DE69404706D1 - Verfahren zur Überwachung stromloser Metallabscheidungsbäder - Google Patents

Verfahren zur Überwachung stromloser Metallabscheidungsbäder

Info

Publication number
DE69404706D1
DE69404706D1 DE69404706T DE69404706T DE69404706D1 DE 69404706 D1 DE69404706 D1 DE 69404706D1 DE 69404706 T DE69404706 T DE 69404706T DE 69404706 T DE69404706 T DE 69404706T DE 69404706 D1 DE69404706 D1 DE 69404706D1
Authority
DE
Germany
Prior art keywords
metal plating
plating baths
electroless metal
monitoring
monitoring electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69404706T
Other languages
English (en)
Other versions
DE69404706T2 (de
Inventor
Alfred Joseph Grady
Sudarshan Lal
Mary Jane Mitchell
Yutaka Okinaka
Craig Gordon Smith
Harvey Stewart Trop
Chwan-Tsann Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of DE69404706D1 publication Critical patent/DE69404706D1/de
Application granted granted Critical
Publication of DE69404706T2 publication Critical patent/DE69404706T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Investigating Or Analysing Materials By The Use Of Chemical Reactions (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE69404706T 1993-03-10 1994-03-02 Verfahren zur Überwachung stromloser Metallabscheidungsbäder Expired - Fee Related DE69404706T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/028,847 US5384153A (en) 1993-03-10 1993-03-10 Monitoring electroless plating baths

Publications (2)

Publication Number Publication Date
DE69404706D1 true DE69404706D1 (de) 1997-09-11
DE69404706T2 DE69404706T2 (de) 1998-02-19

Family

ID=21845805

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69404706T Expired - Fee Related DE69404706T2 (de) 1993-03-10 1994-03-02 Verfahren zur Überwachung stromloser Metallabscheidungsbäder

Country Status (5)

Country Link
US (1) US5384153A (de)
EP (1) EP0615001B1 (de)
JP (1) JPH06299362A (de)
CA (1) CA2110354C (de)
DE (1) DE69404706T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19546206A1 (de) * 1994-12-19 1996-06-20 At & T Corp Verfahren zum Prüfen von Materialien zur Verwendung bei der chemischen oder außenstromlosen Beschichtung
DE19957067B4 (de) * 1999-11-26 2004-02-12 Technische Universität Dresden Verfahren und Anordnung zur Überwachung der stromlosen Metallabscheidung
CN100564592C (zh) * 2003-09-19 2009-12-02 应用材料公司 对无电沉积的终点进行检测的装置和方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3135443A1 (de) * 1981-09-08 1983-03-24 Leybold-Heraeus GmbH, 5000 Köln Verfahren und fotometrische anordnung zur dickenmessung und -steuerung optisch wirksamer schichten
US4608275A (en) * 1983-07-01 1986-08-26 Macdermid, Incorporated Oxidizing accelerator
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
EP0276276B1 (de) * 1986-08-06 1991-08-21 Macdermid Incorporated Verfahren zur herstellung von gedruckten schaltungsbrettern
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
DE3737489A1 (de) * 1987-11-02 1989-05-18 Schering Ag Verfahren zur kontrolle und/oder steuerung von metallisierungsprozessen und vorrichtung hierfuer

Also Published As

Publication number Publication date
CA2110354A1 (en) 1994-09-11
EP0615001A1 (de) 1994-09-14
EP0615001B1 (de) 1997-08-06
CA2110354C (en) 1998-08-11
JPH06299362A (ja) 1994-10-25
US5384153A (en) 1995-01-24
DE69404706T2 (de) 1998-02-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee