DE69211053T2 - Modul-Konstruktion einer Leistungsschaltungsanordnung von hoher Kompaktheit und Leistungsfähigkeit für Wärme-Zerstreuung - Google Patents

Modul-Konstruktion einer Leistungsschaltungsanordnung von hoher Kompaktheit und Leistungsfähigkeit für Wärme-Zerstreuung

Info

Publication number
DE69211053T2
DE69211053T2 DE69211053T DE69211053T DE69211053T2 DE 69211053 T2 DE69211053 T2 DE 69211053T2 DE 69211053 T DE69211053 T DE 69211053T DE 69211053 T DE69211053 T DE 69211053T DE 69211053 T2 DE69211053 T2 DE 69211053T2
Authority
DE
Germany
Prior art keywords
performance
heat dissipation
power circuit
circuit arrangement
module construction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69211053T
Other languages
German (de)
English (en)
Other versions
DE69211053D1 (de
Inventor
Giuseppe Libretti
Paolo Casati
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
SGS Thomson Microelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ITMI911180A external-priority patent/IT1247304B/it
Application filed by SGS Thomson Microelectronics SRL filed Critical SGS Thomson Microelectronics SRL
Application granted granted Critical
Publication of DE69211053D1 publication Critical patent/DE69211053D1/de
Publication of DE69211053T2 publication Critical patent/DE69211053T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
DE69211053T 1991-04-30 1992-04-22 Modul-Konstruktion einer Leistungsschaltungsanordnung von hoher Kompaktheit und Leistungsfähigkeit für Wärme-Zerstreuung Expired - Fee Related DE69211053T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI911180A IT1247304B (it) 1991-04-30 1991-04-30 Complesso circuitale di potenza a struttura modulare ad elevata compattezza e ad alta efficienza di dissipazione termica

Publications (2)

Publication Number Publication Date
DE69211053D1 DE69211053D1 (de) 1996-07-04
DE69211053T2 true DE69211053T2 (de) 1996-10-02

Family

ID=11359807

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69211053T Expired - Fee Related DE69211053T2 (de) 1991-04-30 1992-04-22 Modul-Konstruktion einer Leistungsschaltungsanordnung von hoher Kompaktheit und Leistungsfähigkeit für Wärme-Zerstreuung

Country Status (3)

Country Link
KR (1) KR100284661B1 (ko)
DE (1) DE69211053T2 (ko)
TW (1) TW224192B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005026233A1 (de) * 2005-06-07 2006-12-21 Tyco Electronics Ec Kft Elektrisches Leistungsmodul

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2858577C (en) 2011-12-12 2018-05-29 Verifi Llc Multivariate management of entrained air and rheology in cementitious mixes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005026233A1 (de) * 2005-06-07 2006-12-21 Tyco Electronics Ec Kft Elektrisches Leistungsmodul
DE102005026233B4 (de) * 2005-06-07 2008-08-07 Tyco Electronics Ec Kft Elektrisches Leistungsmodul

Also Published As

Publication number Publication date
DE69211053D1 (de) 1996-07-04
KR920019885A (ko) 1992-11-20
TW224192B (ko) 1994-05-21
KR100284661B1 (ko) 2001-03-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee