DE69432436T2 - Wiederverwendbarer chipträger für einbrennverfahren - Google Patents

Wiederverwendbarer chipträger für einbrennverfahren Download PDF

Info

Publication number
DE69432436T2
DE69432436T2 DE69432436T DE69432436T DE69432436T2 DE 69432436 T2 DE69432436 T2 DE 69432436T2 DE 69432436 T DE69432436 T DE 69432436T DE 69432436 T DE69432436 T DE 69432436T DE 69432436 T2 DE69432436 T2 DE 69432436T2
Authority
DE
Germany
Prior art keywords
chip carrier
burning process
reusable chip
reusable
burning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69432436T
Other languages
English (en)
Other versions
DE69432436D1 (de
Inventor
Rhea Posedel
Larry Lape
James Wrenn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aehr Test Systems Inc
Original Assignee
Aehr Test Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aehr Test Systems Inc filed Critical Aehr Test Systems Inc
Publication of DE69432436D1 publication Critical patent/DE69432436D1/de
Application granted granted Critical
Publication of DE69432436T2 publication Critical patent/DE69432436T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE69432436T 1993-07-09 1994-07-07 Wiederverwendbarer chipträger für einbrennverfahren Expired - Lifetime DE69432436T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/089,752 US5517125A (en) 1993-07-09 1993-07-09 Reusable die carrier for burn-in and burn-in process
PCT/US1994/007662 WO1995002196A1 (en) 1993-07-09 1994-07-07 Reusable die carrier for burn-in and burn-in process

Publications (2)

Publication Number Publication Date
DE69432436D1 DE69432436D1 (de) 2003-05-08
DE69432436T2 true DE69432436T2 (de) 2004-01-29

Family

ID=22219420

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69432436T Expired - Lifetime DE69432436T2 (de) 1993-07-09 1994-07-07 Wiederverwendbarer chipträger für einbrennverfahren

Country Status (7)

Country Link
US (1) US5517125A (de)
EP (1) EP0746772B1 (de)
JP (1) JPH09503577A (de)
KR (1) KR100385014B1 (de)
DE (1) DE69432436T2 (de)
SG (1) SG52417A1 (de)
WO (1) WO1995002196A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578934A (en) * 1991-06-04 1996-11-26 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
US6025732A (en) * 1993-07-09 2000-02-15 Aehr Test Systems Reusable die carrier for burn-in and burn-in process
KR100261935B1 (ko) 1994-04-18 2000-07-15 더블유. 브리얀 퍼네이 전자다이 자동배치 방법 및 장치
US20100065963A1 (en) * 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
JP3928979B2 (ja) * 1996-05-13 2007-06-13 イーア テスト システムズ バーンインおよびバーンイン法に使用する再使用可能なダイキャリヤ
KR100209017B1 (ko) * 1996-09-16 1999-07-15 윤종용 보조기억장치 테스트장치
DE19639685C1 (de) * 1996-09-26 1998-04-30 Siemens Ag Verfahren zum Testen von unbestückten Burn-in-Boards
US5869976A (en) * 1996-12-13 1999-02-09 Cirrus Logic, Inc. Fine alignment IC handler and method for assembling same
JP3722321B2 (ja) * 1997-01-10 2005-11-30 Ｊｓｒ株式会社 検査治具
US6072323A (en) * 1997-03-03 2000-06-06 Micron Technology, Inc. Temporary package, and method system for testing semiconductor dice having backside electrodes
US6025730A (en) * 1997-03-17 2000-02-15 Micron Technology, Inc. Direct connect interconnect for testing semiconductor dice and wafers
US6025728A (en) 1997-04-25 2000-02-15 Micron Technology, Inc. Semiconductor package with wire bond protective member
US5931685A (en) * 1997-06-02 1999-08-03 Micron Technology, Inc. Interconnect for making temporary electrical connections with bumped semiconductor components
US6137299A (en) * 1997-06-27 2000-10-24 International Business Machines Corporation Method and apparatus for testing integrated circuit chips
US6040702A (en) 1997-07-03 2000-03-21 Micron Technology, Inc. Carrier and system for testing bumped semiconductor components
EP0890843A3 (de) * 1997-07-07 2000-08-09 Schlumberger Technologies, Inc. Testsockelanordnung
US6377061B1 (en) * 1997-12-12 2002-04-23 Texas Instruments Incorporated Expanded lead pitch for semiconductor package and method of electrical testing
US6451624B1 (en) 1998-06-05 2002-09-17 Micron Technology, Inc. Stackable semiconductor package having conductive layer and insulating layers and method of fabrication
US6365977B1 (en) 1999-08-31 2002-04-02 International Business Machines Corporation Insulating interposer between two electronic components and process thereof
US6242933B1 (en) * 1999-10-04 2001-06-05 St Assembly Test Services Device probe socket forming part of a test head, interfacing between test head and a probe handler, used for device strip testing
US6476629B1 (en) * 2000-02-23 2002-11-05 Micron Technology, Inc. In-tray burn-in board for testing integrated circuit devices in situ on processing trays
KR100464917B1 (ko) * 2001-09-25 2005-01-06 정재민 간 기능 영상화를 위한 디설파이드 환원형 갈락토즈 결합혈청알부민 및 이를 포함한 방사성 동위원소 표지 화합물
US6859057B2 (en) * 2002-09-17 2005-02-22 Aehr Test Systems Die carrier
US7126228B2 (en) * 2003-04-23 2006-10-24 Micron Technology, Inc. Apparatus for processing semiconductor devices in a singulated form
US7733106B2 (en) * 2005-09-19 2010-06-08 Formfactor, Inc. Apparatus and method of testing singulated dies
US7683648B1 (en) * 2007-06-11 2010-03-23 Nvidia Corporation Integrated circuit socket and method of use for providing adjustable contact pitch
US8896010B2 (en) 2012-01-24 2014-11-25 Cooledge Lighting Inc. Wafer-level flip chip device packages and related methods
US20130309792A1 (en) * 2012-05-21 2013-11-21 Michael A. Tischler Light-emitting dies incorporating wavelength-conversion materials and related methods
US8466705B1 (en) 2012-09-27 2013-06-18 Exatron, Inc. System and method for analyzing electronic devices having a cab for holding electronic devices

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USH13H (en) * 1984-08-13 1986-01-07 At&T Bell Laboratories Connecting a flat-pack-packaged chip to a printed circuit board
US4859189A (en) * 1987-09-25 1989-08-22 Minnesota Mining And Manufacturing Company Multipurpose socket
US4969828A (en) * 1989-05-17 1990-11-13 Amp Incorporated Electrical socket for TAB IC's
US5127837A (en) * 1989-06-09 1992-07-07 Labinal Components And Systems, Inc. Electrical connectors and IC chip tester embodying same
US5123850A (en) * 1990-04-06 1992-06-23 Texas Instruments Incorporated Non-destructive burn-in test socket for integrated circuit die
JPH04162382A (ja) * 1990-10-25 1992-06-05 Canon Inc Ｉｃソケット
US5086269A (en) * 1991-03-08 1992-02-04 Hewlett-Packard Company Burn-in process and apparatus
US5176525A (en) * 1991-04-17 1993-01-05 Data I/O Corporation Modular socket apparatus
US5166607A (en) * 1991-05-31 1992-11-24 Vlsi Technology, Inc. Method and apparatus to heat the surface of a semiconductor die in a device during burn-in while withdrawing heat from device leads
US5245277A (en) * 1992-08-04 1993-09-14 Xilinx, Inc. Clamp for testing used integrated circuit devices
US5397245A (en) * 1993-10-29 1995-03-14 Texas Instruments Incorporated Non-destructive interconnect system for semiconductor devices

Also Published As

Publication number Publication date
DE69432436D1 (de) 2003-05-08
WO1995002196A1 (en) 1995-01-19
US5517125A (en) 1996-05-14
KR960704236A (ko) 1996-08-31
EP0746772B1 (de) 2003-04-02
KR100385014B1 (ko) 2003-08-14
JPH09503577A (ja) 1997-04-08
EP0746772A1 (de) 1996-12-11
EP0746772A4 (de) 1996-10-15
SG52417A1 (en) 1998-09-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition