DE69211697T2 - Antischmelzsicherungsstruktur und verfahren zu ihrer herstellung - Google Patents

Antischmelzsicherungsstruktur und verfahren zu ihrer herstellung

Info

Publication number
DE69211697T2
DE69211697T2 DE69211697T DE69211697T DE69211697T2 DE 69211697 T2 DE69211697 T2 DE 69211697T2 DE 69211697 T DE69211697 T DE 69211697T DE 69211697 T DE69211697 T DE 69211697T DE 69211697 T2 DE69211697 T2 DE 69211697T2
Authority
DE
Germany
Prior art keywords
mel
production
safety structure
safety
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69211697T
Other languages
English (en)
Other versions
DE69211697D1 (de
Inventor
William Boardman
David Chan
Kuang-Yeh Chang
Calvin Gabriel
Vivek Jain
Subhash Nariani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Semiconductors Inc
Original Assignee
VLSI Technology Inc
Philips Semiconductors Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VLSI Technology Inc, Philips Semiconductors Inc filed Critical VLSI Technology Inc
Publication of DE69211697D1 publication Critical patent/DE69211697D1/de
Application granted granted Critical
Publication of DE69211697T2 publication Critical patent/DE69211697T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76888—By rendering at least a portion of the conductor non conductive, e.g. oxidation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/055—Fuse

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE69211697T 1991-07-26 1992-07-24 Antischmelzsicherungsstruktur und verfahren zu ihrer herstellung Expired - Fee Related DE69211697T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/736,162 US5290734A (en) 1991-06-04 1991-07-26 Method for making anti-fuse structures
PCT/US1992/006163 WO1993003499A1 (en) 1991-07-26 1992-07-24 Anti-fuse structures and methods for making same

Publications (2)

Publication Number Publication Date
DE69211697D1 DE69211697D1 (de) 1996-07-25
DE69211697T2 true DE69211697T2 (de) 1996-12-05

Family

ID=24958763

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69211697T Expired - Fee Related DE69211697T2 (de) 1991-07-26 1992-07-24 Antischmelzsicherungsstruktur und verfahren zu ihrer herstellung

Country Status (5)

Country Link
US (1) US5290734A (de)
EP (1) EP0597015B1 (de)
JP (1) JP2759183B2 (de)
DE (1) DE69211697T2 (de)
WO (1) WO1993003499A1 (de)

Families Citing this family (62)

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US5477165A (en) * 1986-09-19 1995-12-19 Actel Corporation Programmable logic module and architecture for field programmable gate array device
US5552627A (en) * 1990-04-12 1996-09-03 Actel Corporation Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayers
US5541441A (en) * 1994-10-06 1996-07-30 Actel Corporation Metal to metal antifuse
US5181096A (en) * 1990-04-12 1993-01-19 Actel Corporation Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayer
US5272101A (en) * 1990-04-12 1993-12-21 Actel Corporation Electrically programmable antifuse and fabrication processes
US5381035A (en) * 1992-09-23 1995-01-10 Chen; Wenn-Jei Metal-to-metal antifuse including etch stop layer
US5404029A (en) * 1990-04-12 1995-04-04 Actel Corporation Electrically programmable antifuse element
US5614756A (en) * 1990-04-12 1997-03-25 Actel Corporation Metal-to-metal antifuse with conductive
US5780323A (en) * 1990-04-12 1998-07-14 Actel Corporation Fabrication method for metal-to-metal antifuses incorporating a tungsten via plug
US5543656A (en) * 1990-04-12 1996-08-06 Actel Corporation Metal to metal antifuse
US6171512B1 (en) 1991-02-15 2001-01-09 Canon Kabushiki Kaisha Etching solution for etching porous silicon, etching method using the etching solution and method of preparing semiconductor member using the etching solution
EP0509631A1 (de) * 1991-04-18 1992-10-21 Actel Corporation Antischmelzsicherungen mit minimalischen Oberflächen
EP0558176A1 (de) * 1992-02-26 1993-09-01 Actel Corporation Metall-Metall-Antischmelzsicherung mit verbesserter Diffusionsbarriere-Schicht
US5475253A (en) * 1992-08-21 1995-12-12 Xilinx, Inc. Antifuse structure with increased breakdown at edges
EP0592078A1 (de) * 1992-09-23 1994-04-13 Actel Corporation Antisicherung und Verfahren zu ihrer Herstellung
JP2909328B2 (ja) * 1992-11-02 1999-06-23 株式会社東芝 フィールドプログラマブルゲートアレイ
US5308795A (en) * 1992-11-04 1994-05-03 Actel Corporation Above via metal-to-metal antifuse
KR960001176B1 (ko) * 1992-12-02 1996-01-19 현대전자산업주식회사 반도체 접속장치 및 그 제조방법
US5373169A (en) * 1992-12-17 1994-12-13 Actel Corporation Low-temperature process metal-to-metal antifuse employing silicon link
US5314840A (en) * 1992-12-18 1994-05-24 International Business Machines Corporation Method for forming an antifuse element with electrical or optical programming
US5550404A (en) * 1993-05-20 1996-08-27 Actel Corporation Electrically programmable antifuse having stair aperture
US5834125A (en) * 1993-06-16 1998-11-10 Integrated Device Technology, Inc. Non-reactive anti-reflection coating
JP3199908B2 (ja) * 1993-06-22 2001-08-20 株式会社東芝 半導体集積回路のテスト回路
US5572061A (en) * 1993-07-07 1996-11-05 Actel Corporation ESD protection device for antifuses with top polysilicon electrode
US5449947A (en) * 1993-07-07 1995-09-12 Actel Corporation Read-disturb tolerant metal-to-metal antifuse and fabrication method
US5498895A (en) * 1993-07-07 1996-03-12 Actel Corporation Process ESD protection devices for use with antifuses
US5369054A (en) * 1993-07-07 1994-11-29 Actel Corporation Circuits for ESD protection of metal-to-metal antifuses during processing
US5619063A (en) * 1993-07-07 1997-04-08 Actel Corporation Edgeless, self-aligned, differential oxidation enhanced and difusion-controlled minimum-geometry antifuse and method of fabrication
US5581111A (en) * 1993-07-07 1996-12-03 Actel Corporation Dielectric-polysilicon-dielectric antifuse for field programmable logic applications
US5856234A (en) * 1993-09-14 1999-01-05 Actel Corporation Method of fabricating an antifuse
US5485031A (en) * 1993-11-22 1996-01-16 Actel Corporation Antifuse structure suitable for VLSI application
US5391513A (en) * 1993-12-22 1995-02-21 Vlsi Technology, Inc. Wet/dry anti-fuse via etch
US5587613A (en) * 1994-05-25 1996-12-24 Crosspoint Solutions, Inc. Low-capacitance, isotropically etched antifuse and method of manufacture therefor
US5633189A (en) * 1994-08-01 1997-05-27 Actel Corporation Method of making metal to metal antifuse
US5663591A (en) * 1995-02-14 1997-09-02 Crosspoint Solutions, Inc. Antifuse with double via, spacer-defined contact
US5789764A (en) * 1995-04-14 1998-08-04 Actel Corporation Antifuse with improved antifuse material
US5592016A (en) * 1995-04-14 1997-01-07 Actel Corporation Antifuse with improved antifuse material
US5741462A (en) * 1995-04-25 1998-04-21 Irori Remotely programmable matrices with memories
US5751629A (en) 1995-04-25 1998-05-12 Irori Remotely programmable matrices with memories
US6329139B1 (en) 1995-04-25 2001-12-11 Discovery Partners International Automated sorting system for matrices with memory
US5874214A (en) 1995-04-25 1999-02-23 Irori Remotely programmable matrices with memories
US6017496A (en) 1995-06-07 2000-01-25 Irori Matrices with memories and uses thereof
US6331273B1 (en) 1995-04-25 2001-12-18 Discovery Partners International Remotely programmable matrices with memories
US6416714B1 (en) 1995-04-25 2002-07-09 Discovery Partners International, Inc. Remotely programmable matrices with memories
WO1996038861A1 (en) * 1995-06-02 1996-12-05 Actel Corporation Raised tungsten plug antifuse and fabrication process
US5986322A (en) * 1995-06-06 1999-11-16 Mccollum; John L. Reduced leakage antifuse structure
US5741720A (en) * 1995-10-04 1998-04-21 Actel Corporation Method of programming an improved metal-to-metal via-type antifuse
US5759876A (en) * 1995-11-01 1998-06-02 United Technologies Corporation Method of making an antifuse structure using a metal cap layer
US5789795A (en) * 1995-12-28 1998-08-04 Vlsi Technology, Inc. Methods and apparatus for fabricationg anti-fuse devices
US5793094A (en) * 1995-12-28 1998-08-11 Vlsi Technology, Inc. Methods for fabricating anti-fuse structures
US5783467A (en) * 1995-12-29 1998-07-21 Vlsi Technology, Inc. Method of making antifuse structures using implantation of both neutral and dopant species
US5654234A (en) * 1996-04-29 1997-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. Method for forming a void-free tungsten-plug contact in the presence of a contact opening overhang
US5856213A (en) * 1996-07-25 1999-01-05 Vlsi Technology, Inc. Method of fabricating a programmable function system block using two masks and a sacrificial oxide layer between the bottom metal and an amorphous silicon antifuse structure
US5899707A (en) * 1996-08-20 1999-05-04 Vlsi Technology, Inc. Method for making doped antifuse structures
US5753540A (en) * 1996-08-20 1998-05-19 Vlsi Technology, Inc. Apparatus and method for programming antifuse structures
US5907175A (en) 1997-09-25 1999-05-25 Advanced Micro Devices, Inc Four transistor SRAM cell
TW347587B (en) * 1997-10-20 1998-12-11 United Semiconductor Corp Antifuse structure and process for producing the same
US6124165A (en) * 1999-05-26 2000-09-26 Vanguard International Semiconductor Corporation Method for making openings in a passivation layer over polycide fuses using a single mask while forming reliable tungsten via plugs on DRAMs
US6355969B1 (en) * 1999-09-27 2002-03-12 Philips Electronics North America Corporation Programmable integrated circuit structures and methods for making the same
WO2006126110A1 (en) * 2005-05-24 2006-11-30 Nxp B.V. Anti-fuse memory device
CN102473676B (zh) * 2009-07-22 2014-10-08 株式会社村田制作所 反熔丝元件
US9006794B1 (en) 2014-01-24 2015-04-14 Altera Corporation Low-voltage programmable electrical fuses

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
US4507853A (en) * 1982-08-23 1985-04-02 Texas Instruments Incorporated Metallization process for integrated circuits
US4651409A (en) * 1984-02-09 1987-03-24 Ncr Corporation Method of fabricating a high density, low power, merged vertical fuse/bipolar transistor
JPS63299251A (ja) * 1987-05-29 1988-12-06 Toshiba Corp 半導体装置の製造方法
US5017510A (en) * 1987-06-01 1991-05-21 Texas Instruments Incorporated Method of making a scalable fuse link element
DE3731621A1 (de) * 1987-09-19 1989-03-30 Texas Instruments Deutschland Verfahren zum herstellen einer elektrisch programmierbaren integrierten schaltung
US4914055A (en) * 1989-08-24 1990-04-03 Advanced Micro Devices, Inc. Semiconductor antifuse structure and method
US5989943A (en) * 1989-09-07 1999-11-23 Quicklogic Corporation Method for fabrication of programmable interconnect structure
JPH03270234A (ja) * 1990-03-20 1991-12-02 Fujitsu Ltd 半導体装置の製造法方
US5070384A (en) * 1990-04-12 1991-12-03 Actel Corporation Electrically programmable antifuse element incorporating a dielectric and amorphous silicon interlayer
EP0509631A1 (de) * 1991-04-18 1992-10-21 Actel Corporation Antischmelzsicherungen mit minimalischen Oberflächen
US5120679A (en) * 1991-06-04 1992-06-09 Vlsi Technology, Inc. Anti-fuse structures and methods for making same

Also Published As

Publication number Publication date
EP0597015A1 (de) 1994-05-18
JP2759183B2 (ja) 1998-05-28
US5290734A (en) 1994-03-01
EP0597015B1 (de) 1996-06-19
DE69211697D1 (de) 1996-07-25
JPH06509444A (ja) 1994-10-20
WO1993003499A1 (en) 1993-02-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PHILIPS SEMICONDUCTORS INC.(N.D.GES.D.STAATES DELA

8339 Ceased/non-payment of the annual fee