DE69122878T2 - Erweiterungsfähige gekühlte gehäuse für computer-leiterplatten - Google Patents

Erweiterungsfähige gekühlte gehäuse für computer-leiterplatten

Info

Publication number
DE69122878T2
DE69122878T2 DE69122878T DE69122878T DE69122878T2 DE 69122878 T2 DE69122878 T2 DE 69122878T2 DE 69122878 T DE69122878 T DE 69122878T DE 69122878 T DE69122878 T DE 69122878T DE 69122878 T2 DE69122878 T2 DE 69122878T2
Authority
DE
Germany
Prior art keywords
expandable
sections
cooled housing
circuit boards
computer boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69122878T
Other languages
English (en)
Other versions
DE69122878D1 (de
Inventor
Joel Fallik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE69122878D1 publication Critical patent/DE69122878D1/de
Application granted granted Critical
Publication of DE69122878T2 publication Critical patent/DE69122878T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Packages (AREA)
DE69122878T 1990-09-24 1991-09-16 Erweiterungsfähige gekühlte gehäuse für computer-leiterplatten Expired - Fee Related DE69122878T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/587,014 US5067040A (en) 1990-09-24 1990-09-24 Expandable refrigerated enclosure for computer boards
PCT/US1991/006664 WO1992005680A1 (en) 1990-09-24 1991-09-16 Expandable refrigerated enclosure for computer boards

Publications (2)

Publication Number Publication Date
DE69122878D1 DE69122878D1 (de) 1996-11-28
DE69122878T2 true DE69122878T2 (de) 1997-05-28

Family

ID=24347980

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69122878T Expired - Fee Related DE69122878T2 (de) 1990-09-24 1991-09-16 Erweiterungsfähige gekühlte gehäuse für computer-leiterplatten

Country Status (7)

Country Link
US (1) US5067040A (de)
EP (1) EP0550654B1 (de)
AT (1) ATE144677T1 (de)
AU (1) AU8739891A (de)
DE (1) DE69122878T2 (de)
ES (1) ES2095330T3 (de)
WO (1) WO1992005680A1 (de)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5319520A (en) * 1991-11-26 1994-06-07 Kabushiki Kaisha Toshiba Electronic equipment assembly of tiered type
US5335144A (en) * 1992-11-02 1994-08-02 Samar Enterprises Company, Ltd. Modular stacked housing arrangement
ATE254815T1 (de) * 1996-05-29 2003-12-15 Abb Ab Hochspannung erzeugender wechselstromgenerator
JP3052843B2 (ja) * 1996-07-03 2000-06-19 住友電装株式会社 電気接続箱
US5864467A (en) * 1997-02-12 1999-01-26 Paradyne Corporation Cascadable modem apparatus
US5909357A (en) * 1997-04-24 1999-06-01 Orr; Tom Vertically stacked computer modules shaped to indicate compatibility with vertical cooling shaft extending throughout
US6115242A (en) * 1997-10-24 2000-09-05 Advanced Micro Devices, Inc. Chip chassis including a micro-backplane for receiving and connecting a plurality of computer chips
US5931000A (en) * 1998-04-23 1999-08-03 Turner; William Evans Cooled electrical system for use downhole
US6134892A (en) * 1998-04-23 2000-10-24 Aps Technology, Inc. Cooled electrical system for use downhole
US6249671B1 (en) * 1998-06-05 2001-06-19 Lxe, Inc. Aesthetic enclosure for a wireless network access point
US9119705B2 (en) 1998-06-08 2015-09-01 Thermotek, Inc. Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis
AU1098700A (en) * 1998-10-01 2000-04-17 Sparrow Marcioni Secure rack systems, methods, and apparatus
US6574110B1 (en) * 1999-12-13 2003-06-03 3Com Corporation Stackable slide mount system for modem devices
EP1256869A1 (de) 2001-05-10 2002-11-13 Hewlett Packard Company, a Delaware Corporation Montage von elektronischen Geräten
KR100397498B1 (ko) * 2001-06-11 2003-09-13 엘지전자 주식회사 공간절약형 데스크 홀더
GB2377085A (en) * 2001-06-27 2002-12-31 Dah Wei Chu Electronic apparatus housing with heating/cooling system
US6650539B1 (en) * 2002-06-19 2003-11-18 Handsome Electronics Ltd. Modular backup power housing
US6667883B1 (en) * 2002-08-29 2003-12-23 Proxim Corporation Forced-air cooling of a transceiver unit
ATE503452T1 (de) 2003-07-18 2011-04-15 Thermotek Inc Thermisches system für eine decke
US8574278B2 (en) 2006-05-09 2013-11-05 Thermotek, Inc. Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation
US8128672B2 (en) 2006-05-09 2012-03-06 Thermotek, Inc. Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation
US8100956B2 (en) 2006-05-09 2012-01-24 Thermotek, Inc. Method of and system for thermally augmented wound care oxygenation
US8778005B2 (en) 2003-07-18 2014-07-15 Thermotek, Inc. Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis
US7116553B2 (en) * 2003-11-07 2006-10-03 Scimeasure Analytical Systems, Inc. Circuit board enclosure
US10016583B2 (en) 2013-03-11 2018-07-10 Thermotek, Inc. Wound care and infusion method and system utilizing a thermally-treated therapeutic agent
USD679023S1 (en) 2004-07-19 2013-03-26 Thermotek, Inc. Foot wrap
US10765785B2 (en) 2004-07-19 2020-09-08 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
US20060034053A1 (en) * 2004-08-12 2006-02-16 Thermotek, Inc. Thermal control system for rack mounting
DE102005032607A1 (de) 2005-05-31 2006-12-07 Fpe Fischer Gmbh Gehäuse für elektronische Geräte und Systeme
US7909861B2 (en) 2005-10-14 2011-03-22 Thermotek, Inc. Critical care thermal therapy method and system
USD662214S1 (en) 2007-04-10 2012-06-19 Thermotek, Inc. Circumferential leg wrap
US8758419B1 (en) 2008-01-31 2014-06-24 Thermotek, Inc. Contact cooler for skin cooling applications
US20100319986A1 (en) * 2009-06-17 2010-12-23 Bleau Charles A Modular vented circuit board enclosure
RU2459231C2 (ru) * 2010-09-30 2012-08-20 Государственное образовательное учреждение высшего профессионального образования Томский государственный университет систем управления и радиоэлектроники (ТУСУР) Устройство для стабилизации температуры микросборок
US10512587B2 (en) 2011-07-27 2019-12-24 Thermotek, Inc. Method and apparatus for scalp thermal treatment
EP2841121B1 (de) 2012-04-24 2020-12-02 Thermotek, Inc. System zur therapeutischen verwendung von ultraviolettem licht
US10300180B1 (en) 2013-03-11 2019-05-28 Thermotek, Inc. Wound care and infusion method and system utilizing a therapeutic agent
CN104516440A (zh) * 2013-09-29 2015-04-15 鸿富锦精密电子(天津)有限公司 硬盘模组
US10198048B2 (en) * 2013-10-03 2019-02-05 Peerless Industries, Inc. Media device enclosure system
EP3068481B1 (de) 2013-11-11 2020-01-01 Thermotek, Inc. System zur wundbehandlung
KR102123265B1 (ko) * 2014-04-08 2020-06-16 주식회사 쏠리드 통신 모듈 어셈블리

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3054024A (en) * 1959-03-11 1962-09-11 Polytron Ind Inc Compatible module structure
CH633929A5 (de) * 1978-07-14 1982-12-31 Hasler Ag Zwangsbelueftetes elektronikgestell.
US4558914A (en) * 1982-09-23 1985-12-17 Gould Inc. Readily expandable input/output construction for programmable controller
US4858070A (en) * 1987-04-24 1989-08-15 Racal Data Communications Inc. Modular expandable housing arrangement for electronic apparatus
JPH038907A (ja) * 1989-06-07 1991-01-16 Ohbayashi Corp 免震装置

Also Published As

Publication number Publication date
ATE144677T1 (de) 1996-11-15
ES2095330T3 (es) 1997-02-16
EP0550654B1 (de) 1996-10-23
DE69122878D1 (de) 1996-11-28
US5067040A (en) 1991-11-19
EP0550654A1 (de) 1993-07-14
EP0550654A4 (en) 1994-07-20
AU8739891A (en) 1992-04-15
WO1992005680A1 (en) 1992-04-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee