DE69417933T2 - Verfahren und Vorrichtung zur Herstellung von Halbleitervorrichtungen - Google Patents

Verfahren und Vorrichtung zur Herstellung von Halbleitervorrichtungen

Info

Publication number
DE69417933T2
DE69417933T2 DE69417933T DE69417933T DE69417933T2 DE 69417933 T2 DE69417933 T2 DE 69417933T2 DE 69417933 T DE69417933 T DE 69417933T DE 69417933 T DE69417933 T DE 69417933T DE 69417933 T2 DE69417933 T2 DE 69417933T2
Authority
DE
Germany
Prior art keywords
semiconductor devices
manufacturing semiconductor
manufacturing
devices
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69417933T
Other languages
English (en)
Other versions
DE69417933D1 (de
Inventor
Shunsuke Inoue
Junichi Hoshi
Takanori Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69417933D1 publication Critical patent/DE69417933D1/de
Application granted granted Critical
Publication of DE69417933T2 publication Critical patent/DE69417933T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
DE69417933T 1993-01-29 1994-01-27 Verfahren und Vorrichtung zur Herstellung von Halbleitervorrichtungen Expired - Fee Related DE69417933T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03244293A JP3402644B2 (ja) 1993-01-29 1993-01-29 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
DE69417933D1 DE69417933D1 (de) 1999-05-27
DE69417933T2 true DE69417933T2 (de) 1999-10-07

Family

ID=12359082

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69417933T Expired - Fee Related DE69417933T2 (de) 1993-01-29 1994-01-27 Verfahren und Vorrichtung zur Herstellung von Halbleitervorrichtungen

Country Status (4)

Country Link
US (1) US5468344A (de)
EP (1) EP0609069B1 (de)
JP (1) JP3402644B2 (de)
DE (1) DE69417933T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19621399A1 (de) * 1996-05-28 1997-12-04 Siemens Ag Verfahren zum Ätzen eines Halbleitersubstrats sowie Ätzanlage
JP2001338878A (ja) * 2000-03-21 2001-12-07 Sharp Corp サセプタおよび表面処理方法
US20040099375A1 (en) * 2002-11-21 2004-05-27 Yanghua He Edge-contact ring for a wafer pedestal
JP4817324B2 (ja) * 2007-02-05 2011-11-16 Ｏｋｉセミコンダクタ株式会社 半導体素子の製造方法
JP2012028790A (ja) * 2011-08-19 2012-02-09 Renesas Electronics Corp 半導体装置
US8999850B2 (en) * 2011-12-29 2015-04-07 Stmicroelectronics Pte Ltd Methods and apparatus for TMAH etching
JP6314477B2 (ja) 2013-12-26 2018-04-25 ソニー株式会社 電子デバイス
ES2706877T3 (es) 2014-11-13 2019-04-01 Gerresheimer Glas Gmbh Filtro de partículas de máquina para conformar vidrio, unidad de émbolo, cabeza de soplado, soporte de cabeza de soplado y máquina para conformar vidrio adaptada a dicho filtro o que lo comprende

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473455A (en) * 1981-12-21 1984-09-25 At&T Bell Laboratories Wafer holding apparatus and method
JPS609129A (ja) * 1983-06-29 1985-01-18 Fujitsu Ltd ウエツト処理装置
SU1257730A1 (ru) * 1984-08-10 1986-09-15 Московский Институт Радиотехники,Электроники И Автоматики Устройство дл жидкостной обработки полупроводниковых пластин
JPH0451474Y2 (de) * 1986-05-15 1992-12-03
US5105556A (en) * 1987-08-12 1992-04-21 Hitachi, Ltd. Vapor washing process and apparatus
AT389959B (de) * 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
GB8928773D0 (en) * 1989-12-20 1990-02-28 Emi Plc Thorn Fountain etch system
KR0157990B1 (ko) * 1990-06-18 1999-02-01 이노우에 키요시 처리 장치

Also Published As

Publication number Publication date
JP3402644B2 (ja) 2003-05-06
EP0609069B1 (de) 1999-04-21
US5468344A (en) 1995-11-21
EP0609069A1 (de) 1994-08-03
DE69417933D1 (de) 1999-05-27
JPH06232404A (ja) 1994-08-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee