DE69210441T2 - Vorrichtung zur Halterung und Positionierung von elektronischen Chips - Google Patents

Vorrichtung zur Halterung und Positionierung von elektronischen Chips

Info

Publication number
DE69210441T2
DE69210441T2 DE69210441T DE69210441T DE69210441T2 DE 69210441 T2 DE69210441 T2 DE 69210441T2 DE 69210441 T DE69210441 T DE 69210441T DE 69210441 T DE69210441 T DE 69210441T DE 69210441 T2 DE69210441 T2 DE 69210441T2
Authority
DE
Germany
Prior art keywords
holding
electronic chips
positioning electronic
positioning
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69210441T
Other languages
English (en)
Other versions
DE69210441D1 (de
Inventor
Kazuya C O Limited C Yasuraoka
Kazuo Ujiie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matsumoto Giken Co Ltd
Original Assignee
Matsumoto Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3336150A external-priority patent/JP2528090B2/ja
Application filed by Matsumoto Giken Co Ltd filed Critical Matsumoto Giken Co Ltd
Publication of DE69210441D1 publication Critical patent/DE69210441D1/de
Application granted granted Critical
Publication of DE69210441T2 publication Critical patent/DE69210441T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69210441T 1991-02-20 1992-02-07 Vorrichtung zur Halterung und Positionierung von elektronischen Chips Expired - Fee Related DE69210441T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4779891 1991-02-20
JP3336150A JP2528090B2 (ja) 1991-02-20 1991-11-26 チップ状電子部品の位置決め用チャック装置

Publications (2)

Publication Number Publication Date
DE69210441D1 DE69210441D1 (de) 1996-06-13
DE69210441T2 true DE69210441T2 (de) 1996-10-10

Family

ID=26387972

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69210441T Expired - Fee Related DE69210441T2 (de) 1991-02-20 1992-02-07 Vorrichtung zur Halterung und Positionierung von elektronischen Chips

Country Status (3)

Country Link
US (1) US5282659A (de)
EP (1) EP0500246B1 (de)
DE (1) DE69210441T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970010118B1 (en) * 1994-09-16 1997-06-21 Lg Ind Systems Co Ltd Head tool of surface mounter and automatic exchanger
US5664617A (en) * 1995-03-24 1997-09-09 Columbia Aluminum Corporation Sow lifter
DE19544684A1 (de) * 1995-11-30 1997-06-05 Kodak Ag Vorrichtung zur Entnahme und Überführung plattenförmiger Gegenstände von einem Stapel mit einer Ansaugvorrichtung
JPH10160794A (ja) * 1996-12-02 1998-06-19 Mitsubishi Electric Corp Ｉｃ着脱装置及びその着脱ヘッド
US6179190B1 (en) * 1997-12-29 2001-01-30 Samsung Aerospace Insustries, Ltd. Tape feeder of chip mounter
DE10212935B4 (de) * 2002-03-22 2004-07-29 Siemens Ag Bestückkopf zum Bestücken von Substraten mit elektrischen Bauelementen
DE102009012331A1 (de) * 2009-03-09 2010-09-16 Weber Maschinenbau Gmbh Breidenbach Produktgreifer
DE102009012332A1 (de) * 2009-03-09 2010-09-16 Weber Maschinenbau Gmbh Breidenbach Produktgreifer
DE102011109967B4 (de) * 2011-08-02 2016-12-01 Multivac Sepp Haggenmüller Se & Co. Kg Greifersystem
JP7084738B2 (ja) * 2018-02-14 2022-06-15 川崎重工業株式会社 実装装置及び実装方法
CN114056937B (zh) * 2021-12-13 2023-06-23 芯峰光电技术(深圳)有限公司 一种电子芯片多工位自动吸取加工生产线

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763120B2 (ja) * 1985-05-30 1995-07-05 松下電器産業株式会社 電子部品のチヤツク装置
JPS62142845U (de) * 1986-02-28 1987-09-09
US4866824A (en) * 1986-12-04 1989-09-19 Micro Component Technology, Inc. Centering mechanism
JPH0691355B2 (ja) * 1988-01-19 1994-11-14 三洋電機株式会社 電子部品位置決め装置
GB2214894B (en) * 1988-02-03 1991-10-30 Ind Tech Res Inst Surface mounting device pick-and-place head
US4950011A (en) * 1988-10-24 1990-08-21 Nicky Borcea Tool for precisely positioning a workpiece
US5056844A (en) * 1990-03-06 1991-10-15 Amistar Corporation Multiple jaw centering head structure for surface mounted component placement machines

Also Published As

Publication number Publication date
EP0500246A1 (de) 1992-08-26
US5282659A (en) 1994-02-01
DE69210441D1 (de) 1996-06-13
EP0500246B1 (de) 1996-05-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee