994-06-13 Electrostatic discharge protection system for mixed voltage application specific integrated circuit design

Publications (2)

Publication Number Publication Date
DE69515560D1 true DE69515560D1 (de) 2000-04-20
DE69515560T2 DE69515560T2 (de) 2000-09-21

Family

ID=22984144

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69515560T Expired - Fee Related DE69515560T2 (de) 1994-06-13 1995-06-01 Vorrichtung und Verfahren zum Schutz einer integrierten Schaltung

Country Status (4)

Country Link
US (2) US5616943A (de)
EP (1) EP0688079B1 (de)
JP (1) JPH0855965A (de)
DE (1) DE69515560T2 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3019760B2 (ja) * 1995-11-15 2000-03-13 日本電気株式会社 半導体集積回路装置
US5714900A (en) * 1996-04-12 1998-02-03 Hewlett-Packard Company Electrical overstress protection device
US5966599A (en) * 1996-05-21 1999-10-12 Lsi Logic Corporation Method for fabricating a low trigger voltage silicon controlled rectifier and thick field device
US5796638A (en) * 1996-06-24 1998-08-18 The Board Of Trustees Of The University Of Illinois Methods, apparatus and computer program products for synthesizing integrated circuits with electrostatic discharge capability and connecting ground rules faults therein
US6040968A (en) * 1997-06-30 2000-03-21 Texas Instruments Incorporated EOS/ESD protection for high density integrated circuits
US5926353A (en) * 1998-03-02 1999-07-20 Hewlett-Packard Co. Method for protecting mixed signal chips from electrostatic discharge
US6037636A (en) * 1998-05-19 2000-03-14 National Semiconductor Corporation Electrostatic discharge protection circuit and method
US5985705A (en) * 1998-06-30 1999-11-16 Lsi Logic Corporation Low threshold voltage MOS transistor and method of manufacture
WO2000028594A1 (en) * 1998-11-09 2000-05-18 Koninklijke Philips Electronics N.V. Over-voltage protection for integrated analog and digital circuits
US6445039B1 (en) 1998-11-12 2002-09-03 Broadcom Corporation System and method for ESD Protection
US6271999B1 (en) 1998-11-20 2001-08-07 Taiwan Semiconductor Manufacturing Company ESD protection circuit for different power supplies
US8405152B2 (en) 1999-01-15 2013-03-26 Broadcom Corporation System and method for ESD protection
AU3209000A (en) * 1999-01-15 2000-08-01 Broadcom Corporation System and method for esd protection
US7687858B2 (en) * 1999-01-15 2010-03-30 Broadcom Corporation System and method for ESD protection
US6169001B1 (en) 1999-02-12 2001-01-02 Vanguard International Semiconductor Corporation CMOS device with deep current path for ESD protection
US6118640A (en) * 1999-02-17 2000-09-12 Pericom Semiconductor Corp. Actively-driven thin-oxide MOS transistor shunt for ESD protection of multiple independent supply busses in a mixed-signal chip
US6512662B1 (en) 1999-11-30 2003-01-28 Illinois Institute Of Technology Single structure all-direction ESD protection for integrated circuits
JP2001185686A (ja) * 1999-12-24 2001-07-06 Seiko Epson Corp 半導体集積装置
JP4619511B2 (ja) * 2000-09-29 2011-01-26 Ｏｋｉセミコンダクタ株式会社 電源電圧供給システムを備えた半導体装置及び電源電圧供給システムを備えた半導体装置に電源電圧を供給する電源電圧供給方法
US6750517B1 (en) 2000-11-06 2004-06-15 Taiwan Semiconductor Manufacturing Company Device layout to improve ESD robustness in deep submicron CMOS technology
US6537868B1 (en) * 2001-11-16 2003-03-25 Taiwan Semiconductor Manufacturing Company Method for forming novel low leakage current cascaded diode structure
US6704179B2 (en) 2002-02-01 2004-03-09 International Business Machines Corporation Automated hierarchical parameterized ESD network design and checking system
US6635931B1 (en) 2002-04-02 2003-10-21 Illinois Institute Of Technology Bonding pad-oriented all-mode ESD protection structure
US6757147B1 (en) 2002-05-03 2004-06-29 Pericom Semiconductor Corp. Pin-to-pin ESD-protection structure having cross-pin activation
EP1453092A3 (de) * 2003-02-27 2004-09-08 NEC Electronics Corporation Integrierte Halbleiterschaltung und Vorrichtung zum Entwurf einer derartigen Schaltung
TWI302031B (en) * 2003-07-16 2008-10-11 Realtek Semiconductor Corp Cascaded diode structure with deep n-well and method for making the same
KR100518593B1 (ko) * 2003-09-04 2005-10-04 삼성전자주식회사 다수개의 전원들을 사용하는 시스템-인-패키지(ｓｉｐ)에내장되는 정전기 방지 회로
US7112853B2 (en) * 2003-12-17 2006-09-26 Broadcom Corporation System for ESD protection with extra headroom in relatively low supply voltage integrated circuits
US7187527B2 (en) * 2004-09-02 2007-03-06 Macronix International Co., Ltd. Electrostatic discharge conduction device and mixed power integrated circuits using same
US7277263B2 (en) * 2004-09-08 2007-10-02 Texas Instruments Incorporated Local ESD protection for low-capacitance applications
US7439592B2 (en) * 2004-12-13 2008-10-21 Broadcom Corporation ESD protection for high voltage applications
US7505238B2 (en) * 2005-01-07 2009-03-17 Agnes Neves Woo ESD configuration for low parasitic capacitance I/O
CN100442510C (zh) * 2005-08-26 2008-12-10 联咏科技股份有限公司 考量电源启动顺序的准位移位器静电放电防护电路
JP2008147376A (ja) * 2006-12-08 2008-06-26 Toshiba Corp 半導体装置
US9069924B2 (en) 2011-12-29 2015-06-30 Taiwan Semiconductor Manufacturing Co., Ltd. ESD protection circuit cell
JP6595948B2 (ja) * 2016-05-10 2019-10-23 ルネサスエレクトロニクス株式会社 半導体装置
US10742026B2 (en) * 2018-02-07 2020-08-11 International Business Machines Corporation Electrostatic protection device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5077591A (en) * 1986-09-30 1991-12-31 Texas Instruments Incorporated Electrostatic discharge protection for semiconductor input devices
US5060037A (en) * 1987-04-03 1991-10-22 Texas Instruments Incorporated Output buffer with enhanced electrostatic discharge protection
US4990976A (en) * 1987-11-24 1991-02-05 Nec Corporation Semiconductor device including a field effect transistor having a protective diode between source and drain thereof
US4989057A (en) * 1988-05-26 1991-01-29 Texas Instruments Incorporated ESD protection for SOI circuits
US4870530A (en) * 1988-06-27 1989-09-26 Advanced Micro Devices, Inc. Electrostatic discharge protection circuitry for any two external pins of an I.C. package
US5274262A (en) * 1989-05-17 1993-12-28 David Sarnoff Research Center, Inc. SCR protection structure and circuit with reduced trigger voltage
JPH0369141A (ja) * 1989-08-08 1991-03-25 Nec Corp セミカスタム半導体集積回路
US5159518A (en) * 1990-01-17 1992-10-27 Vlsi Technology, Inc. Input protection circuit for CMOS devices
US5196981A (en) * 1990-12-28 1993-03-23 National Semiconductor Corporation ESD protection scheme
FR2672732B1 (fr) * 1991-02-12 1997-03-21 Sgs Thomson Microelectronics Structure monolithique comprenant deux ensembles de diodes de protection bidirectionnelles.
JP3375659B2 (ja) * 1991-03-28 2003-02-10 テキサス インスツルメンツ インコーポレイテツド 静電放電保護回路の形成方法
US5208719A (en) * 1991-08-20 1993-05-04 Vlsi Technology, Inc. Output pad electrostatic discharge protection circuit for mos devices
US5287241A (en) * 1992-02-04 1994-02-15 Cirrus Logic, Inc. Shunt circuit for electrostatic discharge protection
US5272097A (en) * 1992-04-07 1993-12-21 Philip Shiota Method for fabricating diodes for electrostatic discharge protection and voltage references
JPH0677415A (ja) * 1992-08-24 1994-03-18 Kawasaki Steel Corp 集積回路
JP2958202B2 (ja) * 1992-12-01 1999-10-06 シャープ株式会社 半導体装置
US5561577A (en) * 1994-02-02 1996-10-01 Hewlett-Packard Company ESD protection for IC's
JP2850801B2 (ja) * 1995-07-28 1999-01-27 日本電気株式会社 半導体素子

Also Published As

Publication number Publication date
JPH0855965A (ja) 1996-02-27
EP0688079B1 (de) 2000-03-15
EP0688079A2 (de) 1995-12-20
EP0688079A3 (de) 1997-01-15
US5616943A (en) 1997-04-01
DE69515560T2 (de) 2000-09-21
US6515839B1 (en) 2003-02-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: FIENER, J., PAT.-ANW., 87719 MINDELHEIM

8339 Ceased/non-payment of the annual fee
8327 Change in the person/name/address of the patent owner

Owner name: HYNIX SEMICONDUCTOR INC., ICHON, KYONGGI, KR