DE69209519D1 - Druckwandler mit Verstärker - Google Patents

Druckwandler mit Verstärker

Info

Publication number
DE69209519D1
DE69209519D1 DE69209519T DE69209519T DE69209519D1 DE 69209519 D1 DE69209519 D1 DE 69209519D1 DE 69209519 T DE69209519 T DE 69209519T DE 69209519 T DE69209519 T DE 69209519T DE 69209519 D1 DE69209519 D1 DE 69209519D1
Authority
DE
Germany
Prior art keywords
amplifier
pressure converter
converter
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69209519T
Other languages
English (en)
Other versions
DE69209519T2 (de
Inventor
Gregory Boyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell Inc
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Publication of DE69209519D1 publication Critical patent/DE69209519D1/de
Application granted granted Critical
Publication of DE69209519T2 publication Critical patent/DE69209519T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
DE69209519T 1991-11-26 1992-11-25 Druckwandler mit Verstärker Expired - Fee Related DE69209519T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/798,476 US5257547A (en) 1991-11-26 1991-11-26 Amplified pressure transducer
PCT/US1992/010441 WO1993011414A1 (en) 1991-11-26 1992-11-25 Amplified pressure transducer

Publications (2)

Publication Number Publication Date
DE69209519D1 true DE69209519D1 (de) 1996-05-02
DE69209519T2 DE69209519T2 (de) 1996-10-31

Family

ID=25173500

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69209519T Expired - Fee Related DE69209519T2 (de) 1991-11-26 1992-11-25 Druckwandler mit Verstärker

Country Status (5)

Country Link
US (1) US5257547A (de)
EP (1) EP0614522B1 (de)
JP (1) JPH07500915A (de)
DE (1) DE69209519T2 (de)
WO (1) WO1993011414A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9003897B2 (en) 2012-05-10 2015-04-14 Honeywell International Inc. Temperature compensated force sensor

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US5868678A (en) 1993-06-30 1999-02-09 Medex, Inc. Two-part medical pressure transducer with diaphragm stand-offs
US5752918A (en) 1993-06-30 1998-05-19 Medex, Inc. Modular medical pressure transducer
US5520054A (en) * 1994-03-29 1996-05-28 Rosemount Inc. Increased wall thickness for robust bond for micromachined sensor
US5454270A (en) * 1994-06-06 1995-10-03 Motorola, Inc. Hermetically sealed pressure sensor and method thereof
US5438877A (en) * 1994-06-13 1995-08-08 Motorola, Inc. Pressure sensor package for reducing stress-induced measurement error
US5412994A (en) * 1994-06-14 1995-05-09 Cook; James D. Offset pressure sensor
US5410916A (en) * 1994-06-24 1995-05-02 Honeywell Inc. Flowthrough pressure sensor
US5459351A (en) * 1994-06-29 1995-10-17 Honeywell Inc. Apparatus for mounting an absolute pressure sensor
JPH08233848A (ja) * 1995-02-28 1996-09-13 Mitsubishi Electric Corp 半導体センサ
JP3394835B2 (ja) * 1995-03-20 2003-04-07 株式会社キャットアイ 部品取付装置
MX9707606A (es) * 1995-04-28 1997-12-31 Rosemount Inc Transmisor de presion con grupo de montaje aislador de alta presion.
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US5802912A (en) * 1996-01-25 1998-09-08 Delco Electronics Corporation Electrical terminal apparatus
US5629486A (en) * 1996-01-25 1997-05-13 Delco Electronics Corporation Pressure sensor apparatus with integrated circuit mounted thereon
DE19612964A1 (de) * 1996-04-01 1997-10-02 Bosch Gmbh Robert Drucksensor und Verfahren zur Herstellung eines Drucksensors
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US5684253A (en) * 1997-01-08 1997-11-04 Honeywell Inc. Differential pressure sensor with stress reducing pressure balancing means
DE19711939A1 (de) * 1997-03-21 1998-09-24 Bosch Gmbh Robert Vorrichtung zur Erfassung des Drucks und der Temperatur im Saugrohr einer Brennkraftmaschine
US5945605A (en) * 1997-11-19 1999-08-31 Sensym, Inc. Sensor assembly with sensor boss mounted on substrate
DE19808248A1 (de) * 1998-02-27 1999-09-02 Pierburg Ag Meßvorrichtung zur Messung der Masse eines strömenden Mediums
JP3452835B2 (ja) 1999-05-28 2003-10-06 三菱電機株式会社 圧力センサ装置
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US6227055B1 (en) * 1999-11-01 2001-05-08 Delphi Technologies, Inc. Pressure sensor assembly with direct backside sensing
US6874377B2 (en) * 1999-11-10 2005-04-05 Honeywell International Inc. Sensor package for flush mounting of a sensor
US6883874B2 (en) 2000-09-14 2005-04-26 New York Air Brake Corporation Pressure sensor module
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US8623710B1 (en) 2000-11-28 2014-01-07 Knowles Electronics, Llc Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages
US7439616B2 (en) * 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
JP4801274B2 (ja) * 2001-03-29 2011-10-26 本田技研工業株式会社 圧力センサを内蔵した制御箱
DE10223357A1 (de) * 2002-05-25 2003-12-04 Bosch Gmbh Robert Vorrichtung zur Druckmessung
US7788048B2 (en) * 2003-04-24 2010-08-31 Hewlett-Packard Development Company, L.P. Apparatus and method for integrating a fuel supply and a fuel level sensing pressure sensor
DE10322017B8 (de) * 2003-05-16 2005-02-24 Sitronic Gesellschaft für elektrotechnische Ausrüstung mbH. & Co. KG Sensoreinheit
US7024937B2 (en) * 2003-12-03 2006-04-11 Honeywell International Inc. Isolated pressure transducer
US7191660B2 (en) * 2004-04-15 2007-03-20 Davidson Instruments Inc. Flame shield for high temperature pressure transducer
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008511B4 (de) 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
US20070013014A1 (en) * 2005-05-03 2007-01-18 Shuwen Guo High temperature resistant solid state pressure sensor
US7538401B2 (en) 2005-05-03 2009-05-26 Rosemount Aerospace Inc. Transducer for use in harsh environments
US7628309B1 (en) * 2005-05-03 2009-12-08 Rosemount Aerospace Inc. Transient liquid phase eutectic bonding
DE102005053767B4 (de) 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
DE102005053765B4 (de) 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
EP1870687B1 (de) 2006-06-23 2012-09-12 STMicroelectronics Srl Anordnung einer intetriergen Einrichtung mit einer vereinfachten Flüssigkeitsverbindung zu den Bereichen der Einrichtung
JP2008088937A (ja) 2006-10-04 2008-04-17 Mitsubishi Electric Corp 検出装置及びエンジン制御装置
US20080217709A1 (en) * 2007-03-07 2008-09-11 Knowles Electronics, Llc Mems package having at least one port and manufacturing method thereof
US7788981B2 (en) * 2007-03-16 2010-09-07 Csem Centre Suisse D'electronique Et De Microtechnique Sa - Recherche Et Developpement Pressure measurement device and system, and method for manufacturing and using the same
FR2917494B1 (fr) * 2007-06-12 2009-08-28 Siemens Vdo Automotive Sas Dispositif de maintien d'un capteur
WO2008157298A2 (en) * 2007-06-15 2008-12-24 Board Of Regents, The University Of Texas System Thin flexible sensor
JP5355867B2 (ja) * 2007-07-10 2013-11-27 ローム株式会社 集積回路素子
US7647835B2 (en) * 2007-09-19 2010-01-19 Honeywell International Inc. Pressure sensor stress isolation pedestal
DE102007056284A1 (de) * 2007-11-22 2009-05-28 Continental Automotive Gmbh Drucksensor
US8297125B2 (en) * 2008-05-23 2012-10-30 Honeywell International Inc. Media isolated differential pressure sensor with cap
US8230745B2 (en) * 2008-11-19 2012-07-31 Honeywell International Inc. Wet/wet differential pressure sensor based on microelectronic packaging process
US8322225B2 (en) * 2009-07-10 2012-12-04 Honeywell International Inc. Sensor package assembly having an unconstrained sense die
US8082797B2 (en) * 2009-11-11 2011-12-27 Honeywell International Inc. Pressure sensor assembly
US8230743B2 (en) 2010-08-23 2012-07-31 Honeywell International Inc. Pressure sensor
US9021689B2 (en) 2011-06-02 2015-05-05 Freescale Semiconductor, Inc. Method of making a dual port pressure sensor
US8307714B1 (en) * 2011-06-02 2012-11-13 Freescale Semiconductor, Inc. Dual port pressure sensor
US8770034B2 (en) * 2011-09-06 2014-07-08 Honeywell International Inc. Packaged sensor with multiple sensors elements
CN103999484B (zh) 2011-11-04 2017-06-30 美商楼氏电子有限公司 作为声学设备中的屏障的嵌入式电介质和制造方法
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
DE102013106353B4 (de) * 2013-06-18 2018-06-28 Tdk Corporation Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
CN105765716B (zh) * 2014-05-15 2018-06-22 富士电机株式会社 功率半导体模块和复合模块
JP5980463B1 (ja) * 2015-01-23 2016-08-31 三菱電機株式会社 セラミックス基板、接合体、モジュール、およびセラミックス基板の製造方法
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
DE102016200699A1 (de) * 2016-01-20 2017-07-20 Robert Bosch Gmbh Herstellungsverfahren für eine Detektionsvorrichtung und Detektionsvorrichtungen
US10942079B2 (en) * 2018-03-29 2021-03-09 Veoneer Us Inc. Rectangular snap fit pressure sensor unit
US20200031661A1 (en) * 2018-07-24 2020-01-30 Invensense, Inc. Liquid proof pressure sensor
US20220397437A1 (en) * 2019-11-14 2022-12-15 Hitachi Astemo, Ltd. Physical Quantity Detection Device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9003897B2 (en) 2012-05-10 2015-04-14 Honeywell International Inc. Temperature compensated force sensor

Also Published As

Publication number Publication date
EP0614522B1 (de) 1996-03-27
US5257547A (en) 1993-11-02
JPH07500915A (ja) 1995-01-26
WO1993011414A1 (en) 1993-06-10
EP0614522A1 (de) 1994-09-14
DE69209519T2 (de) 1996-10-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee