DE69323012D1 - Endoskopisches chirurgisches Gelenkwerkzeug - Google Patents

Endoskopisches chirurgisches Gelenkwerkzeug

Info

Publication number
DE69323012D1
DE69323012D1 DE69323012T DE69323012T DE69323012D1 DE 69323012 D1 DE69323012 D1 DE 69323012D1 DE 69323012 T DE69323012 T DE 69323012T DE 69323012 T DE69323012 T DE 69323012T DE 69323012 D1 DE69323012 D1 DE 69323012D1
Authority
DE
Germany
Prior art keywords
endoscopic surgical
joint tool
surgical joint
tool
endoscopic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69323012T
Other languages
English (en)
Other versions
DE69323012T2 (de
Inventor
David A Nicholas
Ernest Aranyi
Boris Zvenyatsky
Paul A Matula
Stanley H Remiszewski
David T Green
Henry Bolanos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United States Surgical Corp
Original Assignee
United States Surgical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United States Surgical Corp filed Critical United States Surgical Corp
Publication of DE69323012D1 publication Critical patent/DE69323012D1/de
Application granted granted Critical
Publication of DE69323012T2 publication Critical patent/DE69323012T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
    • A61B17/28—Surgical forceps
    • A61B17/29—Forceps for use in minimally invasive surgery
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
    • A61B17/02—Surgical instruments, devices or methods, e.g. tourniquets for holding wounds open; Tractors
    • A61B17/0218—Surgical instruments, devices or methods, e.g. tourniquets for holding wounds open; Tractors for minimally invasive surgery
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/04—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
    • A61B18/12—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating by passing a current through the tissue to be heated, e.g. high-frequency current
    • A61B18/14—Probes or electrodes therefor
    • A61B18/1442—Probes having pivoting end effectors, e.g. forceps
    • A61B18/1445—Probes having pivoting end effectors, e.g. forceps at the distal end of a shaft, e.g. forceps or scissors at the end of a rigid rod
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
    • A61B17/28—Surgical forceps
    • A61B17/29—Forceps for use in minimally invasive surgery
    • A61B2017/2926—Details of heads or jaws
    • A61B2017/2927—Details of heads or jaws the angular position of the head being adjustable with respect to the shaft
    • A61B2017/2929—Details of heads or jaws the angular position of the head being adjustable with respect to the shaft with a head rotatable about the longitudinal axis of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69323012T 1992-08-05 1993-08-04 Endoskopisches chirurgisches Gelenkwerkzeug Expired - Lifetime DE69323012T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US92549692A 1992-08-05 1992-08-05

Publications (2)

Publication Number Publication Date
DE69323012D1 true DE69323012D1 (de) 1999-02-25
DE69323012T2 DE69323012T2 (de) 1999-06-10

Family

ID=25451809

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69323012T Expired - Lifetime DE69323012T2 (de) 1992-08-05 1993-08-04 Endoskopisches chirurgisches Gelenkwerkzeug

Country Status (5)

Country Link
US (1) US6806725B2 (de)
EP (1) EP0582295B1 (de)
CA (1) CA2101293C (de)
DE (1) DE69323012T2 (de)
ES (1) ES2129054T3 (de)

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JP4239352B2 (ja) * 2000-03-28 2009-03-18 株式会社日立製作所 電子装置の製造方法
US6901984B1 (en) 2001-02-27 2005-06-07 Cypress Semiconductor Corporation Method and system for controlling the processing of an integrated circuit chip assembly line using a central computer system and a common communication protocol
US6931298B1 (en) 2001-02-27 2005-08-16 Cypress Semiconductor Corporation Integrated back-end integrated circuit manufacturing assembly
DE10121578C2 (de) * 2001-05-03 2003-04-10 Infineon Technologies Ag Verfahren und Bestückungssystem zum Bestücken eines Substrats mit elektronischen Bauteilen
US7226459B2 (en) 2001-10-26 2007-06-05 Smith & Nephew, Inc. Reciprocating rotary arthroscopic surgical instrument
DE10321403A1 (de) * 2002-05-15 2003-12-04 Infineon Technologies Ag Verfahren zur Markierung von Schlechtteilen
US6922890B2 (en) * 2002-11-15 2005-08-02 International Business Machines Corporation Planarization process for thin film surfaces
US7017257B2 (en) * 2003-06-16 2006-03-28 Hitachi Global Storage Technologies Netherlands B.V. Method for directly debonding sliders during single slider processing
US7105377B1 (en) * 2004-04-13 2006-09-12 Cypress Semiconductor Corporation Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process
US6972244B1 (en) * 2004-04-23 2005-12-06 National Semiconductor Corporation Marking semiconductor devices through a mount tape
WO2005119774A1 (en) * 2004-06-01 2005-12-15 Manufacturing Integration Technology Ltd Method and apparatus for precise marking and placement of an object
US8062214B2 (en) 2004-08-27 2011-11-22 Smith & Nephew, Inc. Tissue resecting system
DE102004052204A1 (de) * 2004-10-19 2006-05-04 Karl Storz Gmbh & Co. Kg Auslenkbares endoskopisches Instrument
JP4642436B2 (ja) * 2004-11-12 2011-03-02 リンテック株式会社 マーキング方法および保護膜形成兼ダイシング用シート
JP2007178132A (ja) * 2005-12-27 2007-07-12 Matsushita Electric Ind Co Ltd 半導体検査装置および半導体検査方法
US7700458B2 (en) * 2006-08-04 2010-04-20 Stats Chippac Ltd. Integrated circuit package system employing wafer level chip scale packaging
WO2010031415A1 (en) * 2008-09-18 2010-03-25 Verigy (Singapore) Pte. Ltd. Method of sharing a test resource at a plurality of test sites, automated test equipment, handler for loading and unloading devices to be tested and test system
US8305104B2 (en) * 2009-03-26 2012-11-06 Electro Scientific Industries, Inc. Testing and sorting system having a linear track and method of using the same
US9155454B2 (en) 2010-09-28 2015-10-13 Smith & Nephew, Inc. Hysteroscopic system
US8710859B2 (en) * 2011-09-23 2014-04-29 Powertech Technology Inc. Method for testing multi-chip stacked packages
JP6043959B2 (ja) * 2013-03-26 2016-12-14 パナソニックＩｐマネジメント株式会社 半導体パッケージの製造方法、半導体チップ支持キャリア及びチップ搭載装置
US9922935B2 (en) 2014-09-17 2018-03-20 Samsung Electronics Co., Ltd. Semiconductor package and method of fabricating the same
KR20160032958A (ko) 2014-09-17 2016-03-25 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
US10772652B2 (en) 2015-01-28 2020-09-15 Covidien Lp Tissue resection system
JP6626254B2 (ja) * 2015-02-03 2019-12-25 株式会社テセック 半導体デバイス測定方法
WO2016205126A1 (en) 2015-06-17 2016-12-22 Covidien Lp Endoscopic device with drip flange and methods of use thereof for an operative procedure
WO2016205359A2 (en) 2015-06-17 2016-12-22 Smith & Nephew, Inc. Surgical instrument with phase change cooling
CA2989162A1 (en) 2015-06-18 2016-12-22 Covidien Lp Surgical instrument with suction control
US10299803B2 (en) 2016-08-04 2019-05-28 Covidien Lp Self-aligning drive coupler
US10772654B2 (en) 2017-03-02 2020-09-15 Covidien Lp Fluid-driven tissue resecting instruments, systems, and methods
US11197710B2 (en) 2018-10-26 2021-12-14 Covidien Lp Tissue resecting device including a blade lock and release mechanism
US10945752B2 (en) 2019-03-20 2021-03-16 Covidien Lp Tissue resecting instrument including a rotation lock feature
US11883058B2 (en) 2019-03-26 2024-01-30 Covidien Lp Jaw members, end effector assemblies, and ultrasonic surgical instruments including the same
EP3975913A1 (de) 2019-05-29 2022-04-06 Covidien LP Hysteroskopiesysteme und verfahren zur verwaltung von patientenflüssigkeit
US11452806B2 (en) 2019-10-04 2022-09-27 Covidien Lp Outflow collection vessels, systems, and components thereof for hysteroscopic surgical procedures
US11890237B2 (en) 2019-10-04 2024-02-06 Covidien Lp Outflow collection vessels, systems, and components thereof for hysteroscopic surgical procedures
US11376032B2 (en) 2019-12-05 2022-07-05 Covidien Lp Tissue resecting instrument
US11179172B2 (en) 2019-12-05 2021-11-23 Covidien Lp Tissue resecting instrument
US11547782B2 (en) 2020-01-31 2023-01-10 Covidien Lp Fluid collecting sheaths for endoscopic devices and systems
US11737777B2 (en) 2020-02-05 2023-08-29 Covidien Lp Tissue resecting instruments
US11317947B2 (en) 2020-02-18 2022-05-03 Covidien Lp Tissue resecting instrument
US11596429B2 (en) 2020-04-20 2023-03-07 Covidien Lp Tissue resecting instrument
CN112590593B (zh) * 2020-12-30 2022-08-16 常州大连理工大学智能装备研究院 一种自调节角度的电车充电桩
CN114311346B (zh) * 2022-03-16 2022-06-07 江苏京创先进电子科技有限公司 晶圆与工作台对准识别方法

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Also Published As

Publication number Publication date
EP0582295B1 (de) 1999-01-13
CA2101293A1 (en) 1994-02-06
DE69323012T2 (de) 1999-06-10
EP0582295A3 (en) 1994-05-18
EP0582295A2 (de) 1994-02-09
US6806725B2 (en) 2004-10-19
CA2101293C (en) 2004-06-29
US20020177875A1 (en) 2002-11-28
ES2129054T3 (es) 1999-06-01

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Legal Events

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8364 No opposition during term of opposition