DE69228783D1 - Strömungserzeugende Paneelen für die stromlose Kupferplattierung komplexer Konstruktionen - Google Patents

Strömungserzeugende Paneelen für die stromlose Kupferplattierung komplexer Konstruktionen

Info

Publication number
DE69228783D1
DE69228783D1 DE69228783T DE69228783T DE69228783D1 DE 69228783 D1 DE69228783 D1 DE 69228783D1 DE 69228783 T DE69228783 T DE 69228783T DE 69228783 T DE69228783 T DE 69228783T DE 69228783 D1 DE69228783 D1 DE 69228783D1
Authority
DE
Germany
Prior art keywords
copper plating
electroless copper
flow generating
complex structures
generating panels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69228783T
Other languages
English (en)
Other versions
DE69228783T2 (de
Inventor
Sunghee Yoon
Mark R Forsyth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of DE69228783D1 publication Critical patent/DE69228783D1/de
Publication of DE69228783T2 publication Critical patent/DE69228783T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
DE69228783T 1991-08-26 1992-08-26 Strömungserzeugende Paneelen für die stromlose Kupferplattierung komplexer Konstruktionen Expired - Fee Related DE69228783T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US75013791A 1991-08-26 1991-08-26

Publications (2)

Publication Number Publication Date
DE69228783D1 true DE69228783D1 (de) 1999-05-06
DE69228783T2 DE69228783T2 (de) 1999-12-02

Family

ID=25016660

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69228783T Expired - Fee Related DE69228783T2 (de) 1991-08-26 1992-08-26 Strömungserzeugende Paneelen für die stromlose Kupferplattierung komplexer Konstruktionen

Country Status (9)

Country Link
US (1) US5603768A (de)
EP (1) EP0530665B1 (de)
JP (1) JPH05209281A (de)
KR (1) KR960015096B1 (de)
AU (1) AU647658B2 (de)
CA (1) CA2076701C (de)
DE (1) DE69228783T2 (de)
ES (1) ES2129419T3 (de)
IL (1) IL102936A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6225223B1 (en) 1999-08-16 2001-05-01 Taiwan Semiconductor Manufacturing Company Method to eliminate dishing of copper interconnects

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2073679A (en) * 1935-02-05 1937-03-16 Western Electric Co Electroplating apparatus
US2691144A (en) * 1952-07-12 1954-10-05 Fansteel Metallurgical Corp Electroforming apparatus for rectifier disks
US3257308A (en) * 1961-07-11 1966-06-21 Western Electric Co Article holder for electroplating articles
DE1239160B (de) * 1963-05-04 1967-04-20 Karl Schmidt Ges Mit Beschraen Vorrichtung zum Galvanisieren ringfoermiger Koerper
US3648653A (en) * 1970-06-01 1972-03-14 Bell Telephone Labor Inc Liquid phase crystal growth apparatus
US3972785A (en) * 1974-06-17 1976-08-03 The Empire Plating Company Electroplating rack
FR2316761A1 (fr) * 1975-07-04 1977-01-28 Olivier Jean Procede et reacteur pour soumettre une matiere a des ondes electromagnetiques
US4322592A (en) * 1980-08-22 1982-03-30 Rca Corporation Susceptor for heating semiconductor substrates
US4312716A (en) * 1980-11-21 1982-01-26 Western Electric Co., Inc. Supporting an array of elongate articles
CA1219179A (en) * 1982-09-27 1987-03-17 Etd Technology, Inc. Apparatus and method for electroless plating
DE3305564C1 (de) * 1983-02-15 1984-03-22 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Aufbau von metallisierten Leiterbahnen und Durchkontaktierungen an gelochten Leiterplatten
SU1167663A1 (ru) * 1984-01-10 1985-07-15 Предприятие П/Я Х-5618 Кассета дл групповой обработки радиодеталей
DE3411208C2 (de) * 1984-03-27 1987-01-29 Leybold-Heraeus GmbH, 5000 Köln Haltevorrichtung für Substrate, insbesondere in Vakuum-Beschichtungsanlagen
US4634512A (en) * 1984-08-21 1987-01-06 Komag, Inc. Disk and plug

Also Published As

Publication number Publication date
AU2131392A (en) 1993-03-11
DE69228783T2 (de) 1999-12-02
IL102936A (en) 1996-03-31
IL102936A0 (en) 1993-02-21
EP0530665A1 (de) 1993-03-10
CA2076701A1 (en) 1993-02-27
EP0530665B1 (de) 1999-03-31
JPH05209281A (ja) 1993-08-20
ES2129419T3 (es) 1999-06-16
CA2076701C (en) 1997-12-23
AU647658B2 (en) 1994-03-24
US5603768A (en) 1997-02-18
KR960015096B1 (ko) 1996-10-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee