DE69307862T2 - Leiterplatte für Spritzgiesssystem - Google Patents

Leiterplatte für Spritzgiesssystem

Info

Publication number
DE69307862T2
DE69307862T2 DE69307862T DE69307862T DE69307862T2 DE 69307862 T2 DE69307862 T2 DE 69307862T2 DE 69307862 T DE69307862 T DE 69307862T DE 69307862 T DE69307862 T DE 69307862T DE 69307862 T2 DE69307862 T2 DE 69307862T2
Authority
DE
Germany
Prior art keywords
injection molding
circuit board
printed circuit
tracks
power source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69307862T
Other languages
English (en)
Other versions
DE69307862D1 (de
Inventor
Harald Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Husky Injection Molding Systems Ltd
Original Assignee
Husky Injection Molding Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Husky Injection Molding Systems Ltd filed Critical Husky Injection Molding Systems Ltd
Application granted granted Critical
Publication of DE69307862D1 publication Critical patent/DE69307862D1/de
Publication of DE69307862T2 publication Critical patent/DE69307862T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0083—Electrical or fluid connection systems therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2737—Heating or cooling means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C2045/1784—Component parts, details or accessories not otherwise provided for; Auxiliary operations not otherwise provided for
    • B29C2045/1786—Electric wire or cable guides, e.g. for manifolds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2737—Heating or cooling means therefor
    • B29C2045/2751—Electrical power supply connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2737—Heating or cooling means therefor
    • B29C45/2738—Heating or cooling means therefor specially adapted for manifolds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/78—Measuring, controlling or regulating of temperature
DE69307862T 1992-12-10 1993-11-25 Leiterplatte für Spritzgiesssystem Expired - Fee Related DE69307862T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/988,863 US5320513A (en) 1992-12-10 1992-12-10 Printed circuit board for an injection molding apparatus

Publications (2)

Publication Number Publication Date
DE69307862D1 DE69307862D1 (de) 1997-03-13
DE69307862T2 true DE69307862T2 (de) 1997-07-24

Family

ID=25534554

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69307862T Expired - Fee Related DE69307862T2 (de) 1992-12-10 1993-11-25 Leiterplatte für Spritzgiesssystem

Country Status (12)

Country Link
US (1) US5320513A (de)
EP (1) EP0606043B1 (de)
JP (1) JPH0773868B2 (de)
KR (1) KR970006229B1 (de)
AT (1) ATE148390T1 (de)
AU (1) AU657065B2 (de)
BR (1) BR9304574A (de)
CA (1) CA2109555C (de)
DE (1) DE69307862T2 (de)
DK (1) DK0606043T3 (de)
ES (1) ES2098713T3 (de)
MX (1) MX9307647A (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5591366A (en) * 1994-06-23 1997-01-07 Husky Injection Molding Systems Ltd. Injection molding heater including circuit breaking means
US5772933A (en) * 1994-10-12 1998-06-30 Kotzab; Werner Method for tempering an injection mold having at least one heated nozzle or hot runner
EP0903421B1 (de) * 1997-09-22 2004-11-24 National Research Institute For Metals Ferritischer,wärmebeständiger Stahl und Verfahren zur Herstellung
US6305923B1 (en) 1998-06-12 2001-10-23 Husky Injection Molding Systems Ltd. Molding system using film heaters and/or sensors
US7241131B1 (en) 2000-06-19 2007-07-10 Husky Injection Molding Systems Ltd. Thick film heater apparatus
AU2002235156A1 (en) * 2000-11-06 2002-05-15 Frederick J. Buja Method and apparatus for controlling a mold melt-flow process using temperature sensors
US6913453B2 (en) * 2003-04-24 2005-07-05 Fast Heat Inc. Apparatus for protecting thermocouple circuits in thermoplastic injection moulding equipment
CA2471439A1 (en) * 2003-06-20 2004-12-20 Mold-Masters Limited Mold and hot runner controller located on the machine platen
US7160100B2 (en) 2004-01-06 2007-01-09 Mold-Masters Limited Injection molding apparatus having an elongated nozzle incorporating multiple nozzle bodies in tandem
JP2005297566A (ja) * 2004-04-07 2005-10-27 Mold Masters Ltd 加熱されるノズル本体セグメント及び加熱されないノズル本体セグメントを有するノズル本体を備えたノズル
CA2482254A1 (en) * 2004-04-07 2005-10-07 Mold-Masters Limited Modular injection nozzle having a thermal barrier
US7585166B2 (en) * 2005-05-02 2009-09-08 Buja Frederick J System for monitoring temperature and pressure during a molding process
US20070082029A1 (en) * 2005-10-07 2007-04-12 Aimutis William R Fiber satiety compositions
US7320588B2 (en) 2005-10-12 2008-01-22 Mold-Masters (2007) Limited Distribution assembly for an injection molding apparatus
US8790256B2 (en) 2006-08-14 2014-07-29 Frederick J. Buja System and method employing a thermocouple junction for monitoring of physiological parameters
DE102007061311B4 (de) * 2006-12-22 2022-08-11 Mold-Masters (2007) Limited Spritzgießsystem
CN101816103B (zh) * 2007-10-02 2013-06-19 奥斯兰姆有限公司 插塞装置、插塞连接器以及制造插塞装置的方法
US8986205B2 (en) 2010-05-14 2015-03-24 Frederick J. Buja Sensor for measurement of temperature and pressure for a cyclic process
US9573435B2 (en) * 2013-09-29 2017-02-21 Elka Suspension Inc. Dual inline hydraulic device
CN104568198B (zh) * 2014-12-31 2017-11-14 广东工业大学 一种多层pcb微孔钻削温度测量装置及方法
KR101690764B1 (ko) * 2015-04-21 2016-12-28 김창겸 핫런너장치의 매니폴드 어셈블리
CN108943597B (zh) * 2018-06-27 2020-05-01 昆山市金联科技有限公司 一种塑料制品加工系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4150281A (en) * 1978-03-13 1979-04-17 Tempco Electric Heater Corporation Electric heater construction
US4533787A (en) * 1981-11-26 1985-08-06 Autophon Ag. Printed circuit assembly
JPS61115108A (ja) * 1984-11-09 1986-06-02 Purasutoron Kk ホツトランナ多点ゲ−トの温度制御方法
JPS61134218A (ja) * 1984-12-05 1986-06-21 Shigeru Tsutsumi 熱可塑性合成樹脂射出成形システムにおけるホツトランナ−の温度制御表示装置
JPH035112A (ja) * 1989-06-01 1991-01-10 Sanri Kk ランナーレス射出成形機における間欠加熱方法およびその装置
CA2022122C (en) * 1990-07-27 1998-02-03 Jobst Ulrich Gellert Pre-wired injection molding assembly
US5030084A (en) * 1990-09-04 1991-07-09 Mold-Masters Limited Pre-wired injection molding assembly

Also Published As

Publication number Publication date
AU657065B2 (en) 1995-02-23
EP0606043A1 (de) 1994-07-13
CA2109555C (en) 1997-04-08
EP0606043B1 (de) 1997-01-29
ES2098713T3 (es) 1997-05-01
AU5074593A (en) 1994-06-23
US5320513A (en) 1994-06-14
ATE148390T1 (de) 1997-02-15
BR9304574A (pt) 1994-06-14
JPH06210689A (ja) 1994-08-02
DE69307862D1 (de) 1997-03-13
CA2109555A1 (en) 1994-06-11
KR940017972A (ko) 1994-07-27
DK0606043T3 (da) 1997-08-11
JPH0773868B2 (ja) 1995-08-09
MX9307647A (es) 1994-06-30
KR970006229B1 (ko) 1997-04-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee