DE69228214D1 - Verbinderanordnungen zum Testen integrierter Schaltungen im Gehäuse - Google Patents

Verbinderanordnungen zum Testen integrierter Schaltungen im Gehäuse

Info

Publication number
DE69228214D1
DE69228214D1 DE69228214T DE69228214T DE69228214D1 DE 69228214 D1 DE69228214 D1 DE 69228214D1 DE 69228214 T DE69228214 T DE 69228214T DE 69228214 T DE69228214 T DE 69228214T DE 69228214 D1 DE69228214 D1 DE 69228214D1
Authority
DE
Germany
Prior art keywords
housing
integrated circuits
connector assemblies
testing integrated
testing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69228214T
Other languages
English (en)
Other versions
DE69228214T2 (de
Inventor
Michael J Steen
Robert H Wardwell
Joseph A Mckenzie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69228214D1 publication Critical patent/DE69228214D1/de
Application granted granted Critical
Publication of DE69228214T2 publication Critical patent/DE69228214T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0425—Test clips, e.g. for IC's
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/912—Electrical connectors with testing means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE69228214T 1991-08-14 1992-08-07 Verbinderanordnungen zum Testen integrierter Schaltungen im Gehäuse Expired - Fee Related DE69228214T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/744,763 US5205741A (en) 1991-08-14 1991-08-14 Connector assembly for testing integrated circuit packages

Publications (2)

Publication Number Publication Date
DE69228214D1 true DE69228214D1 (de) 1999-03-04
DE69228214T2 DE69228214T2 (de) 1999-06-02

Family

ID=24993907

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69228214T Expired - Fee Related DE69228214T2 (de) 1991-08-14 1992-08-07 Verbinderanordnungen zum Testen integrierter Schaltungen im Gehäuse

Country Status (4)

Country Link
US (1) US5205741A (de)
EP (1) EP0528608B1 (de)
JP (1) JPH05196692A (de)
DE (1) DE69228214T2 (de)

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JPH0636834A (ja) * 1992-07-20 1994-02-10 Kiyousera Elco Kk メモリカードコネクタ装置
US5423687A (en) * 1993-03-08 1995-06-13 The Whitaker Corporation Electronic component upgrade connector and contact
US5463324A (en) * 1993-10-26 1995-10-31 Hewlett-Packard Company Probe with contacts that interdigitate with and wedge between adjacent legs of an IC or the like
US5423688A (en) * 1993-12-17 1995-06-13 Itt Industries, Inc. Clip for small outline IC device
US5415560A (en) * 1993-12-17 1995-05-16 Itt Corporation Test clip for IC device
DE19513275A1 (de) * 1994-06-27 1996-01-11 Hewlett Packard Co Sondenadapter zum Testen von IC-Bausteinen
US5564932A (en) * 1994-11-14 1996-10-15 Castleman; Mark-Andrew B. Customizeable interconnect device for stacking electrical components of varying configuration
JP3474655B2 (ja) * 1994-11-24 2003-12-08 株式会社ルネサスＬｓｉデザイン エミュレータプローブおよびエミュレータプローブを用いたデバッグ方法
US5625299A (en) * 1995-02-03 1997-04-29 Uhling; Thomas F. Multiple lead analog voltage probe with high signal integrity over a wide band width
JPH08278900A (ja) * 1995-04-04 1996-10-22 Mitsubishi Electric Corp エミュレータプローブ
JPH0997661A (ja) * 1995-10-02 1997-04-08 Sumitomo Metal Ind Ltd 電子部品用ソケット
US5949238A (en) * 1995-12-20 1999-09-07 Siemens Medical Systems, Inc. Method and apparatus for probing large pin count integrated circuits
US5692911A (en) * 1996-03-27 1997-12-02 Electronic Products, Inc. Flexible electrical test fixure for integrated circuits on prototype and production printed circuit boards
US5982635A (en) * 1996-10-23 1999-11-09 Concept Manufacturing, Incorporated Signal adaptor board for a pin grid array
US5934933A (en) * 1997-06-20 1999-08-10 Cts Corporation Snap lock membrane connector
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6320371B1 (en) * 1998-01-08 2001-11-20 Seagate Technology Llc Flex lead extender
US6194904B1 (en) * 1998-05-19 2001-02-27 R-Tec Corporation Socket test probe and method of making
US6510606B2 (en) * 1998-06-15 2003-01-28 Lockheed Martin Corporation Multichip module
JP4007704B2 (ja) 1998-11-10 2007-11-14 ナブテスコ株式会社 光学的立体造形用の光硬化性樹脂組成物
KR100533569B1 (ko) * 1999-05-27 2005-12-06 삼성전자주식회사 테스트용 반도체 패키지 및 그 제조 방법
JP2000357571A (ja) * 1999-06-14 2000-12-26 Tokyo Eletec Kk Ｉｃソケット
US6428327B1 (en) 1999-10-14 2002-08-06 Unisys Corporation Flexible adapter for use between LGA device and printed circuit board
US6540527B1 (en) 2000-04-28 2003-04-01 Unisys Corporation Method and adapter for reworking a circuit containing an LGA device
EP1395864A2 (de) * 2001-05-25 2004-03-10 Transparent Networks, Inc. Optisches faser-array mit hoher faserdichte
US6769923B2 (en) * 2001-12-17 2004-08-03 Lsi Logic Corporation Fluted signal pin, cap, membrane, and stanchion for a ball grid array
US6776662B2 (en) * 2002-09-27 2004-08-17 Agilent Technologies, Inc. Discrete connector termination adapter
US20040193989A1 (en) * 2003-03-28 2004-09-30 Sun Microsystems, Inc. Test system including a test circuit board including through-hole vias and blind vias
US7131047B2 (en) * 2003-04-07 2006-10-31 Sun Microsystems, Inc. Test system including a test circuit board including resistive devices
TWI283950B (en) * 2003-04-23 2007-07-11 Hon Hai Prec Ind Co Ltd Electrical connector
US7528616B2 (en) * 2005-05-27 2009-05-05 Lsi Corporation Zero ATE insertion force interposer daughter card
KR100761836B1 (ko) * 2006-02-04 2007-09-28 삼성전자주식회사 입체형 소켓 보드 및 이를 포함하는 병렬 테스트 보드시스템
FI122124B (fi) * 2006-07-04 2011-08-31 Abb Oy Menetelmä jarrukatkojan ohjaamiseksi, jarrukatkoja ja taajuusmuuttaja
EP1876643A1 (de) * 2006-07-07 2008-01-09 STMicroelectronics S.r.l. Halbleiterelement mit Anschlüssen
US7278859B1 (en) * 2006-08-31 2007-10-09 Intel Corporation Extended package substrate
CN101616538B (zh) * 2008-06-27 2011-07-27 深圳富泰宏精密工业有限公司 柔性印刷线路模组
KR100989673B1 (ko) * 2010-04-23 2010-10-26 지에프텍 주식회사 표면 실장형 집적회로 패키지용 테스트 소켓
JP5150761B1 (ja) * 2011-11-10 2013-02-27 株式会社東芝 電子機器
US9265170B2 (en) * 2013-10-28 2016-02-16 Intel Corporation Integrated circuit connectors
US9490560B2 (en) * 2014-12-19 2016-11-08 Intel Corporation Multi-array bottom-side connector using spring bias
JP6661733B1 (ja) * 2018-11-28 2020-03-11 株式会社フジクラ ケーブル及び画像伝送システム

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4084869A (en) * 1976-11-10 1978-04-18 Intel Corporation Interconnector for integrated circuit package
US4541676A (en) * 1984-03-19 1985-09-17 Itt Corporation Chip carrier test adapter
US4639058A (en) * 1984-08-22 1987-01-27 Minnesota Mining & Manufacturing Co. Low profile test clip and handle therefor
US4747784A (en) * 1986-05-16 1988-05-31 Daymarc Corporation Contactor for integrated circuits
US4866374A (en) * 1984-10-12 1989-09-12 Daymarc Corporation Contactor assembly for testing integrated circuits
US4671590A (en) * 1985-03-06 1987-06-09 Minnesota Mining And Manufacturing Company Test clip for PLCC
US4716500A (en) * 1985-10-18 1987-12-29 Tektronix, Inc. Probe cable assembly
US4735580A (en) * 1986-12-22 1988-04-05 Itt Corporation Test adapter for integrated circuit carrier
DE3887599T2 (de) * 1987-08-31 1994-05-11 Everett Charles Contact Prod Prüfen von integrierten Schaltungen auf einer bestückten Leiterplatte.
US4917613A (en) * 1988-11-04 1990-04-17 Intel Corporation High density connection system
US4919623A (en) * 1989-02-13 1990-04-24 Amp Incorporated Burn-in socket for integrated circuit device
US4996476A (en) * 1989-11-06 1991-02-26 Itt Corporation Test clip for surface mount device
US5015946A (en) * 1990-02-26 1991-05-14 Tektronix, Inc. High density probe
US5166609A (en) * 1990-05-24 1992-11-24 Tektronix, Inc. Adapter and test fixture for an integrated circuit device package
US5057023A (en) * 1990-06-01 1991-10-15 Intel Corporation High density connector system

Also Published As

Publication number Publication date
US5205741A (en) 1993-04-27
JPH05196692A (ja) 1993-08-06
EP0528608A2 (de) 1993-02-24
EP0528608A3 (de) 1994-05-04
EP0528608B1 (de) 1999-01-20
DE69228214T2 (de) 1999-06-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE),

8339 Ceased/non-payment of the annual fee