DE69412769D1 - Kapazitiver Sensor und Verfahren zur Herstellung - Google Patents

Kapazitiver Sensor und Verfahren zur Herstellung

Info

Publication number
DE69412769D1
DE69412769D1 DE69412769T DE69412769T DE69412769D1 DE 69412769 D1 DE69412769 D1 DE 69412769D1 DE 69412769 T DE69412769 T DE 69412769T DE 69412769 T DE69412769 T DE 69412769T DE 69412769 D1 DE69412769 D1 DE 69412769D1
Authority
DE
Germany
Prior art keywords
manufacturing
capacitive sensor
capacitive
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69412769T
Other languages
English (en)
Other versions
DE69412769T2 (de
Inventor
Shigenori Hayashi
Takeshi Kamada
Hideo Torii
Takashi Hirao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69412769D1 publication Critical patent/DE69412769D1/de
Publication of DE69412769T2 publication Critical patent/DE69412769T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G01D5/241—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
    • G01D5/2417—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying separation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
DE69412769T 1993-12-07 1994-12-02 Kapazitiver Sensor und Verfahren zur Herstellung Expired - Fee Related DE69412769T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30618593 1993-12-07
JP30618493 1993-12-07

Publications (2)

Publication Number Publication Date
DE69412769D1 true DE69412769D1 (de) 1998-10-01
DE69412769T2 DE69412769T2 (de) 1999-01-14

Family

ID=26564600

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69412769T Expired - Fee Related DE69412769T2 (de) 1993-12-07 1994-12-02 Kapazitiver Sensor und Verfahren zur Herstellung

Country Status (5)

Country Link
US (2) US5507080A (de)
EP (1) EP0657718B1 (de)
KR (1) KR100230891B1 (de)
CN (1) CN1083104C (de)
DE (1) DE69412769T2 (de)

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* Cited by examiner, † Cited by third party
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US5760593A (en) * 1996-02-14 1998-06-02 Bicc Public Limited Company Gap measurement device
US20040099061A1 (en) * 1997-12-22 2004-05-27 Mks Instruments Pressure sensor for detecting small pressure differences and low pressures
US6156585A (en) 1998-02-02 2000-12-05 Motorola, Inc. Semiconductor component and method of manufacture
US6690569B1 (en) 1999-12-08 2004-02-10 Sensirion A/G Capacitive sensor
US6591685B2 (en) * 2000-03-10 2003-07-15 W.E.T. Automotive Systems Ag Pressure sensor
US6708392B1 (en) 2000-04-17 2004-03-23 The United States Of America As Represented By The Secretary Of The Army Method of fabricating uncooled IR detector and arrays using colossal magneto-resistive materials and rock salt structure material substrates
US20030121796A1 (en) * 2001-11-26 2003-07-03 Siegele Stephen H Generation and distribution of molecular fluorine within a fabrication facility
US20030183888A1 (en) * 2002-03-28 2003-10-02 Eyal Bar-Sadeh Corrugated diaphragm
CN100416472C (zh) * 2002-07-16 2008-09-03 阿尔卑斯电气株式会社 静电电容式坐标输入装置
US7285844B2 (en) * 2003-06-10 2007-10-23 California Institute Of Technology Multiple internal seal right micro-electro-mechanical system vacuum package
DE102004002825A1 (de) * 2004-01-12 2005-08-04 E.G.O. Elektro-Gerätebau GmbH Bedieneinrichtung mit einem kapazitiven Sensorelement und Elektrogerät mit einer solchen Bedieneinrichtung
DE102004005952A1 (de) * 2004-02-02 2005-08-25 E.G.O. Elektro-Gerätebau GmbH Bedieneinrichtung für ein Elektrogerät mit einem Bedien-Feld und einem Sensorelement darunter sowie Verfahren zum Betrieb der Bedieneinrichtung
US7201057B2 (en) * 2004-09-30 2007-04-10 Mks Instruments, Inc. High-temperature reduced size manometer
US7137301B2 (en) * 2004-10-07 2006-11-21 Mks Instruments, Inc. Method and apparatus for forming a reference pressure within a chamber of a capacitance sensor
US7141447B2 (en) * 2004-10-07 2006-11-28 Mks Instruments, Inc. Method of forming a seal between a housing and a diaphragm of a capacitance sensor
US7204150B2 (en) * 2005-01-14 2007-04-17 Mks Instruments, Inc. Turbo sump for use with capacitive pressure sensor
US20080011297A1 (en) * 2006-06-30 2008-01-17 Scott Thomas Mazar Monitoring physiologic conditions via transtracheal measurement of respiratory parameters
KR100726935B1 (ko) * 2006-08-30 2007-06-11 레시너코리아 주식회사 정전용량형 누수 감지 센서
EP2229967B1 (de) * 2009-03-17 2020-04-15 F.Hoffmann-La Roche Ag Kanülenanordnung und ambulantes Infusionssystem mit Drucksensor aus koplanaren Schichtstapeln
DE102010045008B4 (de) 2010-09-10 2013-02-28 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Kapazitiver Abstandssensor
EP2565635B1 (de) 2011-09-02 2017-11-15 Sensirion AG Sensorchip und Verfahren zur Herstellung eines Sensorchips
KR20130099300A (ko) * 2012-02-29 2013-09-06 (주)유민에쓰티 정전용량형 수위감지센서
FI125447B (en) * 2013-06-04 2015-10-15 Murata Manufacturing Co Improved pressure sensor
US20160302729A1 (en) * 2013-12-11 2016-10-20 The Board Of Regents Of The University Of Texas System Devices and methods for parameter measurement
CN104914134B (zh) * 2015-03-09 2017-12-19 北京微能高芯科技有限公司 基于摩擦电的聚合物辨识传感器及其制作方法
DE102015119272A1 (de) * 2015-11-09 2017-05-11 Endress+Hauser Gmbh+Co. Kg Kapazitiver Drucksensor und Verfahren zu dessen Herstellung
JP6908391B2 (ja) * 2017-02-17 2021-07-28 アズビル株式会社 静電容量型圧力センサ
KR102574448B1 (ko) * 2020-08-26 2023-09-01 연세대학교 산학협력단 광반응성 복합 소재를 이용한 미세 전자 기계 시스템 기반 정전식 감응 센서 및 이의 센싱 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4530029A (en) * 1984-03-12 1985-07-16 United Technologies Corporation Capacitive pressure sensor with low parasitic capacitance
DE3635462A1 (de) * 1985-10-21 1987-04-23 Sharp Kk Feldeffekt-drucksensor
JPH0685450B2 (ja) * 1986-01-13 1994-10-26 松下電器産業株式会社 強誘電体薄膜素子
JPH0750789B2 (ja) * 1986-07-18 1995-05-31 日産自動車株式会社 半導体圧力変換装置の製造方法
FR2610406B1 (fr) * 1987-02-03 1989-09-08 Pierre Bernard Capteur capacitif de pression
US4823230A (en) * 1988-03-04 1989-04-18 General Electric Company Pressure transducer
US4951174A (en) * 1988-12-30 1990-08-21 United Technologies Corporation Capacitive pressure sensor with third encircling plate
JPH0748566B2 (ja) * 1989-09-27 1995-05-24 山武ハネウエル株式会社 加速度センサおよびその製造方法
US5050034A (en) * 1990-01-22 1991-09-17 Endress U. Hauser Gmbh U. Co. Pressure sensor and method of manufacturing same
JPH04143627A (ja) * 1990-10-05 1992-05-18 Yamatake Honeywell Co Ltd 静電容量式圧力センサおよびその製造方法
US5134886A (en) * 1991-04-16 1992-08-04 Ball Kenneth H Capacitive pressure transducer for use in respirator apparatus
JPH05283756A (ja) * 1992-03-31 1993-10-29 Murata Mfg Co Ltd 強誘電体薄膜素子

Also Published As

Publication number Publication date
EP0657718B1 (de) 1998-08-26
US5507080A (en) 1996-04-16
CN1083104C (zh) 2002-04-17
EP0657718A1 (de) 1995-06-14
DE69412769T2 (de) 1999-01-14
KR950021797A (ko) 1995-07-26
US5719740A (en) 1998-02-17
KR100230891B1 (ko) 1999-11-15
CN1107970A (zh) 1995-09-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee