DE69329329D1 - Keramische grünfolie - Google Patents

Keramische grünfolie

Info

Publication number
DE69329329D1
DE69329329D1 DE69329329T DE69329329T DE69329329D1 DE 69329329 D1 DE69329329 D1 DE 69329329D1 DE 69329329 T DE69329329 T DE 69329329T DE 69329329 T DE69329329 T DE 69329329T DE 69329329 D1 DE69329329 D1 DE 69329329D1
Authority
DE
Germany
Prior art keywords
ceramic green
green film
film
ceramic
green
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69329329T
Other languages
English (en)
Other versions
DE69329329T2 (de
Inventor
Takaki Masaki
Takao Kitagawa
Akiko Yoshimura
Keiji Iwanaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP18007792A external-priority patent/JP3312389B2/ja
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Application granted granted Critical
Publication of DE69329329D1 publication Critical patent/DE69329329D1/de
Publication of DE69329329T2 publication Critical patent/DE69329329T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
    • C04B35/18—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay rich in aluminium oxide
    • C04B35/195—Alkaline earth aluminosilicates, e.g. cordierite or anorthite
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C04B35/634—Polymers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C04B35/634—Polymers
    • C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B35/6344—Copolymers containing at least three different monomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69329329T 1992-07-07 1993-06-25 Keramische grünfolie Expired - Lifetime DE69329329T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP18007792A JP3312389B2 (ja) 1992-07-07 1992-07-07 セラミックス・グリーンシートおよびその現像方法
JP3832593 1993-02-26
PCT/JP1993/000862 WO1994001377A1 (en) 1992-07-07 1993-06-25 Ceramic green sheet

Publications (2)

Publication Number Publication Date
DE69329329D1 true DE69329329D1 (de) 2000-10-05
DE69329329T2 DE69329329T2 (de) 2001-03-29

Family

ID=26377542

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69329329T Expired - Lifetime DE69329329T2 (de) 1992-07-07 1993-06-25 Keramische grünfolie

Country Status (3)

Country Link
EP (1) EP0602252B1 (de)
DE (1) DE69329329T2 (de)
WO (1) WO1994001377A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3450920B2 (ja) * 1994-12-26 2003-09-29 京セラ株式会社 生体補綴部材の製造方法
US6159322A (en) * 1996-06-17 2000-12-12 Toray Industries, Inc. Photosensitive ceramic green sheet, ceramic package, and process for producing the same
FR2788268B1 (fr) * 1999-01-11 2002-05-31 Ct De Transfert De Technologie Composition ceramique pateuse pour l'alimentation d'une machine de prototypage rapide et procede de fabrication
DE10130893A1 (de) * 2001-06-27 2003-01-16 Siemens Ag Glaskeramik, keramischer Grünkörper und monolithischer keramischer Mehrschichtkörper mit der Glaskeramik
FR2835827B1 (fr) * 2002-02-08 2004-04-30 Ct De Transfert De Technologie Procede et composition pour fabriquer une piece en matiere ceramique par prototypage rapide et pieces obtenues
FR2835828B1 (fr) * 2002-02-08 2006-07-14 Ct De Transfert De Technologie Procede et composition pour la fabrication de pieces ceramiques par stereo-lithophotographie et application au domaine dentaire
KR100523295B1 (ko) * 2003-01-10 2005-10-24 한국화학연구원 광중합성 조성물 및 이로부터 제조된 광중합성 막
JP2007261848A (ja) * 2006-03-28 2007-10-11 Ngk Insulators Ltd セラミックスグリーンシート及びその製造方法
JP2007261849A (ja) * 2006-03-28 2007-10-11 Ngk Insulators Ltd シート状緻密質コージェライト焼結体の製造方法
CN108484176A (zh) * 2018-05-24 2018-09-04 宁夏艾森达新材料科技有限公司 一种高温共烧陶瓷用氮化铝生瓷片的制备方法
CN111825333B (zh) * 2019-04-15 2021-08-27 西安交通大学 一种玻璃浆料及其制备方法和3d打印玻璃器件的方法
CN112930027A (zh) * 2021-01-18 2021-06-08 成都宏科电子科技有限公司 白色氧化铝陶瓷基板金属化的填孔钨浆料及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4536535A (en) * 1983-06-07 1985-08-20 E. I. Du Pont De Nemours And Company Castable ceramic compositions
JPS60211898A (ja) * 1984-04-05 1985-10-24 日本電気株式会社 多層配線基板の製造方法
JPS60250686A (ja) * 1984-05-25 1985-12-11 日本碍子株式会社 セラミツク配線基板の製造方法
US4566186A (en) * 1984-06-29 1986-01-28 Tektronix, Inc. Multilayer interconnect circuitry using photoimageable dielectric
JPS61274399A (ja) * 1985-05-29 1986-12-04 株式会社ノリタケカンパニーリミテド 多層セラミック基板用組成物および多層セラミック基板の製造方法
JPS6364953A (ja) * 1986-09-05 1988-03-23 工業技術院長 セラミツクスシ−ト用組成物、及びセラミツクスシ−トの製造法
JPH01232797A (ja) 1988-03-11 1989-09-18 Narumi China Corp セラミック多層回路基板
EP0357063A3 (de) * 1988-09-02 1991-05-02 E.I. Du Pont De Nemours And Company Keramische lichtempfindliche Beschichtungszusammensetzungen
JPH02141458A (ja) 1988-11-24 1990-05-30 Noritake Co Ltd 低温焼成セラミック多層基板およびその製造方法
JPH089644B2 (ja) * 1990-02-19 1996-01-31 三菱レイヨン株式会社 光重合性組成物

Also Published As

Publication number Publication date
EP0602252A4 (de) 1994-11-23
EP0602252B1 (de) 2000-08-30
WO1994001377A1 (en) 1994-01-20
EP0602252A1 (de) 1994-06-22
DE69329329T2 (de) 2001-03-29

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Legal Events

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