DE69424186T2 - Imprägniertes oder beschichtetes substrat mit flexibler epoxidzusammensetzung - Google Patents

Imprägniertes oder beschichtetes substrat mit flexibler epoxidzusammensetzung

Info

Publication number
DE69424186T2
DE69424186T2 DE1994624186 DE69424186T DE69424186T2 DE 69424186 T2 DE69424186 T2 DE 69424186T2 DE 1994624186 DE1994624186 DE 1994624186 DE 69424186 T DE69424186 T DE 69424186T DE 69424186 T2 DE69424186 T2 DE 69424186T2
Authority
DE
Germany
Prior art keywords
impregnated
coated substrate
epoxy composition
flexible epoxy
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1994624186
Other languages
English (en)
Other versions
DE69424186D1 (de
Inventor
Kevin E Kinzer
Lowell W Holland
Krishnamurthy Sridhar
James N Kellen
Richard W Pribnow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of DE69424186D1 publication Critical patent/DE69424186D1/de
Application granted granted Critical
Publication of DE69424186T2 publication Critical patent/DE69424186T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/145—Compounds containing one epoxy group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/205—Adhesives in the form of films or foils characterised by their carriers characterised by the backing impregnating composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
DE1994624186 1994-02-04 1994-12-13 Imprägniertes oder beschichtetes substrat mit flexibler epoxidzusammensetzung Expired - Fee Related DE69424186T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/191,601 US5667893A (en) 1992-10-09 1994-02-04 Substrate coated or impregnated with flexible epoxy composition
PCT/US1994/014346 WO1995021207A1 (en) 1994-02-04 1994-12-13 Substrate coated or impregnated with flexible epoxy composition

Publications (2)

Publication Number Publication Date
DE69424186D1 DE69424186D1 (de) 2000-05-31
DE69424186T2 true DE69424186T2 (de) 2000-12-21

Family

ID=22706127

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1994624186 Expired - Fee Related DE69424186T2 (de) 1994-02-04 1994-12-13 Imprägniertes oder beschichtetes substrat mit flexibler epoxidzusammensetzung

Country Status (6)

Country Link
US (1) US5667893A (de)
EP (1) EP0742804B1 (de)
JP (1) JPH09508652A (de)
CA (1) CA2181256A1 (de)
DE (1) DE69424186T2 (de)
WO (1) WO1995021207A1 (de)

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US7841982B2 (en) * 1995-06-22 2010-11-30 Techniscan, Inc. Apparatus and method for imaging objects with wavefields
WO1998012667A2 (en) * 1996-08-29 1998-03-26 Johnson Steven A Wavefield imaging using inverse scattering techniques
AU711786B2 (en) * 1997-05-16 1999-10-21 National Starch And Chemical Investment Holding Corporation Reactive radiation- or thermally-initiated cationically- curable epoxide monomers and compositions made from those monomers
US6020508A (en) * 1997-05-16 2000-02-01 National Starch And Chemical Investment Holding Corporation Radiation- or thermally-initiated cationically-curable epoxide compounds and compositions made from those compounds
US6235363B1 (en) 1998-05-06 2001-05-22 Avery Dennison Corporation Composite construction containing barrier layer
JP2001279215A (ja) * 2000-03-24 2001-10-10 Three M Innovative Properties Co 異方導電性接着剤組成物およびそれから形成された異方導電性接着フィルム
US6699351B2 (en) 2000-03-24 2004-03-02 3M Innovative Properties Company Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
US6432530B1 (en) 2000-08-31 2002-08-13 3M Innovative Properties Company Solventless plasticizer-resistant vinyl electrical tape
US7053133B2 (en) * 2001-05-29 2006-05-30 Hiroaki Yamaguchi Ultraviolet activatable adhesive film
US20050256230A1 (en) * 2002-04-01 2005-11-17 Hiroaki Yamaguchi Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
JP4549621B2 (ja) * 2002-12-02 2010-09-22 日東電工株式会社 電池用セパレータのための架橋性ポリマー担持多孔質フィルムとそれを用いた電池の製造方法
US7771360B2 (en) * 2003-04-09 2010-08-10 Techniscan, Inc. Breast scanning system
CN1886438A (zh) * 2003-12-02 2006-12-27 帝斯曼知识产权资产管理有限公司 阻燃可辐射固化组合物
JP4403829B2 (ja) * 2004-02-27 2010-01-27 株式会社日立製作所 回転電機，電気絶縁線輪及びそれに用いるエポキシ樹脂組成物
US7169462B1 (en) 2004-03-01 2007-01-30 Laticrete International, Inc. Waterproofing membrane
US7699783B2 (en) * 2004-04-08 2010-04-20 Techniscan, Inc. Method for imaging and treating a breast
ES2293306T3 (es) * 2004-05-28 2008-03-16 Albemarle Corporation Poliuretanos retardantes de llama y los aditivos correspondientes.
WO2008143901A2 (en) * 2007-05-15 2008-11-27 Techniscan, Inc. Improved imaging system
US8765217B2 (en) 2008-11-04 2014-07-01 Entrotech, Inc. Method for continuous production of (meth)acrylate syrup and adhesives therefrom
US8329079B2 (en) 2009-04-20 2012-12-11 Entrochem, Inc. Method and apparatus for continuous production of partially polymerized compositions and polymers therefrom
EP2915822A1 (de) * 2014-03-06 2015-09-09 Université de Haute Alsace Lichtinduziertes freiradikalisches und/oder kationisches Photopolymerisationsverfahren

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Also Published As

Publication number Publication date
EP0742804B1 (de) 2000-04-26
US5667893A (en) 1997-09-16
WO1995021207A1 (en) 1995-08-10
EP0742804A1 (de) 1996-11-20
DE69424186D1 (de) 2000-05-31
JPH09508652A (ja) 1997-09-02
CA2181256A1 (en) 1995-08-10

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee