DE69419775D1 - Bildsensormatrix für infrarote strahlung mit kompositsensoren die jedes pixel formen - Google Patents

Bildsensormatrix für infrarote strahlung mit kompositsensoren die jedes pixel formen

Info

Publication number
DE69419775D1
DE69419775D1 DE69419775T DE69419775T DE69419775D1 DE 69419775 D1 DE69419775 D1 DE 69419775D1 DE 69419775 T DE69419775 T DE 69419775T DE 69419775 T DE69419775 T DE 69419775T DE 69419775 D1 DE69419775 D1 DE 69419775D1
Authority
DE
Germany
Prior art keywords
pixel
shape
image sensor
infrared radiation
sensor matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69419775T
Other languages
English (en)
Other versions
DE69419775T2 (de
Inventor
Roland Wood
Robert Higashi
Michael Rhodes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell Inc
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Application granted granted Critical
Publication of DE69419775D1 publication Critical patent/DE69419775D1/de
Publication of DE69419775T2 publication Critical patent/DE69419775T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
DE69419775T 1993-11-17 1994-11-14 Bildsensormatrix für infrarote strahlung mit kompositsensoren die jedes pixel formen Expired - Lifetime DE69419775T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/153,066 US5449910A (en) 1993-11-17 1993-11-17 Infrared radiation imaging array with compound sensors forming each pixel
PCT/US1994/013002 WO1995014218A1 (en) 1993-11-17 1994-11-14 Infrared radiation imaging array with compound sensors forming each pixel

Publications (2)

Publication Number Publication Date
DE69419775D1 true DE69419775D1 (de) 1999-09-02
DE69419775T2 DE69419775T2 (de) 1999-12-23

Family

ID=22545634

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69419775T Expired - Lifetime DE69419775T2 (de) 1993-11-17 1994-11-14 Bildsensormatrix für infrarote strahlung mit kompositsensoren die jedes pixel formen

Country Status (6)

Country Link
US (1) US5449910A (de)
EP (1) EP0733199B1 (de)
JP (1) JPH09505400A (de)
CA (1) CA2175487C (de)
DE (1) DE69419775T2 (de)
WO (1) WO1995014218A1 (de)

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DE19645036B4 (de) * 1996-10-31 2006-04-20 Siemens Ag Pyroelektrische Halbleiter-Detektoreinrichtung für Infrarotstrahlung und Verfahren zur Herstellung
US6268883B1 (en) * 1997-05-30 2001-07-31 California Institute Of Technology High speed infrared imaging system and method
US6144030A (en) * 1997-10-28 2000-11-07 Raytheon Company Advanced small pixel high fill factor uncooled focal plane array
US6521477B1 (en) 2000-02-02 2003-02-18 Raytheon Company Vacuum package fabrication of integrated circuit components
US6479320B1 (en) 2000-02-02 2002-11-12 Raytheon Company Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
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US6541772B2 (en) 2000-12-26 2003-04-01 Honeywell International Inc. Microbolometer operating system
US6559447B2 (en) 2000-12-26 2003-05-06 Honeywell International Inc. Lightweight infrared camera
US7365326B2 (en) * 2000-12-26 2008-04-29 Honeywell International Inc. Camera having distortion correction
US6777681B1 (en) 2001-04-25 2004-08-17 Raytheon Company Infrared detector with amorphous silicon detector elements, and a method of making it
US6958478B2 (en) 2003-05-19 2005-10-25 Indigo Systems Corporation Microbolometer detector with high fill factor and transducers having enhanced thermal isolation
US7170059B2 (en) * 2003-10-03 2007-01-30 Wood Roland A Planar thermal array
US7351972B2 (en) * 2004-08-19 2008-04-01 Drs Sensors & Targeting Systems, Inc. Infrared radiation image having sub-pixelization and detector interdigitation
CN100453986C (zh) * 2005-09-06 2009-01-21 中国科学技术大学 光学读出红外传感器
US20070146720A1 (en) * 2005-12-23 2007-06-28 Honeywell International Inc. Spectrometer method and apparatus for near infrared to terahertz wavelengths
US7462831B2 (en) * 2006-01-26 2008-12-09 L-3 Communications Corporation Systems and methods for bonding
US7459686B2 (en) * 2006-01-26 2008-12-02 L-3 Communications Corporation Systems and methods for integrating focal plane arrays
US7655909B2 (en) * 2006-01-26 2010-02-02 L-3 Communications Corporation Infrared detector elements and methods of forming same
US7501626B2 (en) * 2006-06-02 2009-03-10 Honeywell International Inc. Micromechanical thermal sensor
US7718965B1 (en) 2006-08-03 2010-05-18 L-3 Communications Corporation Microbolometer infrared detector elements and methods for forming same
JP2008039695A (ja) * 2006-08-09 2008-02-21 Nippon Ceramic Co Ltd サーモパイルアレイ温度検出器
US8478480B2 (en) * 2006-10-27 2013-07-02 International Electronic Machines Corp. Vehicle evaluation using infrared data
US8153980B1 (en) 2006-11-30 2012-04-10 L-3 Communications Corp. Color correction for radiation detectors
CN100453443C (zh) * 2006-12-01 2009-01-21 中国科学技术大学 玻璃基底光学读出红外传感器
US7750301B1 (en) 2007-10-02 2010-07-06 Flir Systems, Inc. Microbolometer optical cavity tuning and calibration systems and methods
US20090114822A1 (en) * 2007-11-06 2009-05-07 Honeywell International Inc. Terahertz dispersive spectrometer system
US8981296B2 (en) 2007-11-06 2015-03-17 Honeywell International Inc. Terahertz dispersive spectrometer system
JP2009139111A (ja) * 2007-12-03 2009-06-25 Toyota Central R&D Labs Inc 熱型赤外線センサ、及び熱型赤外線イメージセンサ
US7898498B2 (en) * 2008-03-20 2011-03-01 Honeywell International Inc. Transducer for high-frequency antenna coupling and related apparatus and method
US8451176B2 (en) * 2009-06-11 2013-05-28 Honeywell International Inc. Method for achieving intrinsic safety compliance in wireless devices using isolated overlapping grounds and related apparatus
US9658111B2 (en) 2009-10-09 2017-05-23 Flir Systems, Inc. Microbolometer contact systems and methods
US8729474B1 (en) 2009-10-09 2014-05-20 Flir Systems, Inc. Microbolometer contact systems and methods
US8765514B1 (en) 2010-11-12 2014-07-01 L-3 Communications Corp. Transitioned film growth for conductive semiconductor materials
DE102011054739A1 (de) * 2011-10-24 2013-04-25 O-Flexx Technologies Gmbh Thermoelement und Herstellungsverfahren
US9438825B2 (en) * 2012-12-10 2016-09-06 Fluke Corporation Infrared sensor amplification techniques for thermal imaging
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EP0649517B1 (de) * 1992-07-08 1997-08-27 Honeywell Inc. Mikrostruktur-entwurf für hohe ir - empfindlichkeit

Also Published As

Publication number Publication date
EP0733199A1 (de) 1996-09-25
EP0733199B1 (de) 1999-07-28
CA2175487C (en) 2002-07-16
CA2175487A1 (en) 1995-05-26
US5449910A (en) 1995-09-12
WO1995014218A1 (en) 1995-05-26
JPH09505400A (ja) 1997-05-27
DE69419775T2 (de) 1999-12-23

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