DE69315172T2 - Verfahren zum in Kunststoff einzugiessender Metalleinlage - Google Patents
Verfahren zum in Kunststoff einzugiessender MetalleinlageInfo
- Publication number
- DE69315172T2 DE69315172T2 DE69315172T DE69315172T DE69315172T2 DE 69315172 T2 DE69315172 T2 DE 69315172T2 DE 69315172 T DE69315172 T DE 69315172T DE 69315172 T DE69315172 T DE 69315172T DE 69315172 T2 DE69315172 T2 DE 69315172T2
- Authority
- DE
- Germany
- Prior art keywords
- plastic
- metal insert
- insert
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C45/14221—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure by tools, e.g. cutting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
- B29C2045/14081—Positioning or centering articles in the mould using means being retractable during injection centering means retracted by the injection pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14147—Positioning or centering articles in the mould using pins or needles penetrating through the insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2072—Anchoring, i.e. one structure gripping into another
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITTO920648A IT1256901B (it) | 1992-07-28 | 1992-07-28 | Procedimento per il costampaggio di un inserto metallico realizzante una pluralita' di circuiti elettrici in un elemento in materiale plastico sintetico. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69315172D1 DE69315172D1 (de) | 1997-12-18 |
DE69315172T2 true DE69315172T2 (de) | 1998-04-02 |
Family
ID=11410645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69315172T Expired - Fee Related DE69315172T2 (de) | 1992-07-28 | 1993-06-22 | Verfahren zum in Kunststoff einzugiessender Metalleinlage |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0592768B1 (de) |
DE (1) | DE69315172T2 (de) |
IT (1) | IT1256901B (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014102024A1 (de) | 2014-02-18 | 2015-08-20 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Verfahren und Werkzeug zur Herstellung einer Öffnung in einem Faserverbundbauteil |
CN110948781A (zh) * | 2018-09-27 | 2020-04-03 | 日本电产株式会社 | 嵌件成型模具以及嵌件成型品的制造方法 |
DE102005038930B4 (de) * | 2004-08-17 | 2021-05-20 | Borgwarner Inc. | Verfahren zum Einformen einer Schaltung |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19500790A1 (de) * | 1995-01-13 | 1996-07-18 | Bayer Ag | Verfahren und Vorrichtung zur Herstellung von Kunststoff/Metallverbundkörpern |
FR2748414B1 (fr) * | 1996-05-10 | 1998-06-26 | Allibert Ind | Procede d'habillage d'une piece thermoplastique injectee par une feuille decoupee au cours du procede, moule pour la mise en oeuvre du procede et piece obtenue |
FR2749795B1 (fr) * | 1996-06-12 | 1998-08-14 | James Juillard Ets | Moule pour la realisation d'un surmoulage, et procede de realisation d'une piece surmoulee avec decoupe d'insert integree |
WO2005110703A1 (en) * | 2004-05-07 | 2005-11-24 | Decoma International | Injection forming and bonding process |
US9782942B2 (en) | 2013-12-30 | 2017-10-10 | Verily Life Sciences Llc | Methods and apparatus for positioning a structure on a polymer layer |
US10001661B1 (en) | 2014-03-06 | 2018-06-19 | Verily Life Sciences Llc | Body-mountable devices having an optical polarizer |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01262115A (ja) * | 1988-04-14 | 1989-10-19 | Seiko Epson Corp | Ic封止用射出成形金型 |
US5203060A (en) * | 1989-05-22 | 1993-04-20 | Mraz James E | Apparatus for making insert molded circuitry |
US4965933A (en) * | 1989-05-22 | 1990-10-30 | The Cherry Corporation | Process for making insert molded circuit |
US5038468A (en) * | 1990-04-19 | 1991-08-13 | Illinois Tool Works Inc. | Method of insert molding with web placed in the mold |
JPH04102338A (ja) * | 1990-08-22 | 1992-04-03 | Toshiba Corp | 樹脂封止型半導体装置の製造方法及び製造装置 |
-
1992
- 1992-07-28 IT ITTO920648A patent/IT1256901B/it active IP Right Grant
-
1993
- 1993-06-22 EP EP93109956A patent/EP0592768B1/de not_active Expired - Lifetime
- 1993-06-22 DE DE69315172T patent/DE69315172T2/de not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005038930B4 (de) * | 2004-08-17 | 2021-05-20 | Borgwarner Inc. | Verfahren zum Einformen einer Schaltung |
DE102014102024A1 (de) | 2014-02-18 | 2015-08-20 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Verfahren und Werkzeug zur Herstellung einer Öffnung in einem Faserverbundbauteil |
US9884454B2 (en) | 2014-02-18 | 2018-02-06 | Dr. Ing. H.C.F. Porsche Aktiengesellschaft | Method for producing an opening in a fiber composite component |
CN110948781A (zh) * | 2018-09-27 | 2020-04-03 | 日本电产株式会社 | 嵌件成型模具以及嵌件成型品的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE69315172D1 (de) | 1997-12-18 |
ITTO920648A1 (it) | 1994-01-28 |
EP0592768A1 (de) | 1994-04-20 |
EP0592768B1 (de) | 1997-11-12 |
ITTO920648A0 (it) | 1992-07-28 |
IT1256901B (it) | 1995-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |