DE69507926D1 - Verfahren zur erzeugung eines kupferbildes auf einer aus elektrisch nichtleitendem material bestehenden platte mittels eines photolithographischen verfahrens - Google Patents

Verfahren zur erzeugung eines kupferbildes auf einer aus elektrisch nichtleitendem material bestehenden platte mittels eines photolithographischen verfahrens

Info

Publication number
DE69507926D1
DE69507926D1 DE69507926T DE69507926T DE69507926D1 DE 69507926 D1 DE69507926 D1 DE 69507926D1 DE 69507926 T DE69507926 T DE 69507926T DE 69507926 T DE69507926 T DE 69507926T DE 69507926 D1 DE69507926 D1 DE 69507926D1
Authority
DE
Germany
Prior art keywords
producing
conductive material
electrically non
plate containing
containing electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69507926T
Other languages
English (en)
Other versions
DE69507926T2 (de
Inventor
Der Sluis-Van Der Voort El Van
Sigrid Gelderland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE69507926D1 publication Critical patent/DE69507926D1/de
Publication of DE69507926T2 publication Critical patent/DE69507926T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/46—Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
    • H01J29/467—Control electrodes for flat display tubes, e.g. of the type covered by group H01J31/123
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
    • H01J9/148—Manufacture of electrodes or electrode systems of non-emitting electrodes of electron emission flat panels, e.g. gate electrodes, focusing electrodes or anode electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemically Coating (AREA)
  • Gas-Filled Discharge Tubes (AREA)
DE69507926T 1994-04-28 1995-04-06 Verfahren zur erzeugung eines kupferbildes auf einer aus elektrisch nichtleitendem material bestehenden platte mittels eines photolithographischen verfahrens Expired - Fee Related DE69507926T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP94201170 1994-04-28
PCT/IB1995/000239 WO1995030178A1 (en) 1994-04-28 1995-04-06 Method of photolithographically producing a copper pattern on a plate of an electrically insulating material

Publications (2)

Publication Number Publication Date
DE69507926D1 true DE69507926D1 (de) 1999-04-01
DE69507926T2 DE69507926T2 (de) 1999-09-16

Family

ID=8216828

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69507926T Expired - Fee Related DE69507926T2 (de) 1994-04-28 1995-04-06 Verfahren zur erzeugung eines kupferbildes auf einer aus elektrisch nichtleitendem material bestehenden platte mittels eines photolithographischen verfahrens

Country Status (5)

Country Link
US (1) US5738977A (de)
EP (1) EP0706678B1 (de)
JP (1) JPH08512171A (de)
DE (1) DE69507926T2 (de)
WO (1) WO1995030178A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6120588A (en) 1996-07-19 2000-09-19 E Ink Corporation Electronically addressable microencapsulated ink and display thereof
US6323989B1 (en) 1996-07-19 2001-11-27 E Ink Corporation Electrophoretic displays using nanoparticles
DE69636960C5 (de) * 1996-07-19 2015-07-30 E-Ink Corp. Elektronisch adressierbare mikroverkapselte Tinte
US6538801B2 (en) 1996-07-19 2003-03-25 E Ink Corporation Electrophoretic displays using nanoparticles
EP0941545B1 (de) * 1997-08-05 2006-01-11 Koninklijke Philips Electronics N.V. Verfahren zur herstellung mehrerer elektronischer bauteile
US7242513B2 (en) * 1997-08-28 2007-07-10 E Ink Corporation Encapsulated electrophoretic displays having a monolayer of capsules and materials and methods for making the same
US6704133B2 (en) 1998-03-18 2004-03-09 E-Ink Corporation Electro-optic display overlays and systems for addressing such displays
EP1064584B1 (de) 1998-03-18 2004-05-19 E Ink Corporation Elektrophoretische anzeige
US7075502B1 (en) 1998-04-10 2006-07-11 E Ink Corporation Full color reflective display with multichromatic sub-pixels
AU3987299A (en) 1998-05-12 1999-11-29 E-Ink Corporation Microencapsulated electrophoretic electrostatically-addressed media for drawing device applications
CA2336596A1 (en) 1998-07-08 2000-01-20 E Ink Corporation Methods for achieving improved color in microencapsulated electrophoretic devices
US6312304B1 (en) 1998-12-15 2001-11-06 E Ink Corporation Assembly of microencapsulated electronic displays
US6506438B2 (en) 1998-12-15 2003-01-14 E Ink Corporation Method for printing of transistor arrays on plastic substrates
US6531997B1 (en) 1999-04-30 2003-03-11 E Ink Corporation Methods for addressing electrophoretic displays
US6504524B1 (en) 2000-03-08 2003-01-07 E Ink Corporation Addressing methods for displays having zero time-average field
JP3756041B2 (ja) * 1999-05-27 2006-03-15 Ｈｏｙａ株式会社 多層プリント配線板の製造方法
EP1196814A1 (de) * 1999-07-21 2002-04-17 E Ink Corporation Verwendung eines speicherkondensators zur verbesserung der leistung einer, von einer aktiven matrix gesteuerten elektronischen anzeige
US7893435B2 (en) 2000-04-18 2011-02-22 E Ink Corporation Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough
US6825068B2 (en) 2000-04-18 2004-11-30 E Ink Corporation Process for fabricating thin film transistors
US6683333B2 (en) 2000-07-14 2004-01-27 E Ink Corporation Fabrication of electronic circuit elements using unpatterned semiconductor layers
SG108820A1 (en) * 2001-02-23 2005-02-28 Agency Science Tech & Res Method and apparatus for forming a metallic feature on a substrate
US6967640B2 (en) * 2001-07-27 2005-11-22 E Ink Corporation Microencapsulated electrophoretic display with integrated driver
SG106070A1 (en) * 2002-04-23 2004-09-30 Agency Science Tech & Res Method for elelctroless deposition of a metal layer on selected portions of a substrate
US7303854B2 (en) * 2003-02-14 2007-12-04 E.I. Du Pont De Nemours And Company Electrode-forming composition for field emission type of display device, and method using such a composition
DE102004061941B4 (de) * 2004-12-22 2014-02-13 AeroLas GmbH Aerostatische Lager- Lasertechnik Axial angetriebene Kolben-Zylinder-Einheit
JP2012222323A (ja) * 2011-04-14 2012-11-12 Canon Inc 貫通孔基板及びその製造方法
FR3004735B1 (fr) * 2013-04-23 2015-07-03 Dourdin Procede de vernissage de pieces metallisees
JP2017199803A (ja) * 2016-04-27 2017-11-02 日立マクセル株式会社 三次元成形回路部品
JP6341245B2 (ja) 2016-09-05 2018-06-13 大日本印刷株式会社 貫通電極基板の製造方法、貫通電極基板および半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3240684A (en) * 1962-02-21 1966-03-15 Burroughs Corp Method of etching rhodium plated metal layers and of making rhodium plated printed circuit boards
CA1232104A (en) * 1983-12-02 1988-02-02 Roy W. Klein Electroless nickel initiator solution and process for rejuvenation
US4814205A (en) * 1983-12-02 1989-03-21 Omi International Corporation Process for rejuvenation electroless nickel solution
NL9001528A (nl) * 1990-07-05 1992-02-03 Philips Nv Beeldweergeefinrichting van het dunne type.
US5235139A (en) * 1990-09-12 1993-08-10 Macdermid, Incorprated Method for fabricating printed circuits
US5314789A (en) * 1991-10-01 1994-05-24 Shipley Company Inc. Method of forming a relief image comprising amphoteric compositions
JPH05160551A (ja) * 1991-12-03 1993-06-25 Tokuyama Soda Co Ltd 電子部品実装窒化アルミニウム基板の製造方法
EP0562670B1 (de) * 1992-03-23 1999-06-02 Koninklijke Philips Electronics N.V. Verfahren zum Herstellen einer Platte aus einem elektrisch isolierenden Material mit einem Muster von Löchern oder Hohlräumen zum Gebrauch in Wiedergabeanordungen
EP0577187B1 (de) * 1992-06-29 1995-12-13 Koninklijke Philips Electronics N.V. Verfahren zum Bilden eines Metallmusters auf Glas durch ein stromloses Verfahren
US5474798A (en) * 1994-08-26 1995-12-12 Macdermid, Incorporated Method for the manufacture of printed circuit boards

Also Published As

Publication number Publication date
JPH08512171A (ja) 1996-12-17
DE69507926T2 (de) 1999-09-16
WO1995030178A1 (en) 1995-11-09
US5738977A (en) 1998-04-14
EP0706678A1 (de) 1996-04-17
EP0706678B1 (de) 1999-02-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8328 Change in the person/name/address of the agent

Representative=s name: VOLMER, G., DIPL.-ING., PAT.-ANW., 52066 AACHEN

8339 Ceased/non-payment of the annual fee