DE69122757D1 - Vorrichtung zum magnetronsputtern mit geschlitzter zylindrischer hohlkathode - Google Patents
Vorrichtung zum magnetronsputtern mit geschlitzter zylindrischer hohlkathodeInfo
- Publication number
- DE69122757D1 DE69122757D1 DE69122757T DE69122757T DE69122757D1 DE 69122757 D1 DE69122757 D1 DE 69122757D1 DE 69122757 T DE69122757 T DE 69122757T DE 69122757 T DE69122757 T DE 69122757T DE 69122757 D1 DE69122757 D1 DE 69122757D1
- Authority
- DE
- Germany
- Prior art keywords
- magnetron sputtering
- cylindrical hollow
- hollow cathode
- slit cylindrical
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- SQEHCNOBYLQFTG-UHFFFAOYSA-M lithium;thiophene-2-carboxylate Chemical compound [Li+].[O-]C(=O)C1=CC=CS1 SQEHCNOBYLQFTG-UHFFFAOYSA-M 0.000 title 1
- 238000001755 magnetron sputter deposition Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/550,719 US5073245A (en) | 1990-07-10 | 1990-07-10 | Slotted cylindrical hollow cathode/magnetron sputtering device |
PCT/US1991/004889 WO1992001082A1 (en) | 1990-07-10 | 1991-07-10 | Slotted cylindrical hollow cathode/magnetron sputtering device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69122757D1 true DE69122757D1 (de) | 1996-11-21 |
DE69122757T2 DE69122757T2 (de) | 1997-02-13 |
Family
ID=24198333
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69122757T Expired - Fee Related DE69122757T2 (de) | 1990-07-10 | 1991-07-10 | Vorrichtung zum magnetronsputtern mit geschlitzter zylindrischer hohlkathode |
Country Status (4)
Country | Link |
---|---|
US (1) | US5073245A (de) |
EP (1) | EP0538363B1 (de) |
DE (1) | DE69122757T2 (de) |
WO (1) | WO1992001082A1 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5437778A (en) * | 1990-07-10 | 1995-08-01 | Telic Technologies Corporation | Slotted cylindrical hollow cathode/magnetron sputtering device |
US5482611A (en) * | 1991-09-30 | 1996-01-09 | Helmer; John C. | Physical vapor deposition employing ion extraction from a plasma |
FR2689143B1 (fr) * | 1992-03-31 | 1994-05-13 | Commissariat A Energie Atomique | Dispositif de pulverisation cathodique utilisant un plasma engendre par des micro-ondes. |
US5277779A (en) * | 1992-04-14 | 1994-01-11 | Henshaw William F | Rectangular cavity magnetron sputtering vapor source |
DE4333825C1 (de) * | 1993-09-28 | 1995-02-23 | Mat Gmbh | Vorrichtung zum Beschichten von langgestreckten biegsamen Erzeugnissen |
SE501888C2 (sv) * | 1993-10-18 | 1995-06-12 | Ladislav Bardos | En metod och en apparat för generering av en urladdning i egna ångor från en radiofrekvenselektrod för kontinuerlig självförstoftning av elektroden |
EP0672439B1 (de) * | 1994-02-18 | 1998-03-25 | Marker Deutschland GmbH | Vorrichtung mit zur Abstützung des Skischuhes auf dem Ski dienenden Abstütz- bzw. Bindungsteilen |
US6217716B1 (en) | 1998-05-06 | 2001-04-17 | Novellus Systems, Inc. | Apparatus and method for improving target erosion in hollow cathode magnetron sputter source |
US6299740B1 (en) | 2000-01-19 | 2001-10-09 | Veeco Instrument, Inc. | Sputtering assembly and target therefor |
EP1346085B1 (de) | 2000-11-30 | 2011-10-12 | North Carolina State University | Verfahren zur herstellung von gruppe-iii-metallnitrid-materialien |
WO2002043466A2 (en) | 2000-11-30 | 2002-06-06 | North Carolina State University | Non-thermionic sputter material transport device, methods of use, and materials produced thereby |
GB0203709D0 (en) | 2002-02-16 | 2002-04-03 | Mcdonald George W | Improvements in and relating to sheet articles |
EP1511876B1 (de) * | 2002-05-14 | 2009-04-29 | Tokyo Electron Limited | Adapter für zerstäubungskathode |
WO2004005574A2 (en) * | 2002-07-02 | 2004-01-15 | Academy Precision Materials A Division Of Academy Corporation | Rotary target and method for onsite mechanical assembly of rotary target |
US7411352B2 (en) * | 2002-09-19 | 2008-08-12 | Applied Process Technologies, Inc. | Dual plasma beam sources and method |
US7327089B2 (en) * | 2002-09-19 | 2008-02-05 | Applied Process Technologies, Inc. | Beam plasma source |
US6878242B2 (en) * | 2003-04-08 | 2005-04-12 | Guardian Industries Corp. | Segmented sputtering target and method/apparatus for using same |
US7038389B2 (en) * | 2003-05-02 | 2006-05-02 | Applied Process Technologies, Inc. | Magnetron plasma source |
US20050276381A1 (en) * | 2003-07-02 | 2005-12-15 | Academy Corporation | Rotary target locking ring assembly |
GB2447977B (en) * | 2007-03-30 | 2011-08-10 | E2V Tech | Magnetrons |
DE102010063685B4 (de) * | 2010-02-21 | 2012-07-12 | Von Ardenne Anlagentechnik Gmbh | Magnetronanordnung mit einem Hohltarget |
CN108396295B (zh) * | 2018-02-26 | 2023-06-27 | 温州职业技术学院 | 曲面磁控溅射阴极、闭合磁场涂层磁控溅射设备及其应用方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL50072C (de) * | 1935-12-28 | |||
DE1765850A1 (de) * | 1967-11-10 | 1971-10-28 | Euratom | Verfahren und Vorrichtung zum Aufbringen von duennen Schichten |
US3616450A (en) * | 1968-11-07 | 1971-10-26 | Peter J Clark | Sputtering apparatus |
US3844793A (en) * | 1970-10-19 | 1974-10-29 | American Cyanamid Co | Photosensitive azido material |
US3711398A (en) * | 1971-02-18 | 1973-01-16 | P Clarke | Sputtering apparatus |
US3884793A (en) * | 1971-09-07 | 1975-05-20 | Telic Corp | Electrode type glow discharge apparatus |
US3878085A (en) * | 1973-07-05 | 1975-04-15 | Sloan Technology Corp | Cathode sputtering apparatus |
US4166018A (en) * | 1974-01-31 | 1979-08-28 | Airco, Inc. | Sputtering process and apparatus |
US4111782A (en) * | 1974-12-23 | 1978-09-05 | Telic Corporation | Sputtering apparatus |
US4126530A (en) * | 1977-08-04 | 1978-11-21 | Telic Corporation | Method and apparatus for sputter cleaning and bias sputtering |
US4290877A (en) * | 1980-09-08 | 1981-09-22 | The United States Of America As Represented By The Secretary Of The Interior | Sputtering apparatus for coating elongated tubes and strips |
US4442916A (en) * | 1980-12-04 | 1984-04-17 | Conoco Inc. | Underwater shear wave vibrator coupling |
US4356073A (en) * | 1981-02-12 | 1982-10-26 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4472259A (en) * | 1981-10-29 | 1984-09-18 | Materials Research Corporation | Focusing magnetron sputtering apparatus |
CH659484A5 (de) * | 1984-04-19 | 1987-01-30 | Balzers Hochvakuum | Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung. |
IT1211938B (it) * | 1987-11-27 | 1989-11-08 | Siv Soc Italiana Vetro | Apparecchiatura e procedimento per la deposizione di uno strato sottile su un substrato trasparente, particolarmente per la realizzazione di vetrature |
US4915805A (en) * | 1988-11-21 | 1990-04-10 | At&T Bell Laboratories | Hollow cathode type magnetron apparatus construction |
-
1990
- 1990-07-10 US US07/550,719 patent/US5073245A/en not_active Expired - Lifetime
-
1991
- 1991-07-10 WO PCT/US1991/004889 patent/WO1992001082A1/en active IP Right Grant
- 1991-07-10 DE DE69122757T patent/DE69122757T2/de not_active Expired - Fee Related
- 1991-07-10 EP EP91913202A patent/EP0538363B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0538363B1 (de) | 1996-10-16 |
US5073245A (en) | 1991-12-17 |
EP0538363A1 (de) | 1993-04-28 |
EP0538363A4 (en) | 1994-08-17 |
WO1992001082A1 (en) | 1992-01-23 |
DE69122757T2 (de) | 1997-02-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |