DE69121486D1 - Epoxyharzzusammensetzung, gehärtetes Epoxyharzmaterial und mit Kupfer beschichtetes Laminat - Google Patents

Epoxyharzzusammensetzung, gehärtetes Epoxyharzmaterial und mit Kupfer beschichtetes Laminat

Info

Publication number
DE69121486D1
DE69121486D1 DE69121486T DE69121486T DE69121486D1 DE 69121486 D1 DE69121486 D1 DE 69121486D1 DE 69121486 T DE69121486 T DE 69121486T DE 69121486 T DE69121486 T DE 69121486T DE 69121486 D1 DE69121486 D1 DE 69121486D1
Authority
DE
Germany
Prior art keywords
epoxy resin
copper coated
resin composition
coated laminate
resin material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69121486T
Other languages
English (en)
Other versions
DE69121486T2 (de
Inventor
Michio Futakuchi
Hiroyuki Nakajima
Takashi Takahama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE69121486D1 publication Critical patent/DE69121486D1/de
Publication of DE69121486T2 publication Critical patent/DE69121486T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/93—Reaction product of a polyhydric phenol and epichlorohydrin or diepoxide, having a molecular weight of over 5,000, e.g. phenoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69121486T 1990-07-09 1991-04-17 Epoxyharzzusammensetzung, gehärtetes Epoxyharzmaterial und mit Kupfer beschichtetes Laminat Expired - Fee Related DE69121486T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2180955A JPH0819213B2 (ja) 1990-07-09 1990-07-09 エポキシ樹脂組成物および銅張積層板

Publications (2)

Publication Number Publication Date
DE69121486D1 true DE69121486D1 (de) 1996-09-26
DE69121486T2 DE69121486T2 (de) 1996-12-19

Family

ID=16092200

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69121486T Expired - Fee Related DE69121486T2 (de) 1990-07-09 1991-04-17 Epoxyharzzusammensetzung, gehärtetes Epoxyharzmaterial und mit Kupfer beschichtetes Laminat

Country Status (4)

Country Link
US (1) US5278259A (de)
EP (1) EP0466299B1 (de)
JP (1) JPH0819213B2 (de)
DE (1) DE69121486T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1089356C (zh) * 1995-04-04 2002-08-21 日立化成工业株式会社 粘合剂、胶膜及带粘合剂底面的金属箔
US5976699A (en) * 1995-11-09 1999-11-02 Sumitomo Bakelite Company Limited Insulating adhesive for multilayer printed circuit board
EP0831528A3 (de) * 1996-09-10 1999-12-22 Hitachi Chemical Company, Ltd. Mehrschicht-Leiterplatte zum Montieren einer Halbleiteranordnung und Herstellungsverfahren dafür
JP3657720B2 (ja) * 1996-12-11 2005-06-08 ジャパンエポキシレジン株式会社 高分子エポキシ樹脂の製造方法
JP2002118144A (ja) * 2000-10-06 2002-04-19 Sony Chem Corp 接着剤及び電気装置
JP4027066B2 (ja) * 2001-10-09 2007-12-26 東都化成株式会社 ポリヒドロキシポリエーテル樹脂組成物及び、該ポリヒドロキシポリエーテル樹脂を含有する硬化性樹脂組成物、樹脂付き金属箔、樹脂フィルム
US7118837B2 (en) * 2002-01-08 2006-10-10 International Business Machines Corporation Photoimaged dielectric polymer and film, and circuit package containing the same
US6806033B2 (en) 2002-01-08 2004-10-19 International Business Machines Corporation Photoimaged dielectric, its manufacture and use in electronics
DE602005017509D1 (de) * 2004-11-26 2009-12-17 Lg Chemical Ltd Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit
US20070073005A1 (en) * 2005-09-22 2007-03-29 Hideki Iijima Anionic electrodeposition paint
JP5305707B2 (ja) * 2007-03-29 2013-10-02 株式会社日本触媒 樹脂組成物及び光学部材
CN112694623B (zh) * 2020-12-28 2023-04-07 广东生益科技股份有限公司 一种树脂胶液、预浸料及覆金属箔层压板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3888942A (en) * 1973-12-13 1975-06-10 Gen Electric Resinous compositions and laminates made therefrom
JPS5817534B2 (ja) * 1977-11-05 1983-04-07 三菱電機株式会社 可撓性エポキシ樹脂組成物
JPS6037810B2 (ja) * 1978-12-08 1985-08-28 東邦レーヨン株式会社 ストランドプリプレグ組成物
US4550128A (en) * 1984-04-16 1985-10-29 International Business Machines Corporation Epoxy composition
JPS61246228A (ja) * 1985-04-24 1986-11-01 Shin Kobe Electric Mach Co Ltd 積層板用樹脂組成物
US5028668A (en) * 1986-04-14 1991-07-02 The Dow Chemical Company Adducts of metabrominated phenols and polyfunctional epoxides
US4895755A (en) * 1986-09-15 1990-01-23 The Dow Chemical Company Halogenated advanced epoxy resins
US4839444A (en) * 1986-12-29 1989-06-13 Essex Group, Inc. High solids enamel
US4769399A (en) * 1987-03-12 1988-09-06 Minnesota Mining And Manufacturing Company Epoxy adhesive film for electronic applications
US4959425A (en) * 1987-11-16 1990-09-25 The Dow Chemical Company Laminating varnish composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol and a solvent
US4853423A (en) * 1988-07-14 1989-08-01 General Electric Company Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production
EP0394965A3 (de) * 1989-04-25 1991-12-18 Mitsubishi Denki Kabushiki Kaisha Harzzusammensetzung für Laminate
KR920701362A (ko) * 1989-10-06 1992-08-11 아더 엠.킹 전기 적층품을 위한 폴리페닐렌 옥시드/하이브리드 에폭시 수지계

Also Published As

Publication number Publication date
EP0466299B1 (de) 1996-08-21
DE69121486T2 (de) 1996-12-19
US5278259A (en) 1994-01-11
JPH0468021A (ja) 1992-03-03
EP0466299A3 (en) 1993-07-14
JPH0819213B2 (ja) 1996-02-28
EP0466299A2 (de) 1992-01-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee