DE69332773D1 - Maske mit Teilmustern und Belichtungsverfahren unter Verwendung derselben - Google Patents

Maske mit Teilmustern und Belichtungsverfahren unter Verwendung derselben

Info

Publication number
DE69332773D1
DE69332773D1 DE69332773T DE69332773T DE69332773D1 DE 69332773 D1 DE69332773 D1 DE 69332773D1 DE 69332773 T DE69332773 T DE 69332773T DE 69332773 T DE69332773 T DE 69332773T DE 69332773 D1 DE69332773 D1 DE 69332773D1
Authority
DE
Germany
Prior art keywords
mask
same
partial patterns
exposure methods
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69332773T
Other languages
English (en)
Other versions
DE69332773T2 (de
Inventor
Nobuyuki Fukuba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE69332773D1 publication Critical patent/DE69332773D1/de
Application granted granted Critical
Publication of DE69332773T2 publication Critical patent/DE69332773T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69332773T 1992-10-13 1993-10-13 Maske mit Teilmustern und Belichtungsverfahren unter Verwendung derselben Expired - Fee Related DE69332773T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27391392 1992-10-13
JP4273913A JP2912505B2 (ja) 1992-10-13 1992-10-13 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
DE69332773D1 true DE69332773D1 (de) 2003-04-24
DE69332773T2 DE69332773T2 (de) 2004-02-12

Family

ID=17534318

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69332773T Expired - Fee Related DE69332773T2 (de) 1992-10-13 1993-10-13 Maske mit Teilmustern und Belichtungsverfahren unter Verwendung derselben

Country Status (5)

Country Link
US (1) US5451488A (de)
EP (1) EP0593274B1 (de)
JP (1) JP2912505B2 (de)
KR (1) KR970008330B1 (de)
DE (1) DE69332773T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7494749B2 (en) * 2000-02-04 2009-02-24 Advanced Micro Devices, Inc. Photolithography using interdependent binary masks
US6541166B2 (en) 2001-01-18 2003-04-01 International Business Machines Corporation Method and apparatus for lithographically printing tightly nested and isolated device features using multiple mask exposures
JP5214904B2 (ja) 2007-04-12 2013-06-19 ルネサスエレクトロニクス株式会社 固体撮像素子の製造方法
JP2014153596A (ja) * 2013-02-12 2014-08-25 Renesas Electronics Corp 半導体装置およびその製造方法、ならびにマスク
WO2017199728A1 (ja) * 2016-05-18 2017-11-23 パナソニック・タワージャズセミコンダクター株式会社 半導体装置及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3173277D1 (en) * 1980-12-29 1986-01-30 Fujitsu Ltd Method of projecting circuit patterns
JPS59133546A (ja) * 1983-01-21 1984-07-31 Hitachi Ltd 半導体装置製造用マスク
JP2720441B2 (ja) * 1988-01-21 1998-03-04 ソニー株式会社 電荷転送装置のパターン形成法
GB8803171D0 (en) * 1988-02-11 1988-03-09 English Electric Valve Co Ltd Imaging apparatus
JP2624570B2 (ja) * 1990-10-25 1997-06-25 シャープ株式会社 固体撮像素子の製造方法

Also Published As

Publication number Publication date
EP0593274B1 (de) 2003-03-19
US5451488A (en) 1995-09-19
DE69332773T2 (de) 2004-02-12
JPH06124869A (ja) 1994-05-06
JP2912505B2 (ja) 1999-06-28
EP0593274A1 (de) 1994-04-20
KR970008330B1 (ko) 1997-05-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee