DE69316419D1 - Vorrichtung zur feinelektrochemischen Bearbeitung - Google Patents

Vorrichtung zur feinelektrochemischen Bearbeitung

Info

Publication number
DE69316419D1
DE69316419D1 DE69316419T DE69316419T DE69316419D1 DE 69316419 D1 DE69316419 D1 DE 69316419D1 DE 69316419 T DE69316419 T DE 69316419T DE 69316419 T DE69316419 T DE 69316419T DE 69316419 D1 DE69316419 D1 DE 69316419D1
Authority
DE
Germany
Prior art keywords
electrochemical processing
fine
fine electrochemical
processing
electrochemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69316419T
Other languages
English (en)
Other versions
DE69316419T2 (de
Inventor
Masataka Shinogi
Toshihiko Sakuhara
Masayuki Suda
Fumiharu Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Publication of DE69316419D1 publication Critical patent/DE69316419D1/de
Application granted granted Critical
Publication of DE69316419T2 publication Critical patent/DE69316419T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
DE69316419T 1992-03-30 1993-03-05 Vorrichtung zur feinelektrochemischen Bearbeitung Expired - Fee Related DE69316419T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4074734A JP2952539B2 (ja) 1992-03-30 1992-03-30 微細加工装置

Publications (2)

Publication Number Publication Date
DE69316419D1 true DE69316419D1 (de) 1998-02-26
DE69316419T2 DE69316419T2 (de) 1998-05-07

Family

ID=13555765

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69316419T Expired - Fee Related DE69316419T2 (de) 1992-03-30 1993-03-05 Vorrichtung zur feinelektrochemischen Bearbeitung

Country Status (4)

Country Link
US (1) US5344539A (de)
EP (1) EP0563616B1 (de)
JP (1) JP2952539B2 (de)
DE (1) DE69316419T2 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2896726B2 (ja) * 1992-03-30 1999-05-31 セイコーインスツルメンツ株式会社 微細加工装置
JP2710268B2 (ja) * 1994-08-23 1998-02-10 工業技術院長 局所エッチング方法
US5567300A (en) * 1994-09-02 1996-10-22 Ibm Corporation Electrochemical metal removal technique for planarization of surfaces
DE69724269T2 (de) * 1996-09-06 2004-06-09 Obducat Ab Verfahren für das anisotrope ätzen von strukturen in leitende materialien
JP3217999B2 (ja) 1997-12-03 2001-10-15 セイコーインスツルメンツ株式会社 部品製作方法及び部品製作装置
WO1999045179A1 (en) * 1998-03-05 1999-09-10 Obducat Ab Method of etching
US6143155A (en) * 1998-06-11 2000-11-07 Speedfam Ipec Corp. Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly
US6121152A (en) * 1998-06-11 2000-09-19 Integrated Process Equipment Corporation Method and apparatus for planarization of metallized semiconductor wafers using a bipolar electrode assembly
US6132586A (en) * 1998-06-11 2000-10-17 Integrated Process Equipment Corporation Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly
EP1231300B1 (de) 1999-07-26 2007-02-07 Tokyo Electron Limited Plattierungsverfahren, -vorrichtung und -system
US6547937B1 (en) * 2000-01-03 2003-04-15 Semitool, Inc. Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
US7094131B2 (en) 2000-08-30 2006-08-22 Micron Technology, Inc. Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
US7160176B2 (en) * 2000-08-30 2007-01-09 Micron Technology, Inc. Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
US7134934B2 (en) 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US7192335B2 (en) 2002-08-29 2007-03-20 Micron Technology, Inc. Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
US7153195B2 (en) 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US7112121B2 (en) 2000-08-30 2006-09-26 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US7078308B2 (en) 2002-08-29 2006-07-18 Micron Technology, Inc. Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
US7074113B1 (en) 2000-08-30 2006-07-11 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US7220166B2 (en) 2000-08-30 2007-05-22 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US7129160B2 (en) 2002-08-29 2006-10-31 Micron Technology, Inc. Method for simultaneously removing multiple conductive materials from microelectronic substrates
US7153410B2 (en) * 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
US20050050767A1 (en) * 2003-06-06 2005-03-10 Hanson Kyle M. Wet chemical processing chambers for processing microfeature workpieces
US20050063798A1 (en) * 2003-06-06 2005-03-24 Davis Jeffry Alan Interchangeable workpiece handling apparatus and associated tool for processing microfeature workpieces
US7390382B2 (en) * 2003-07-01 2008-06-24 Semitool, Inc. Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods
US20050035046A1 (en) * 2003-06-06 2005-02-17 Hanson Kyle M. Wet chemical processing chambers for processing microfeature workpieces
US7393439B2 (en) * 2003-06-06 2008-07-01 Semitool, Inc. Integrated microfeature workpiece processing tools with registration systems for paddle reactors
US20070144912A1 (en) * 2003-07-01 2007-06-28 Woodruff Daniel J Linearly translating agitators for processing microfeature workpieces, and associated methods
US7112122B2 (en) 2003-09-17 2006-09-26 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US7153777B2 (en) 2004-02-20 2006-12-26 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
US7566391B2 (en) 2004-09-01 2009-07-28 Micron Technology, Inc. Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
US7569490B2 (en) 2005-03-15 2009-08-04 Wd Media, Inc. Electrochemical etching
US20060207890A1 (en) 2005-03-15 2006-09-21 Norbert Staud Electrochemical etching
US20080178460A1 (en) * 2007-01-29 2008-07-31 Woodruff Daniel J Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods
US20080181758A1 (en) * 2007-01-29 2008-07-31 Woodruff Daniel J Microfeature workpiece transfer devices with rotational orientation sensors, and associated systems and methods
CN102092676A (zh) * 2011-01-20 2011-06-15 浙江大学 一种批量制备大纵横比三维微结构的方法及系统
CN103342334B (zh) * 2013-05-10 2016-01-20 厦门大学 一种电化学刻蚀加工聚合物材料表面的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2399289A (en) * 1940-06-15 1946-04-30 Aqua Electric Corp Ltd Apparatus for purifying liquids
US2862863A (en) * 1957-09-23 1958-12-02 Kenneth F Griffith Apparatus for electrolytic production of a metal product from fused salts
GB1071923A (en) * 1964-01-08 1967-06-14 Ici Ltd Electrolytic production of soluble compounds
AU420670B2 (en) * 1968-04-01 1972-01-21 Electrolytic treatment process
US3852176A (en) * 1971-02-23 1974-12-03 Calspan Corp Embrittlement machining method
US3873512A (en) * 1973-04-30 1975-03-25 Martin Marietta Corp Machining method
US3989604A (en) * 1975-10-15 1976-11-02 National Steel Corporation Method of producing metal strip having a galvanized coating on one side

Also Published As

Publication number Publication date
DE69316419T2 (de) 1998-05-07
JP2952539B2 (ja) 1999-09-27
EP0563616B1 (de) 1998-01-21
EP0563616A3 (en) 1995-02-01
US5344539A (en) 1994-09-06
EP0563616A2 (de) 1993-10-06
JPH05271969A (ja) 1993-10-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: WIESE KONNERTH FISCHER PATENTANWAELTE PARTNERSCHAF

8328 Change in the person/name/address of the agent

Representative=s name: SCHROETER LEHMANN FISCHER & NEUGEBAUER, 81479 MUEN

8339 Ceased/non-payment of the annual fee