DE69208822D1 - Wärmesenke mit Stiften und Strömungsverbesserung - Google Patents

Wärmesenke mit Stiften und Strömungsverbesserung

Info

Publication number
DE69208822D1
DE69208822D1 DE69208822T DE69208822T DE69208822D1 DE 69208822 D1 DE69208822 D1 DE 69208822D1 DE 69208822 T DE69208822 T DE 69208822T DE 69208822 T DE69208822 T DE 69208822T DE 69208822 D1 DE69208822 D1 DE 69208822D1
Authority
DE
Germany
Prior art keywords
pins
heat sink
flow improvement
improvement
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69208822T
Other languages
English (en)
Other versions
DE69208822T2 (de
Inventor
Kaveh Azar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of DE69208822D1 publication Critical patent/DE69208822D1/de
Application granted granted Critical
Publication of DE69208822T2 publication Critical patent/DE69208822T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/124—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and being formed of pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69208822T 1991-11-12 1992-11-05 Wärmesenke mit Stiften und Strömungsverbesserung Expired - Lifetime DE69208822T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/790,897 US5158136A (en) 1991-11-12 1991-11-12 Pin fin heat sink including flow enhancement

Publications (2)

Publication Number Publication Date
DE69208822D1 true DE69208822D1 (de) 1996-04-11
DE69208822T2 DE69208822T2 (de) 1996-07-25

Family

ID=25152056

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69208822T Expired - Lifetime DE69208822T2 (de) 1991-11-12 1992-11-05 Wärmesenke mit Stiften und Strömungsverbesserung

Country Status (6)

Country Link
US (1) US5158136A (de)
EP (1) EP0542478B1 (de)
JP (1) JPH0543550U (de)
KR (1) KR950014051B1 (de)
CA (1) CA2076774C (de)
DE (1) DE69208822T2 (de)

Families Citing this family (58)

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US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
US5455382A (en) * 1991-10-31 1995-10-03 Sumitomo Metal Industries, Ltd. IC package heat sink fin
JP2715752B2 (ja) * 1991-10-31 1998-02-18 住友金属工業株式会社 ヒートシンク放熱フィンとその製造方法
EP0560259B1 (de) * 1992-03-09 1996-10-30 Sumitomo Metal Industries, Ltd. Wärmesenke mit guten wärmezerstreuenden Eigenschaften und Herstellungsverfahren
US5351748A (en) * 1993-01-21 1994-10-04 Baruch Dagan Tubular pin fin heat sink for electronic components
EP0633608B1 (de) * 1993-07-08 2000-10-11 Sumitomo Metal Industries, Ltd. Herstellungsverfahren für eine Stift-Wärmesenke
US5447189A (en) * 1993-12-16 1995-09-05 Mcintyre; Gerald L. Method of making heat sink having elliptical pins
US5544696A (en) * 1994-07-01 1996-08-13 The United States Of America As Represented By The Secretary Of The Air Force Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer
US5673177A (en) * 1995-08-01 1997-09-30 International Business Machines Corporation Heat sink structure with corrugated wound wire heat conductive elements
DE19628548A1 (de) * 1996-07-16 1998-01-22 Abb Patent Gmbh Kühlprofil für einen Hochleistungs-Kühler für ein luftgekühltes Stromrichtergerät
DE19704226B4 (de) * 1997-02-05 2004-09-30 Sew-Eurodrive Gmbh & Co. Kg Klemmdeckelumrichter
DE19712723A1 (de) * 1997-03-26 1998-10-01 Ego Elektro Geraetebau Gmbh Kühlkörper
US6173758B1 (en) * 1999-08-02 2001-01-16 General Motors Corporation Pin fin heat sink and pin fin arrangement therein
DE29915465U1 (de) * 1999-09-03 2001-01-18 Schneider-Clauss GmbH & Co. KG Metallwarenfabrikation, 50677 Köln Kühlelement
US6675746B2 (en) 1999-12-01 2004-01-13 Advanced Mechanical Technology, Inc. Heat exchanger with internal pin elements
DE19963374B4 (de) * 1999-12-28 2007-09-13 Alstom Vorrichtung zur Kühlung einer, einen Strömungskanal umgebenden Strömungskanalwand mit wenigstens einem Rippenelement
DE10025486A1 (de) 2000-05-23 2001-11-29 Behr Gmbh & Co Wärmeübertragerblock
US6942025B2 (en) * 2000-09-20 2005-09-13 Degree Controls, Inc. Uniform heat dissipating and cooling heat sink
US6407917B1 (en) * 2000-10-30 2002-06-18 Lucent Technologies Inc. Fluid flow management system
FR2819978A1 (fr) * 2001-01-24 2002-07-26 Labinal Dispositif electrique a dissipateur de chaleur
US20030183368A1 (en) * 2002-04-02 2003-10-02 Paradis Leo Richard Diamond heat sink
US7000691B1 (en) * 2002-07-11 2006-02-21 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
TW527099U (en) * 2002-07-19 2003-04-01 Hai-Ching Lin Heat dissipation plate having gained heat dissipation efficiency
US6735082B2 (en) * 2002-08-14 2004-05-11 Agilent Technologies, Inc. Heatsink with improved heat dissipation capability
DE10239845C1 (de) 2002-08-29 2003-12-24 Day4 Energy Inc Elektrode für fotovoltaische Zellen, fotovoltaische Zelle und fotovoltaischer Modul
US6940718B2 (en) * 2003-08-27 2005-09-06 Hewlett-Packard Development Company, L.P. Heat dissipation apparatus and method
US7365980B2 (en) 2003-11-13 2008-04-29 Intel Corporation Micropin heat exchanger
US7151667B2 (en) 2004-04-12 2006-12-19 Nvidia Corporation Modular, scalable thermal solution
US7359197B2 (en) * 2004-04-12 2008-04-15 Nvidia Corporation System for efficiently cooling a processor
US20050274139A1 (en) * 2004-06-14 2005-12-15 Wyatt William G Sub-ambient refrigerating cycle
US20070119572A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
US20070119199A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and method for electronic chassis and rack mounted electronics with an integrated subambient cooling system
US20070119568A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and method of enhanced boiling heat transfer using pin fins
US20070209782A1 (en) * 2006-03-08 2007-09-13 Raytheon Company System and method for cooling a server-based data center with sub-ambient cooling
US7908874B2 (en) 2006-05-02 2011-03-22 Raytheon Company Method and apparatus for cooling electronics with a coolant at a subambient pressure
US20080112134A1 (en) * 2006-11-09 2008-05-15 Brandon Rubenstein Dust accumulation resistant heat sink
KR101291428B1 (ko) * 2006-12-14 2013-07-30 엘지전자 주식회사 조리기기
US8651172B2 (en) 2007-03-22 2014-02-18 Raytheon Company System and method for separating components of a fluid coolant for cooling a structure
US7921655B2 (en) 2007-09-21 2011-04-12 Raytheon Company Topping cycle for a sub-ambient cooling system
US7934386B2 (en) * 2008-02-25 2011-05-03 Raytheon Company System and method for cooling a heat generating structure
KR20110042083A (ko) 2008-07-28 2011-04-22 데이4 에너지 인코포레이티드 저온 정밀 에칭백 및 패시베이션 공정으로 제조되는 셀렉티브 에미터를 구비한 결정 실리콘 ｐｖ 셀
CN102356014B (zh) * 2009-03-24 2013-06-19 住友精密工业株式会社 冷却装置
US8740421B2 (en) 2011-06-14 2014-06-03 Litelab Corp. Luminaire with enhanced thermal dissipation characteristics
US9249675B2 (en) 2011-08-30 2016-02-02 General Electric Company Pin-fin array
IN2014CN04113A (de) * 2011-12-09 2015-07-10 Mitsubishi Electric Corp
CN103199066A (zh) * 2013-03-03 2013-07-10 秦吉忠 一种肋线式散热器及制造方法
EP2989659B1 (de) * 2013-04-23 2019-06-12 Alexiou & Tryde Holding ApS Kühlkörper mit kühlstruktur mit abnehmender strukturdichte
US10048019B2 (en) * 2014-12-22 2018-08-14 Hamilton Sundstrand Corporation Pins for heat exchangers
US9713284B2 (en) * 2015-07-15 2017-07-18 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Locally enhanced direct liquid cooling system for high power applications
DE202016008394U1 (de) * 2016-02-18 2017-10-13 Rehm Gmbh & Co. Kg Gerät mit einem eine Leistungselektronik umfassenden Leistungsteil und einem dieses umgebenden Gehäuse, insbesondere Schweißgerät, und Gehäuse für ein Schweißgerät
US10415895B2 (en) * 2016-11-21 2019-09-17 Abl Ip Holding Llc Heatsink
DE102017101126B4 (de) 2017-01-20 2021-08-19 Danfoss Silicon Power Gmbh Leistungselektroniksystem und Verfahren zu dessen Herstellung
FR3063864B1 (fr) * 2017-03-09 2019-07-05 Aptiv Technologies Limited Dispositif electronique pour vehicule automobile
USD856945S1 (en) * 2019-01-31 2019-08-20 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD856944S1 (en) * 2019-01-31 2019-08-20 Advanced Thermal Solutions, Inc. Fluid mover enclosure
US11859915B1 (en) 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD896767S1 (en) 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
US11252841B1 (en) 2021-02-18 2022-02-15 Giftedness And Creativity Company Heat sink with slotted pin fins

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GB537733A (en) * 1939-08-29 1941-07-03 British Thomson Houston Co Ltd Improvements in heat-exchange surfaces
GB633376A (en) * 1946-05-31 1949-12-12 Marconi Wireless Telegraph Co Improvements in or relating to electron discharge tubes
US2595457A (en) * 1947-06-03 1952-05-06 Air Preheater Pin fin heat exchanger
US2722048A (en) * 1950-04-08 1955-11-01 Jr John R Gier Method of making heat exchangers
US2892618A (en) * 1957-04-12 1959-06-30 Ferrotherm Company Heat exchangers and cores and extended surface elements therefor
US3327779A (en) * 1965-12-16 1967-06-27 Jacoby John Hull Heat dissipating device and method
US3524497A (en) * 1968-04-04 1970-08-18 Ibm Heat transfer in a liquid cooling system
US4277816A (en) * 1979-05-29 1981-07-07 International Business Machines Corporation Electronic circuit module cooling
FR2499233A1 (fr) * 1981-01-30 1982-08-06 Valeo Echangeur de chaleur a faisceau de tubes
FR2518357A1 (fr) * 1981-12-11 1983-06-17 Thomson Csf Procede de realisation d'un dispositif de refroidissement a elements filiformes pour composant electronique et dispositif de refroidissement ainsi obtenu
FR2545274B1 (fr) * 1983-04-29 1985-07-05 Thomson Csf Procede de fabrication d'un dissipateur thermique a picots et dissipateur obtenu par ce procede
DE8411960U1 (de) * 1984-04-16 1988-07-14 Siemens AG, 1000 Berlin und 8000 München Wärmetauscherprofil
US4682269A (en) * 1984-10-11 1987-07-21 Teradyne, Inc. Heat dissipation for electronic components on a ceramic substrate
CA1235528A (en) * 1984-10-11 1988-04-19 Teradyne, Inc. Heat dissipation for electronic components on ceramic substrate
US4638858A (en) * 1985-10-16 1987-01-27 International Business Machines Corp. Composite heat transfer device with pins having wings alternately oriented for up-down flow
JPS62274798A (ja) * 1986-05-19 1987-11-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション ヒ−トシンク構造体

Also Published As

Publication number Publication date
JPH0543550U (ja) 1993-06-11
CA2076774A1 (en) 1993-05-13
KR930010513A (ko) 1993-06-22
US5158136A (en) 1992-10-27
KR950014051B1 (ko) 1995-11-20
EP0542478B1 (de) 1996-03-06
DE69208822T2 (de) 1996-07-25
EP0542478A1 (de) 1993-05-19
CA2076774C (en) 1995-02-14

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