DE69230630D1 - Integrierte Schaltungspackung mit einem Kühlmechanismus - Google Patents
Integrierte Schaltungspackung mit einem KühlmechanismusInfo
- Publication number
- DE69230630D1 DE69230630D1 DE69230630T DE69230630T DE69230630D1 DE 69230630 D1 DE69230630 D1 DE 69230630D1 DE 69230630 T DE69230630 T DE 69230630T DE 69230630 T DE69230630 T DE 69230630T DE 69230630 D1 DE69230630 D1 DE 69230630D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- cooling mechanism
- circuit pack
- pack
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4336—Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3272631A JP2852148B2 (ja) | 1991-10-21 | 1991-10-21 | 集積回路パッケージの冷却構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69230630D1 true DE69230630D1 (de) | 2000-03-09 |
DE69230630T2 DE69230630T2 (de) | 2000-09-28 |
Family
ID=17516625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69230630T Expired - Fee Related DE69230630T2 (de) | 1991-10-21 | 1992-10-21 | Integrierte Schaltungspackung mit einem Kühlmechanismus |
Country Status (5)
Country | Link |
---|---|
US (1) | US5329419A (de) |
EP (1) | EP0538833B1 (de) |
JP (1) | JP2852148B2 (de) |
CA (1) | CA2081045C (de) |
DE (1) | DE69230630T2 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2500757B2 (ja) * | 1993-06-21 | 1996-05-29 | 日本電気株式会社 | 集積回路の冷却構造 |
US5831824A (en) * | 1996-01-31 | 1998-11-03 | Motorola, Inc. | Apparatus for spray-cooling multiple electronic modules |
US5675473A (en) * | 1996-02-23 | 1997-10-07 | Motorola, Inc. | Apparatus and method for shielding an electronic module from electromagnetic radiation |
US5687577A (en) * | 1996-04-10 | 1997-11-18 | Motorola, Inc. | Apparatus and method for spray-cooling an electronic module |
US5718117A (en) * | 1996-04-10 | 1998-02-17 | Motorola, Inc. | Apparatus and method for spray-cooling an electronic module |
US5731542A (en) * | 1996-05-23 | 1998-03-24 | Motorola, Inc. | Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate |
US6111749A (en) * | 1996-09-25 | 2000-08-29 | International Business Machines Corporation | Flexible cold plate having a one-piece coolant conduit and method employing same |
US5920457A (en) * | 1996-09-25 | 1999-07-06 | International Business Machines Corporation | Apparatus for cooling electronic devices using a flexible coolant conduit |
US6222264B1 (en) | 1999-10-15 | 2001-04-24 | Dell Usa, L.P. | Cooling apparatus for an electronic package |
US6519151B2 (en) | 2001-06-27 | 2003-02-11 | International Business Machines Corporation | Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof |
DE10132874A1 (de) * | 2001-07-06 | 2003-01-23 | Zdenko Knezevic | Emissionsarme Kühlvorrichtung und Verfahren zum emissionsarmen Kühlen |
US6980450B2 (en) * | 2002-01-24 | 2005-12-27 | Inverters Unlimited, Inc. | High power density inverter and components thereof |
US7167366B2 (en) * | 2002-09-11 | 2007-01-23 | Kioan Cheon | Soft cooling jacket for electronic device |
TWM248227U (en) * | 2003-10-17 | 2004-10-21 | Hon Hai Prec Ind Co Ltd | Liquid cooling apparatus |
JP2006190707A (ja) * | 2004-12-28 | 2006-07-20 | Toshiba Corp | 電子機器とこの電子機器が適用されるテレビジョン受像装置 |
US7605581B2 (en) | 2005-06-16 | 2009-10-20 | Delta Design, Inc. | Apparatus and method for controlling die force in a semiconductor device testing assembly |
US7298618B2 (en) * | 2005-10-25 | 2007-11-20 | International Business Machines Corporation | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled |
US7537047B2 (en) * | 2006-03-23 | 2009-05-26 | Foxconn Technology Co., Ltd. | Liquid-cooling heat sink |
US20080047694A1 (en) * | 2006-08-27 | 2008-02-28 | Delano Andrew D | Heat transfer apparatus and methods |
US7480142B2 (en) * | 2006-12-12 | 2009-01-20 | Cummins Power Generation Ip, Inc. | Boost spring holder for securing a power device to a heatsink |
WO2009009516A2 (en) * | 2007-07-12 | 2009-01-15 | Honeywell International Inc. | Nano shower for chip-scale cooling |
US7508676B1 (en) * | 2008-04-11 | 2009-03-24 | International Business Machines Corporation | Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability |
EP2264594B1 (de) | 2009-06-18 | 2011-10-12 | Software AG | Brokersystem für mehrere Broker, Clients und Server in einem heterogenen Netzwerk |
US8368208B2 (en) | 2010-10-01 | 2013-02-05 | Raytheon Company | Semiconductor cooling apparatus |
US9553038B2 (en) | 2012-04-02 | 2017-01-24 | Raytheon Company | Semiconductor cooling apparatus |
US9472487B2 (en) | 2012-04-02 | 2016-10-18 | Raytheon Company | Flexible electronic package integrated heat exchanger with cold plate and risers |
DE102016112279A1 (de) * | 2016-07-05 | 2018-01-11 | Te Connectivity Germany Gmbh | Kontakteinrichtung zur Hochstromübertragung |
US10575438B1 (en) | 2018-12-14 | 2020-02-25 | Juniper Networks, Inc | Apparatus, system, and method for cooling multi-chip modules via clustered fluid-cooled plates |
KR102497950B1 (ko) * | 2021-02-04 | 2023-02-10 | 제엠제코(주) | 반도체 부품 쿨링 시스템, 반도체 부품 쿨링 시스템 제조방법, 및 반도체 부품 쿨링 시스템이 적용된 반도체 패키지 |
US11641727B2 (en) | 2021-03-23 | 2023-05-02 | Hewlett Packard Enterprise Development Lp | Cooling system for an electronic circuit module |
US11582866B1 (en) * | 2021-07-22 | 2023-02-14 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems including a power device-embedded PCB directly joined with a cooling assembly and method of forming the same |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3586101A (en) * | 1969-12-22 | 1971-06-22 | Ibm | Cooling system for data processing equipment |
US3774677A (en) * | 1971-02-26 | 1973-11-27 | Ibm | Cooling system providing spray type condensation |
US3908188A (en) * | 1974-08-14 | 1975-09-23 | Us Air Force | Heat sink for microstrip circuit |
US4226281A (en) * | 1979-06-11 | 1980-10-07 | International Business Machines Corporation | Thermal conduction module |
US4245273A (en) * | 1979-06-29 | 1981-01-13 | International Business Machines Corporation | Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices |
US4381032A (en) * | 1981-04-23 | 1983-04-26 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
JPH0673364B2 (ja) * | 1983-10-28 | 1994-09-14 | 株式会社日立製作所 | 集積回路チップ冷却装置 |
JPS60160150A (ja) * | 1984-01-26 | 1985-08-21 | Fujitsu Ltd | 集積回路の冷却装置 |
JPH06101523B2 (ja) * | 1985-03-04 | 1994-12-12 | 株式会社日立製作所 | 集積回路チツプ冷却装置 |
JPS61222242A (ja) * | 1985-03-28 | 1986-10-02 | Fujitsu Ltd | 冷却装置 |
JPS61226946A (ja) * | 1985-04-01 | 1986-10-08 | Hitachi Ltd | 集積回路チツプ冷却装置 |
JPS61276242A (ja) * | 1985-05-30 | 1986-12-06 | Hitachi Ltd | 半導体モジユ−ル |
US4748495A (en) * | 1985-08-08 | 1988-05-31 | Dypax Systems Corporation | High density multi-chip interconnection and cooling package |
DE3688962T2 (de) * | 1985-10-04 | 1993-12-09 | Fujitsu Ltd | Kühlsystem für eine elektronische Schaltungsanordnung. |
US4750086A (en) * | 1985-12-11 | 1988-06-07 | Unisys Corporation | Apparatus for cooling integrated circuit chips with forced coolant jet |
US4759403A (en) * | 1986-04-30 | 1988-07-26 | International Business Machines Corp. | Hydraulic manifold for water cooling of multi-chip electric modules |
JPS6381959A (ja) * | 1986-09-26 | 1988-04-12 | Hitachi Ltd | 半導体装置 |
JPH07112033B2 (ja) * | 1987-03-16 | 1995-11-29 | 富士通株式会社 | 冷却モジユ−ル構造 |
JPH065700B2 (ja) * | 1987-07-22 | 1994-01-19 | 株式会社日立製作所 | 電子回路デバイスの冷却装置 |
US4942497A (en) * | 1987-07-24 | 1990-07-17 | Nec Corporation | Cooling structure for heat generating electronic components mounted on a substrate |
US4791983A (en) * | 1987-10-13 | 1988-12-20 | Unisys Corporation | Self-aligning liquid-cooling assembly |
CA1283225C (en) * | 1987-11-09 | 1991-04-16 | Shinji Mine | Cooling system for three-dimensional ic package |
US4809134A (en) * | 1988-04-18 | 1989-02-28 | Unisys Corporation | Low stress liquid cooling assembly |
DE68918156T2 (de) * | 1988-05-09 | 1995-01-12 | Nippon Electric Co | Flache Kühlungsstruktur für integrierte Schaltung. |
-
1991
- 1991-10-21 JP JP3272631A patent/JP2852148B2/ja not_active Expired - Fee Related
-
1992
- 1992-10-21 DE DE69230630T patent/DE69230630T2/de not_active Expired - Fee Related
- 1992-10-21 CA CA002081045A patent/CA2081045C/en not_active Expired - Fee Related
- 1992-10-21 US US07/964,028 patent/US5329419A/en not_active Expired - Fee Related
- 1992-10-21 EP EP92118017A patent/EP0538833B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0538833A1 (de) | 1993-04-28 |
CA2081045C (en) | 1997-05-27 |
JPH05109954A (ja) | 1993-04-30 |
CA2081045A1 (en) | 1993-04-22 |
DE69230630T2 (de) | 2000-09-28 |
EP0538833B1 (de) | 2000-02-02 |
JP2852148B2 (ja) | 1999-01-27 |
US5329419A (en) | 1994-07-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |