DE69318900T2 - Optisches Modul mit verbesserter Erdung eines optischen Elements - Google Patents

Optisches Modul mit verbesserter Erdung eines optischen Elements

Info

Publication number
DE69318900T2
DE69318900T2 DE69318900T DE69318900T DE69318900T2 DE 69318900 T2 DE69318900 T2 DE 69318900T2 DE 69318900 T DE69318900 T DE 69318900T DE 69318900 T DE69318900 T DE 69318900T DE 69318900 T2 DE69318900 T2 DE 69318900T2
Authority
DE
Germany
Prior art keywords
optical
improved grounding
optical element
optical module
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69318900T
Other languages
English (en)
Other versions
DE69318900D1 (de
Inventor
Hiromi Kurashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP21434792A external-priority patent/JP3151797B2/ja
Priority claimed from JP04221436A external-priority patent/JP3092119B2/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE69318900D1 publication Critical patent/DE69318900D1/de
Publication of DE69318900T2 publication Critical patent/DE69318900T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE69318900T 1992-08-11 1993-08-09 Optisches Modul mit verbesserter Erdung eines optischen Elements Expired - Fee Related DE69318900T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21434792A JP3151797B2 (ja) 1992-08-11 1992-08-11 光モジュールの製造方法
JP04221436A JP3092119B2 (ja) 1992-08-20 1992-08-20 光モジュール

Publications (2)

Publication Number Publication Date
DE69318900D1 DE69318900D1 (de) 1998-07-09
DE69318900T2 true DE69318900T2 (de) 1998-10-01

Family

ID=26520267

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69318900T Expired - Fee Related DE69318900T2 (de) 1992-08-11 1993-08-09 Optisches Modul mit verbesserter Erdung eines optischen Elements

Country Status (6)

Country Link
US (1) US5353364A (de)
EP (1) EP0582992B1 (de)
KR (1) KR0137189B1 (de)
AU (1) AU657632B2 (de)
CA (1) CA2103611A1 (de)
DE (1) DE69318900T2 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5416871A (en) * 1993-04-09 1995-05-16 Sumitomo Electric Industries, Ltd. Molded optical connector module
US5546489A (en) * 1993-08-02 1996-08-13 Sumitomo Electric Industries, Ltd. Optical link apparatus
EP0638829B1 (de) * 1993-08-09 1999-11-24 Nippon Telegraph And Telephone Corporation Optoelektronische Hybridintegrationsplattform, optisches Untermodul, optoelektronische hybridintegrierte Schaltung, und Herstellungsverfahren der Plattform
KR0139132B1 (ko) * 1993-09-30 1998-07-01 쿠라우찌 노리타카 광통신용 광모듈, 그 제조방법 및 광파이버 페루울 수납용 슬리브
EP0654866A3 (de) * 1993-11-23 1997-08-20 Motorola Inc Träger zur Verbindung eines Halbleiterwürfels und Herstellungsverfahren.
US5561727A (en) * 1994-02-15 1996-10-01 Sumitomo Electric Industries, Ltd. Card-shaped optical data link device
SE9403575L (sv) * 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Benram för kapslad optokomponent
CA2161718A1 (en) * 1994-10-31 1996-05-01 Hiromi Kurashima Optical module having structure for defining fixing position of sleeve
US5717533A (en) 1995-01-13 1998-02-10 Methode Electronics Inc. Removable optoelectronic module
US6220878B1 (en) 1995-10-04 2001-04-24 Methode Electronics, Inc. Optoelectronic module with grounding means
JP2995092B2 (ja) * 1995-11-08 1999-12-27 シーメンス マイクロエレクトロニクス インコーポレイテッド 多数の取付形態を有する薄型光学装置
DE19643072A1 (de) * 1996-10-18 1998-04-23 Alsthom Cge Alcatel Optoelektronisches Bauelement
JP3514609B2 (ja) * 1997-05-29 2004-03-31 新光電気工業株式会社 光半導体装置用リードフレームと光半導体装置
SG71172A1 (en) 1997-12-03 2000-03-21 Sumitomo Electric Industries Optical data link
JPH11258467A (ja) * 1998-03-16 1999-09-24 Sumitomo Electric Ind Ltd 光モジュール用リードフレーム、光モジュールの製造方法、及び光モジュール
DE19918859C2 (de) * 1999-04-26 2002-02-07 Tyco Electronics Logistics Ag Elektro-optisches Wandlerbauteil und Verfahren zu seiner Herstellung
SE514393C2 (sv) * 1999-06-30 2001-02-19 Ericsson Telefon Ab L M Kapslad optomodul
US6704515B1 (en) * 1999-12-30 2004-03-09 The Boeing Company Fiber optic interface module and associated fabrication method
JP2002131712A (ja) * 2000-10-19 2002-05-09 Mitsubishi Electric Corp 光デバイスおよびその製造方法
US6867377B2 (en) 2000-12-26 2005-03-15 Emcore Corporation Apparatus and method of using flexible printed circuit board in optical transceiver device
US6905260B2 (en) 2000-12-26 2005-06-14 Emcore Corporation Method and apparatus for coupling optical elements to optoelectronic devices for manufacturing optical transceiver modules
US6799902B2 (en) 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
US7021836B2 (en) 2000-12-26 2006-04-04 Emcore Corporation Attenuator and conditioner
US6863444B2 (en) 2000-12-26 2005-03-08 Emcore Corporation Housing and mounting structure
WO2002079844A1 (en) * 2001-03-28 2002-10-10 Iljin Corporation Small-formed optical module
WO2002079812A2 (en) * 2001-03-28 2002-10-10 Iljin Corporation Small-formed optical module
US6863453B2 (en) 2003-01-28 2005-03-08 Emcore Corporation Method and apparatus for parallel optical transceiver module assembly
US7805084B2 (en) * 2004-05-20 2010-09-28 Finisar Corporation Dual stage modular optical devices
US7334948B2 (en) * 2004-05-21 2008-02-26 Finisar Corporation Modular optical device with component insert
US20060153507A1 (en) * 2004-05-21 2006-07-13 Togami Chris K Modular optical devices compatible with legacy form factors
JP6558192B2 (ja) * 2015-10-01 2019-08-14 住友電気工業株式会社 光学装置
JP6631138B2 (ja) 2015-10-01 2020-01-15 住友電気工業株式会社 光学装置、プリント回路基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4149072A (en) * 1977-08-05 1979-04-10 Minnesota Mining And Manufacturing Company System for flat ribbon optical fiber data communications link
JPH0231735Y2 (de) * 1987-02-12 1990-08-28
CA1330576C (en) * 1989-03-29 1994-07-05 Camilo M. Tabalba Transient voltage suppression for electro-optic modules
JP2881806B2 (ja) * 1989-04-12 1999-04-12 住友電気工業株式会社 光モジュール及びその製造方法
US5047835A (en) * 1989-12-26 1991-09-10 At&T Bell Laboratories Lightwave packaging for pairs of optical devices
US5069522A (en) * 1990-01-09 1991-12-03 International Business Machines Corporation Optical fiber link card
US4979787A (en) * 1990-01-12 1990-12-25 Pco, Inc. Optical-electronic interface module
AU643411B2 (en) * 1990-08-23 1993-11-11 Sumitomo Electric Industries, Ltd. Optical module
AU631000B2 (en) * 1990-08-28 1992-11-12 Sumitomo Electric Industries, Ltd. Optical module
US5113466A (en) * 1991-04-25 1992-05-12 At&T Bell Laboratories Molded optical packaging arrangement
US5123066A (en) * 1991-04-25 1992-06-16 At&T Bell Laboratories Molded optical package utilizing leadframe technology

Also Published As

Publication number Publication date
KR940004352A (ko) 1994-03-15
AU657632B2 (en) 1995-03-16
US5353364A (en) 1994-10-04
EP0582992B1 (de) 1998-06-03
KR0137189B1 (ko) 1998-06-15
EP0582992A1 (de) 1994-02-16
AU4455493A (en) 1994-02-17
DE69318900D1 (de) 1998-07-09
CA2103611A1 (en) 1994-02-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee