DE69315172D1 - Verfahren zum in Kunststoff einzugiessender Metalleinlage - Google Patents

Verfahren zum in Kunststoff einzugiessender Metalleinlage

Info

Publication number
DE69315172D1
DE69315172D1 DE69315172T DE69315172T DE69315172D1 DE 69315172 D1 DE69315172 D1 DE 69315172D1 DE 69315172 T DE69315172 T DE 69315172T DE 69315172 T DE69315172 T DE 69315172T DE 69315172 D1 DE69315172 D1 DE 69315172D1
Authority
DE
Germany
Prior art keywords
plastic
metal insert
insert
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69315172T
Other languages
English (en)
Other versions
DE69315172T2 (de
Inventor
Silvano Cibin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ITW Fastex Italia SpA
Original Assignee
ITW Fastex Italia SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ITW Fastex Italia SpA filed Critical ITW Fastex Italia SpA
Publication of DE69315172D1 publication Critical patent/DE69315172D1/de
Application granted granted Critical
Publication of DE69315172T2 publication Critical patent/DE69315172T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C45/14221—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure by tools, e.g. cutting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
    • B29C2045/14081—Positioning or centering articles in the mould using means being retractable during injection centering means retracted by the injection pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14147—Positioning or centering articles in the mould using pins or needles penetrating through the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
DE69315172T 1992-07-28 1993-06-22 Verfahren zum in Kunststoff einzugiessender Metalleinlage Expired - Fee Related DE69315172T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITTO920648A IT1256901B (it) 1992-07-28 1992-07-28 Procedimento per il costampaggio di un inserto metallico realizzante una pluralita' di circuiti elettrici in un elemento in materiale plastico sintetico.

Publications (2)

Publication Number Publication Date
DE69315172D1 true DE69315172D1 (de) 1997-12-18
DE69315172T2 DE69315172T2 (de) 1998-04-02

Family

ID=11410645

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69315172T Expired - Fee Related DE69315172T2 (de) 1992-07-28 1993-06-22 Verfahren zum in Kunststoff einzugiessender Metalleinlage

Country Status (3)

Country Link
EP (1) EP0592768B1 (de)
DE (1) DE69315172T2 (de)
IT (1) IT1256901B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19500790A1 (de) * 1995-01-13 1996-07-18 Bayer Ag Verfahren und Vorrichtung zur Herstellung von Kunststoff/Metallverbundkörpern
FR2748414B1 (fr) * 1996-05-10 1998-06-26 Allibert Ind Procede d'habillage d'une piece thermoplastique injectee par une feuille decoupee au cours du procede, moule pour la mise en oeuvre du procede et piece obtenue
FR2749795B1 (fr) * 1996-06-12 1998-08-14 James Juillard Ets Moule pour la realisation d'un surmoulage, et procede de realisation d'une piece surmoulee avec decoupe d'insert integree
WO2005110703A1 (en) * 2004-05-07 2005-11-24 Decoma International Injection forming and bonding process
US7572402B2 (en) * 2004-08-17 2009-08-11 Borgwarner Inc. Method of overmolding circuit
US9782942B2 (en) 2013-12-30 2017-10-10 Verily Life Sciences Llc Methods and apparatus for positioning a structure on a polymer layer
DE102014102024A1 (de) 2014-02-18 2015-08-20 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Verfahren und Werkzeug zur Herstellung einer Öffnung in einem Faserverbundbauteil
US10001661B1 (en) 2014-03-06 2018-06-19 Verily Life Sciences Llc Body-mountable devices having an optical polarizer
JP2020049804A (ja) * 2018-09-27 2020-04-02 日本電産株式会社 インサート成形金型及びインサート成形品の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01262115A (ja) * 1988-04-14 1989-10-19 Seiko Epson Corp Ｉｃ封止用射出成形金型
US4965933A (en) * 1989-05-22 1990-10-30 The Cherry Corporation Process for making insert molded circuit
US5203060A (en) * 1989-05-22 1993-04-20 Mraz James E Apparatus for making insert molded circuitry
US5038468A (en) * 1990-04-19 1991-08-13 Illinois Tool Works Inc. Method of insert molding with web placed in the mold
JPH04102338A (ja) * 1990-08-22 1992-04-03 Toshiba Corp 樹脂封止型半導体装置の製造方法及び製造装置

Also Published As

Publication number Publication date
EP0592768A1 (de) 1994-04-20
ITTO920648A0 (it) 1992-07-28
ITTO920648A1 (it) 1994-01-28
DE69315172T2 (de) 1998-04-02
IT1256901B (it) 1995-12-27
EP0592768B1 (de) 1997-11-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee