DE69429228T2 - Vorrichtung zur Herstellung eines kristallorientierten Dünnfilms - Google Patents
Vorrichtung zur Herstellung eines kristallorientierten DünnfilmsInfo
- Publication number
- DE69429228T2 DE69429228T2 DE69429228T DE69429228T DE69429228T2 DE 69429228 T2 DE69429228 T2 DE 69429228T2 DE 69429228 T DE69429228 T DE 69429228T DE 69429228 T DE69429228 T DE 69429228T DE 69429228 T2 DE69429228 T2 DE 69429228T2
- Authority
- DE
- Germany
- Prior art keywords
- crystal
- producing
- thin film
- oriented thin
- oriented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/002—Controlling or regulating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP05239512A JP3125907B2 (ja) | 1993-09-27 | 1993-09-27 | 結晶配向薄膜製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69429228D1 DE69429228D1 (de) | 2002-01-10 |
DE69429228T2 true DE69429228T2 (de) | 2002-07-25 |
Family
ID=17045903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69429228T Expired - Fee Related DE69429228T2 (de) | 1993-09-27 | 1994-09-27 | Vorrichtung zur Herstellung eines kristallorientierten Dünnfilms |
Country Status (4)
Country | Link |
---|---|
US (1) | US5567288A (de) |
EP (1) | EP0645468B1 (de) |
JP (1) | JP3125907B2 (de) |
DE (1) | DE69429228T2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19711137C1 (de) * | 1997-03-07 | 1998-08-13 | Siemens Ag | Verfahren zum Aufbringen texturierter YSZ-Schichten durch Sputter-Beschichten |
CN100532635C (zh) * | 2007-01-30 | 2009-08-26 | 南京航空航天大学 | 镁合金表面辉光等离子沉积耐蚀合金层方法 |
DE102007046260A1 (de) * | 2007-09-26 | 2009-04-09 | Uhde Gmbh | Verfahren zur Reinigung des Rohgases aus einer Feststoffvergasung |
CN102634768B (zh) * | 2012-03-31 | 2014-06-11 | 浙江金徕镀膜有限公司 | 一种镀膜工艺中使用的基板固定装置 |
US11664207B2 (en) * | 2018-08-10 | 2023-05-30 | Tokyo Electron Limited | Film-forming apparatus, film-forming system, and film-forming method |
CN111041437A (zh) * | 2019-12-04 | 2020-04-21 | 山东科技大学 | 一种溅射沉积倾斜c轴压电薄膜的辅助装置 |
DE102020119875A1 (de) * | 2020-07-28 | 2022-02-03 | Technische Universität Darmstadt, Körperschaft des öffentlichen Rechts | Vorrichtung und Verfahren zum Führen geladener Teilchen |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3530057A (en) * | 1967-05-29 | 1970-09-22 | Nat Res Corp | Sputtering |
US3897325A (en) * | 1972-10-20 | 1975-07-29 | Nippon Electric Varian Ltd | Low temperature sputtering device |
US4297189A (en) * | 1980-06-27 | 1981-10-27 | Rockwell International Corporation | Deposition of ordered crystalline films |
JPS57100627A (en) * | 1980-12-12 | 1982-06-22 | Teijin Ltd | Manufacture of vertical magnetic recording medium |
DE3801309A1 (de) * | 1988-01-19 | 1989-07-27 | Leybold Ag | Einrichtung fuer die regelung der targetgleichspannung und der biasgleichspannung von sputteranlagen |
CZ278295B6 (en) * | 1989-08-14 | 1993-11-17 | Fyzikalni Ustav Avcr | Process of sputtering layers and apparatus for making the same |
US5114556A (en) * | 1989-12-27 | 1992-05-19 | Machine Technology, Inc. | Deposition apparatus and method for enhancing step coverage and planarization on semiconductor wafers |
-
1993
- 1993-09-27 JP JP05239512A patent/JP3125907B2/ja not_active Expired - Lifetime
-
1994
- 1994-09-27 EP EP94307036A patent/EP0645468B1/de not_active Expired - Lifetime
- 1994-09-27 DE DE69429228T patent/DE69429228T2/de not_active Expired - Fee Related
- 1994-09-27 US US08/313,339 patent/US5567288A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3125907B2 (ja) | 2001-01-22 |
JPH0797293A (ja) | 1995-04-11 |
DE69429228D1 (de) | 2002-01-10 |
EP0645468A1 (de) | 1995-03-29 |
EP0645468B1 (de) | 2001-11-28 |
US5567288A (en) | 1996-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |