DE69305251T2 - Verwendung von Oxalylchlorid für die Herstellung chlorid-dotierter SiO2-Schichten auf Silikon-Substraten - Google Patents
Verwendung von Oxalylchlorid für die Herstellung chlorid-dotierter SiO2-Schichten auf Silikon-SubstratenInfo
- Publication number
- DE69305251T2 DE69305251T2 DE69305251T DE69305251T DE69305251T2 DE 69305251 T2 DE69305251 T2 DE 69305251T2 DE 69305251 T DE69305251 T DE 69305251T DE 69305251 T DE69305251 T DE 69305251T DE 69305251 T2 DE69305251 T2 DE 69305251T2
- Authority
- DE
- Germany
- Prior art keywords
- chloride
- production
- sio2 layers
- silicone substrates
- doped sio2
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title 2
- CTSLXHKWHWQRSH-UHFFFAOYSA-N oxalyl chloride Chemical compound ClC(=O)C(Cl)=O CTSLXHKWHWQRSH-UHFFFAOYSA-N 0.000 title 2
- 229910052681 coesite Inorganic materials 0.000 title 1
- 229910052906 cristobalite Inorganic materials 0.000 title 1
- 229920001296 polysiloxane Polymers 0.000 title 1
- 239000000377 silicon dioxide Substances 0.000 title 1
- 235000012239 silicon dioxide Nutrition 0.000 title 1
- 229910052682 stishovite Inorganic materials 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- 229910052905 tridymite Inorganic materials 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/02131—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being halogen doped silicon oxides, e.g. FSG
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
- H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
- H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/3165—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation
- H01L21/31654—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself
- H01L21/31658—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself by thermal oxidation, e.g. of SiGe
- H01L21/31662—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself by thermal oxidation, e.g. of SiGe of silicon in uncombined form
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/891,484 US5721176A (en) | 1992-05-29 | 1992-05-29 | Use of oxalyl chloride to form chloride-doped silicon dioxide films of silicon substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69305251D1 DE69305251D1 (de) | 1996-11-14 |
DE69305251T2 true DE69305251T2 (de) | 1997-02-13 |
Family
ID=25398271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69305251T Expired - Fee Related DE69305251T2 (de) | 1992-05-29 | 1993-05-27 | Verwendung von Oxalylchlorid für die Herstellung chlorid-dotierter SiO2-Schichten auf Silikon-Substraten |
Country Status (6)
Country | Link |
---|---|
US (1) | US5721176A (de) |
EP (1) | EP0577262B1 (de) |
JP (1) | JP2559195B2 (de) |
KR (1) | KR0143755B1 (de) |
DE (1) | DE69305251T2 (de) |
SG (1) | SG42804A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6387827B1 (en) | 1997-03-28 | 2002-05-14 | Imec (Vzw) | Method for growing thin silicon oxides on a silicon substrate using chlorine precursors |
US6303522B1 (en) | 1997-11-19 | 2001-10-16 | Imec Vzw | Oxidation in an ambient comprising ozone and the reaction products of an organic chloro-carbon precursor |
WO2002003438A1 (en) * | 2000-07-06 | 2002-01-10 | Mattson Thermal Products Inc. | Method and apparatus for rapid thermal processing (rtp) of semiconductor wafers |
CN117862147B (zh) * | 2024-03-12 | 2024-05-17 | 粤芯半导体技术股份有限公司 | 炉管设备的清洗方法及半导体工艺方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2816140A (en) * | 1955-07-01 | 1957-12-10 | Du Pont | Process for the production of oxalyl chloride |
US3793263A (en) * | 1972-02-14 | 1974-02-19 | Standard Oil Co | Polymerization catalyst and process using a chloride treated supported molybdenum oxide |
JPS5754331A (de) * | 1980-08-11 | 1982-03-31 | Western Electric Co | |
US4612258A (en) * | 1984-12-21 | 1986-09-16 | Zilog, Inc. | Method for thermally oxidizing polycide substrates in a dry oxygen environment and semiconductor circuit structures produced thereby |
US4606935A (en) * | 1985-10-10 | 1986-08-19 | International Business Machines Corporation | Process and apparatus for producing high purity oxidation on a semiconductor substrate |
EP0405205A3 (en) * | 1989-06-12 | 1992-05-13 | Seiko Instruments Inc. | Method of producing mos type semiconductor device |
-
1992
- 1992-05-29 US US07/891,484 patent/US5721176A/en not_active Expired - Fee Related
-
1993
- 1993-05-27 KR KR1019930009273A patent/KR0143755B1/ko not_active IP Right Cessation
- 1993-05-27 SG SG1995002046A patent/SG42804A1/en unknown
- 1993-05-27 DE DE69305251T patent/DE69305251T2/de not_active Expired - Fee Related
- 1993-05-27 EP EP93304143A patent/EP0577262B1/de not_active Expired - Lifetime
- 1993-05-28 JP JP5126537A patent/JP2559195B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5721176A (en) | 1998-02-24 |
EP0577262A3 (de) | 1994-10-12 |
SG42804A1 (en) | 1997-10-17 |
DE69305251D1 (de) | 1996-11-14 |
EP0577262B1 (de) | 1996-10-09 |
EP0577262A2 (de) | 1994-01-05 |
KR0143755B1 (ko) | 1998-08-17 |
JPH0697157A (ja) | 1994-04-08 |
JP2559195B2 (ja) | 1996-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Free format text: PATENTANWAELTE RUFF, WILHELM, BEIER, DAUSTER & PARTNER, 70173 STUTTGART |
|
8339 | Ceased/non-payment of the annual fee |