DE69422559D1 - Ohmische Elektrode und Verfahren für ihre Herstellung - Google Patents
Ohmische Elektrode und Verfahren für ihre HerstellungInfo
- Publication number
- DE69422559D1 DE69422559D1 DE69422559T DE69422559T DE69422559D1 DE 69422559 D1 DE69422559 D1 DE 69422559D1 DE 69422559 T DE69422559 T DE 69422559T DE 69422559 T DE69422559 T DE 69422559T DE 69422559 D1 DE69422559 D1 DE 69422559D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- ohmic electrode
- ohmic
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0405—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising semiconducting carbon, e.g. diamond, diamond-like carbon
- H01L21/0425—Making electrodes
- H01L21/043—Ohmic electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/34—Materials of the light emitting region containing only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22352893A JP3304541B2 (ja) | 1993-09-08 | 1993-09-08 | オーミック電極の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69422559D1 true DE69422559D1 (de) | 2000-02-17 |
DE69422559T2 DE69422559T2 (de) | 2000-09-14 |
Family
ID=16799567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69422559T Expired - Fee Related DE69422559T2 (de) | 1993-09-08 | 1994-09-06 | Ohmische Elektrode und Verfahren für ihre Herstellung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5668382A (de) |
EP (1) | EP0642169B1 (de) |
JP (1) | JP3304541B2 (de) |
DE (1) | DE69422559T2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5929523A (en) * | 1996-03-07 | 1999-07-27 | 3C Semiconductor Corporation | Os rectifying Schottky and ohmic junction and W/WC/TiC ohmic contacts on SiC |
US6388272B1 (en) | 1996-03-07 | 2002-05-14 | Caldus Semiconductor, Inc. | W/WC/TAC ohmic and rectifying contacts on SiC |
KR100563264B1 (ko) * | 1998-12-21 | 2006-05-25 | 재단법인 포항산업과학연구원 | 내구성이 향상된 탄성표면파 필터의 전극제조방법 |
US6955978B1 (en) * | 2001-12-20 | 2005-10-18 | Fairchild Semiconductor Corporation | Uniform contact |
JP2005317676A (ja) * | 2004-04-27 | 2005-11-10 | Sony Corp | 半導体発光素子、半導体発光装置及び半導体発光素子の製造方法 |
US7964884B2 (en) * | 2004-10-22 | 2011-06-21 | Seoul Opto Device Co., Ltd. | GaN compound semiconductor light emitting element and method of manufacturing the same |
WO2006087937A1 (ja) * | 2005-02-16 | 2006-08-24 | National Institute For Materials Science | ダイヤモンド半導体整流素子 |
CN101771114B (zh) * | 2009-01-04 | 2012-03-07 | 厦门市三安光电科技有限公司 | 一种具有复合堆叠式阻挡层金属结构的垂直发光二极管及其制备方法 |
US8933462B2 (en) * | 2011-12-21 | 2015-01-13 | Akhan Semiconductor, Inc. | Method of fabricating diamond semiconductor and diamond semiconductor formed according to the method |
JP6444718B2 (ja) | 2014-12-15 | 2018-12-26 | 株式会社東芝 | 半導体装置 |
CN116914558B (zh) * | 2023-09-13 | 2023-12-19 | 苏州长光华芯光电技术股份有限公司 | 一种半导体激光器接触电极及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2671259B2 (ja) * | 1988-03-28 | 1997-10-29 | 住友電気工業株式会社 | ショットキー接合半導体装置 |
JPH02260470A (ja) * | 1989-03-30 | 1990-10-23 | Sumitomo Electric Ind Ltd | 発光素子 |
US5055424A (en) * | 1989-06-29 | 1991-10-08 | The United States Of America As Represented By The Secretary Of The Navy | Method for fabricating ohmic contacts on semiconducting diamond |
-
1993
- 1993-09-08 JP JP22352893A patent/JP3304541B2/ja not_active Expired - Fee Related
-
1994
- 1994-09-06 EP EP94113944A patent/EP0642169B1/de not_active Expired - Lifetime
- 1994-09-06 DE DE69422559T patent/DE69422559T2/de not_active Expired - Fee Related
-
1996
- 1996-06-28 US US08/668,525 patent/US5668382A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5668382A (en) | 1997-09-16 |
DE69422559T2 (de) | 2000-09-14 |
EP0642169B1 (de) | 2000-01-12 |
EP0642169A1 (de) | 1995-03-08 |
JP3304541B2 (ja) | 2002-07-22 |
JPH0778784A (ja) | 1995-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: GROSSE, BOCKHORNI, SCHUMACHER, 81476 MUENCHEN |
|
8339 | Ceased/non-payment of the annual fee |