DE69115315T2 - Verfahren zum stromlosen Aufbringen einer Metallschicht auf einen flachen Gegenstand mit Hilfe einer Metallisierungsflüssigkeit. - Google Patents

Verfahren zum stromlosen Aufbringen einer Metallschicht auf einen flachen Gegenstand mit Hilfe einer Metallisierungsflüssigkeit.

Info

Publication number
DE69115315T2
DE69115315T2 DE69115315T DE69115315T DE69115315T2 DE 69115315 T2 DE69115315 T2 DE 69115315T2 DE 69115315 T DE69115315 T DE 69115315T DE 69115315 T DE69115315 T DE 69115315T DE 69115315 T2 DE69115315 T2 DE 69115315T2
Authority
DE
Germany
Prior art keywords
metal layer
flat object
electrolessly
applying
metallizing liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69115315T
Other languages
English (en)
Other versions
DE69115315D1 (de
Inventor
Petrus Egidius Jacobu Legierse
Boer Paulus Gerhardus Johan De
Jacobus Henricus Baten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Publication of DE69115315D1 publication Critical patent/DE69115315D1/de
Application granted granted Critical
Publication of DE69115315T2 publication Critical patent/DE69115315T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1676—Heating of the solution
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1678—Heating of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/168—Control of temperature, e.g. temperature of bath, substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1682—Control of atmosphere
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1889—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
DE69115315T 1990-02-12 1991-02-08 Verfahren zum stromlosen Aufbringen einer Metallschicht auf einen flachen Gegenstand mit Hilfe einer Metallisierungsflüssigkeit. Expired - Fee Related DE69115315T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9000323A NL9000323A (nl) 1990-02-12 1990-02-12 Werkwijze voor het vanuit een metalliseringsvloeistof stroomloos neerslaan van een metaallaag op een vlak voorwerp.

Publications (2)

Publication Number Publication Date
DE69115315D1 DE69115315D1 (de) 1996-01-25
DE69115315T2 true DE69115315T2 (de) 1996-07-11

Family

ID=19856574

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69115315T Expired - Fee Related DE69115315T2 (de) 1990-02-12 1991-02-08 Verfahren zum stromlosen Aufbringen einer Metallschicht auf einen flachen Gegenstand mit Hilfe einer Metallisierungsflüssigkeit.

Country Status (7)

Country Link
US (1) US5403625A (de)
EP (1) EP0448138B1 (de)
JP (1) JPH04218676A (de)
KR (1) KR100221105B1 (de)
DE (1) DE69115315T2 (de)
HK (1) HK168696A (de)
NL (1) NL9000323A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19537409A1 (de) * 1995-10-09 1997-04-10 Leybold Ag Vorrichtung zur Herstellung von belichteten und metallisierten Substraten
JP3012547B2 (ja) * 1997-02-25 2000-02-21 日本ビクター株式会社 光記録媒体及びその製造方法
US6348294B1 (en) * 1997-06-13 2002-02-19 Sony Corporation Glassmastering photoresist read after write method and system
JP2004259374A (ja) * 2003-02-26 2004-09-16 Tdk Corp 情報記録ディスクのメタルマスタの製造方法及びメタルマスタ
JP2005048209A (ja) * 2003-07-30 2005-02-24 Hitachi Ltd 無電解メッキ方法、無電解メッキ装置、半導体装置の製造方法及びその製造装置
JP6649097B2 (ja) * 2016-02-01 2020-02-19 学校法人東京薬科大学 光ファイバー表面プラズモン共鳴センサーの製造方法および光ファイバー表面プラズモン共鳴センサーの製造装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3073719A (en) * 1945-09-20 1963-01-15 Du Pont Spray method for making metallic flake pigmented films
US3818863A (en) * 1962-08-14 1974-06-25 Celanese Corp Centrifugal spray apparatus
GB1058021A (en) * 1963-05-13 1967-02-08 Josef Tvrsky Device for silvering electrically unconductive objects
US3647514A (en) * 1968-08-28 1972-03-07 Knapsack Ag Surface-pretreatment of articles made from polyethylene or polypropylene or corresponding copolymers for chemical nickel-plating
US3821016A (en) * 1972-05-19 1974-06-28 Western Electric Co Method of forming an adherent metallic pattern on a polyimide surface
SU881080A1 (ru) * 1977-12-27 1981-11-15 Организация П/Я Х-5263 Устройство дл нанесени покрытий
US4332833A (en) * 1980-02-29 1982-06-01 Bell Telephone Laboratories, Incorporated Method for optical monitoring in materials fabrication
JPS57135066A (en) * 1981-02-14 1982-08-20 Tatsumo Kk Rotary applying machine
DE3135443A1 (de) * 1981-09-08 1983-03-24 Leybold-Heraeus GmbH, 5000 Köln Verfahren und fotometrische anordnung zur dickenmessung und -steuerung optisch wirksamer schichten
US4564280A (en) * 1982-10-28 1986-01-14 Fujitsu Limited Method and apparatus for developing resist film including a movable nozzle arm
SE455441B (sv) * 1986-11-24 1988-07-11 Refina Instr Ab Sett att styra och/eller meta tjockleken av skikt sasom ytskikt pa underlag
US4832799A (en) * 1987-02-24 1989-05-23 Polyonics Corporation Process for coating at least one surface of a polyimide sheet with copper
JP2675309B2 (ja) * 1987-09-19 1997-11-12 パイオニア株式会社 無電解めっき方法及びその装置
US4857367A (en) * 1987-10-16 1989-08-15 Thorn Brent A Method of and apparatus for spraying
US4864966A (en) * 1988-02-05 1989-09-12 Automated Artists Corp. Robotic airbrush apparatus
NL8802211A (nl) * 1988-09-08 1990-04-02 Philips Nv Werkwijze voor de vervaardiging van een metalen matrijs.
US5238702A (en) * 1988-10-27 1993-08-24 Henning Giesecke Electrically conductive patterns
KR920701518A (ko) * 1988-11-14 1992-08-11 토마스 엘. 무어헤드 인쇄회로 기판에 증기차단 피복을 적용하기 위한 장치 및 방법
US5141778A (en) * 1989-10-12 1992-08-25 Enthone, Incorporated Method of preparing aluminum memory disks having a smooth metal plated finish

Also Published As

Publication number Publication date
US5403625A (en) 1995-04-04
DE69115315D1 (de) 1996-01-25
HK168696A (en) 1996-09-20
NL9000323A (nl) 1991-09-02
EP0448138B1 (de) 1995-12-13
KR910015978A (ko) 1991-09-30
EP0448138A1 (de) 1991-09-25
JPH04218676A (ja) 1992-08-10
KR100221105B1 (ko) 1999-09-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8339 Ceased/non-payment of the annual fee