DE69316872T2 - Elektrostatische klemmvorrichtung zur halterung einer wafer - Google Patents

Elektrostatische klemmvorrichtung zur halterung einer wafer

Info

Publication number
DE69316872T2
DE69316872T2 DE69316872T DE69316872T DE69316872T2 DE 69316872 T2 DE69316872 T2 DE 69316872T2 DE 69316872 T DE69316872 T DE 69316872T DE 69316872 T DE69316872 T DE 69316872T DE 69316872 T2 DE69316872 T2 DE 69316872T2
Authority
DE
Germany
Prior art keywords
wafer
holding
clamping device
electrostatic clamping
electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69316872T
Other languages
English (en)
Other versions
DE69316872D1 (de
Inventor
A Frutiger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Application granted granted Critical
Publication of DE69316872D1 publication Critical patent/DE69316872D1/de
Publication of DE69316872T2 publication Critical patent/DE69316872T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
DE69316872T 1992-11-06 1993-11-01 Elektrostatische klemmvorrichtung zur halterung einer wafer Expired - Fee Related DE69316872T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US97261792A 1992-11-06 1992-11-06
PCT/US1993/010502 WO1994011944A1 (en) 1992-11-06 1993-11-01 Electrostatic wafer clamp

Publications (2)

Publication Number Publication Date
DE69316872D1 DE69316872D1 (de) 1998-03-12
DE69316872T2 true DE69316872T2 (de) 1998-05-28

Family

ID=25519898

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69316872T Expired - Fee Related DE69316872T2 (de) 1992-11-06 1993-11-01 Elektrostatische klemmvorrichtung zur halterung einer wafer

Country Status (4)

Country Link
EP (1) EP0620953B1 (de)
JP (1) JP3330945B2 (de)
DE (1) DE69316872T2 (de)
WO (1) WO1994011944A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5822171A (en) * 1994-02-22 1998-10-13 Applied Materials, Inc. Electrostatic chuck with improved erosion resistance
JPH09237826A (ja) * 1996-02-29 1997-09-09 Kyocera Corp 静電チャック
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
FR2785737B1 (fr) * 1998-11-10 2001-01-05 Semco Engineering Sa Dispositif de maintien electrostatique
US6362946B1 (en) * 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
WO2004093157A2 (en) * 2003-03-30 2004-10-28 Litton Systems, Inc. Diffusion bonding method for microchannel plates
US8139340B2 (en) * 2009-01-20 2012-03-20 Plasma-Therm Llc Conductive seal ring electrostatic chuck
US9236216B2 (en) * 2012-08-03 2016-01-12 Axcelis Technologies, Inc. In-vacuum high speed pre-chill and post-heat stations
CN104685604B (zh) * 2013-10-02 2017-11-10 艾克塞利斯科技公司 真空中高速预冷站和后热站
FR3017487B1 (fr) * 2014-02-07 2016-03-18 Ion Beam Services Porte-substrat electrostatique chauffant et polarise en haute tension
US9633885B2 (en) * 2014-02-12 2017-04-25 Axcelis Technologies, Inc. Variable electrode pattern for versatile electrostatic clamp operation
JP6140624B2 (ja) * 2014-02-27 2017-05-31 東京エレクトロン株式会社 基板保持方法、基板保持装置および接合装置
US9607803B2 (en) 2015-08-04 2017-03-28 Axcelis Technologies, Inc. High throughput cooled ion implantation system and method
JP6723660B2 (ja) 2017-03-24 2020-07-15 住友重機械イオンテクノロジー株式会社 ウェハ保持装置及びウェハ着脱方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3717801A (en) * 1971-04-12 1973-02-20 Xerox Corp Methods and apparatus for electrostatically performing a tacking operation
US4184188A (en) * 1978-01-16 1980-01-15 Veeco Instruments Inc. Substrate clamping technique in IC fabrication processes
US4384918A (en) * 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
JPS6059104B2 (ja) * 1982-02-03 1985-12-23 株式会社東芝 静電チヤツク板
JPS5929435A (ja) * 1982-08-11 1984-02-16 Hitachi Ltd 試料支持装置
JPS5944797A (ja) * 1982-09-07 1984-03-13 増田　閃一 物体の静電的処理装置
WO1988009054A1 (en) * 1987-05-06 1988-11-17 Labtam Limited Electrostatic chuck using ac field excitation
US5179498A (en) * 1990-05-17 1993-01-12 Tokyo Electron Limited Electrostatic chuck device
EP0460955A1 (de) * 1990-06-08 1991-12-11 Varian Associates, Inc. Spannen eines Werkstückes unter Verwendung einer mehrphasigen Haltespannung
US5166856A (en) * 1991-01-31 1992-11-24 International Business Machines Corporation Electrostatic chuck with diamond coating

Also Published As

Publication number Publication date
EP0620953B1 (de) 1998-02-04
JPH07506465A (ja) 1995-07-13
EP0620953A1 (de) 1994-10-26
WO1994011944A1 (en) 1994-05-26
JP3330945B2 (ja) 2002-10-07
EP0620953A4 (de) 1995-07-05
DE69316872D1 (de) 1998-03-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.(N.

8339 Ceased/non-payment of the annual fee