DE69221783T2 - Verfahren und Vorrichtung zum automatischen Ätzen von Plättchen - Google Patents
Verfahren und Vorrichtung zum automatischen Ätzen von PlättchenInfo
- Publication number
- DE69221783T2 DE69221783T2 DE69221783T DE69221783T DE69221783T2 DE 69221783 T2 DE69221783 T2 DE 69221783T2 DE 69221783 T DE69221783 T DE 69221783T DE 69221783 T DE69221783 T DE 69221783T DE 69221783 T2 DE69221783 T2 DE 69221783T2
- Authority
- DE
- Germany
- Prior art keywords
- platelets
- automatic etching
- etching
- automatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15609091A JP2628415B2 (ja) | 1991-05-31 | 1991-05-31 | ウエーハの自動エッチング装置 |
JP15609191A JP2871173B2 (ja) | 1991-05-31 | 1991-05-31 | ウエーハ移替装置及び方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69221783D1 DE69221783D1 (de) | 1997-10-02 |
DE69221783T2 true DE69221783T2 (de) | 1998-02-05 |
Family
ID=26483922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69221783T Expired - Fee Related DE69221783T2 (de) | 1991-05-31 | 1992-06-01 | Verfahren und Vorrichtung zum automatischen Ätzen von Plättchen |
Country Status (3)
Country | Link |
---|---|
US (1) | US5246528A (de) |
EP (2) | EP0657920A1 (de) |
DE (1) | DE69221783T2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0162102B1 (ko) * | 1991-05-29 | 1999-02-01 | 이노우에 아키라 | 반도체 제조장치 |
DE4305748A1 (de) * | 1993-02-25 | 1994-09-01 | Leybold Ag | Vorrichtung zum Beschichten und/oder Ätzen von Substraten in einer Vakuumkammer |
US5340437A (en) * | 1993-10-08 | 1994-08-23 | Memc Electronic Materials, Inc. | Process and apparatus for etching semiconductor wafers |
US5950643A (en) * | 1995-09-06 | 1999-09-14 | Miyazaki; Takeshiro | Wafer processing system |
US6090711A (en) * | 1997-09-30 | 2000-07-18 | Semitool, Inc. | Methods for controlling semiconductor workpiece surface exposure to processing liquids |
US6457929B2 (en) | 1998-11-03 | 2002-10-01 | Seh America, Inc. | Apparatus and method for automatically transferring wafers between wafer holders in a liquid environment |
US6494219B1 (en) * | 2000-03-22 | 2002-12-17 | Applied Materials, Inc. | Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits |
DE10319521A1 (de) * | 2003-04-30 | 2004-11-25 | Scp Germany Gmbh | Verfahren und Vorrichtung zum Behandeln von scheibenförmigen Substraten |
JP5478604B2 (ja) * | 2008-03-31 | 2014-04-23 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | シリコンウェハの端部をエッチングするための方法 |
WO2010059556A1 (en) * | 2008-11-19 | 2010-05-27 | Memc Electronic Materials, Inc. | Method and system for stripping the edge of a semiconductor wafer |
US8853054B2 (en) | 2012-03-06 | 2014-10-07 | Sunedison Semiconductor Limited | Method of manufacturing silicon-on-insulator wafers |
CN109300822B (zh) * | 2018-11-21 | 2024-01-26 | 江苏润达新能源科技有限公司 | 一种不需放置治具去除qfn细微毛边的蚀刻滚桶槽机台 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2138775B (en) * | 1983-04-25 | 1987-02-04 | Ruska Instr Corp | Transferring e.g. semi-conductor wafers between carriers |
JPS6169983A (ja) * | 1984-09-12 | 1986-04-10 | Hitachi Ltd | 処理装置 |
JPS636857A (ja) * | 1986-06-26 | 1988-01-12 | Fujitsu Ltd | ウエ−ハ移し替え装置 |
JPS63248449A (ja) * | 1987-04-03 | 1988-10-14 | Tadahiro Omi | ドラフトチヤンバ |
JPH073634Y2 (ja) * | 1987-12-28 | 1995-01-30 | 株式会社トムコ | ウェハ液洗乾燥装置 |
JPH0785471B2 (ja) * | 1990-10-16 | 1995-09-13 | 信越半導体株式会社 | エッチング装置 |
-
1992
- 1992-05-29 US US07/890,195 patent/US5246528A/en not_active Expired - Fee Related
- 1992-06-01 EP EP95100530A patent/EP0657920A1/de not_active Withdrawn
- 1992-06-01 EP EP92305006A patent/EP0519613B1/de not_active Expired - Lifetime
- 1992-06-01 DE DE69221783T patent/DE69221783T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69221783D1 (de) | 1997-10-02 |
EP0519613A1 (de) | 1992-12-23 |
US5246528A (en) | 1993-09-21 |
EP0519613B1 (de) | 1997-08-27 |
EP0657920A1 (de) | 1995-06-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69330470T2 (de) | Vorrichtung und Verfahren zum Zentrifugaltrennen von Vollblut | |
DE69125156D1 (de) | Verfahren und vorrichtung zum wahrnehmen von objekten | |
DE68928468D1 (de) | Vorrichtung und Verfahren zur Kühlung von Substraten | |
DE69230022D1 (de) | Verfahren und Vorrichtung zur Gewinnung von Objekttypen | |
DE68928192D1 (de) | Vorrichtung und Verfahren zur Positionsdetektion | |
DE69226511D1 (de) | Verfahren und Vorrichtung zur Belichtung von Substraten | |
DE69221630D1 (de) | Vorrichtung und verfahren zum beschichten von partikeln | |
DE69225080T2 (de) | Vorrichtung und Verfahren zur Aufzeichnung von Transaktionen | |
DE69119787D1 (de) | Apherese verfahren und vorrichtung dafuer | |
DE69212771D1 (de) | Verfahren und Vorrichtung zur Ultraschallprüfung von Werkzeugen | |
DE59204722D1 (de) | Verfahren und Vorrichtung zum Kommissionieren | |
DE59206795D1 (de) | Verfahren und Vorrichtung zum einseitigen Behandeln von plattenförmigen Gegenständen | |
DE69210650D1 (de) | Vorrichtung und Verfahren zum Elektroplattieren | |
DE68926031D1 (de) | Verfahren und Vorrichtung zur Entfernung von Unterfarben | |
DE69221783D1 (de) | Verfahren und Vorrichtung zum automatischen Ätzen von Plättchen | |
DE69033452D1 (de) | Vorrichtung und Verfahren zum Behandeln von Substraten | |
DE69224764T2 (de) | Verfahren und Vorrichtung zur Beurteilung von automatischen Herstellungsmöglichkeiten | |
DE69132520D1 (de) | Vorrichtung und Verfahren zum Unterscheiden von Münzen | |
DE3677876D1 (de) | Verfahren und vorrichtung zum entfernen von vorgarnresten an vorgarnspulen. | |
DE69033535T2 (de) | Verfahren und vorrichtung zur reinigung von bohrklein | |
DE59001618D1 (de) | Verfahren und vorrichtung zum orten von unterseeboote. | |
DE59402491D1 (de) | Verfahren und vorrichtung zum klopfenden reinigen von gegenständen | |
DE69225617D1 (de) | Vorrichtung und Verfahren zur Freigabe von Artikeln | |
DE69030942D1 (de) | Verfahren und Vorrichtung zur Zuweisung von Operationen | |
ATA37990A (de) | Vorrichtung und verfahren zum schlingen von brezeln |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |