DE69113066T2 - Behälter für flüssigen Rohstoff. - Google Patents

Behälter für flüssigen Rohstoff.

Info

Publication number
DE69113066T2
DE69113066T2 DE1991613066 DE69113066T DE69113066T2 DE 69113066 T2 DE69113066 T2 DE 69113066T2 DE 1991613066 DE1991613066 DE 1991613066 DE 69113066 T DE69113066 T DE 69113066T DE 69113066 T2 DE69113066 T2 DE 69113066T2
Authority
DE
Germany
Prior art keywords
container
raw material
liquid raw
liquid
raw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1991613066
Other languages
English (en)
Other versions
DE69113066D1 (de
Inventor
Shinji Miyazaki
Yoshitaka Tsunashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69113066D1 publication Critical patent/DE69113066D1/de
Publication of DE69113066T2 publication Critical patent/DE69113066T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/44Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/14Feed and outlet means for the gases; Modifying the flow of the reactive gases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/2931Diverse fluid containing pressure systems
    • Y10T137/3115Gas pressure storage over or displacement of liquid
    • Y10T137/3127With gas maintenance or application
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/4238With cleaner, lubrication added to fluid or liquid sealing at valve interface
    • Y10T137/4245Cleaning or steam sterilizing
    • Y10T137/4259With separate material addition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
  • Loading And Unloading Of Fuel Tanks Or Ships (AREA)
  • Jet Pumps And Other Pumps (AREA)
DE1991613066 1990-01-11 1991-01-02 Behälter für flüssigen Rohstoff. Expired - Fee Related DE69113066T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP433790A JP2614338B2 (ja) 1990-01-11 1990-01-11 液体ソース容器

Publications (2)

Publication Number Publication Date
DE69113066D1 DE69113066D1 (de) 1995-10-26
DE69113066T2 true DE69113066T2 (de) 1996-04-11

Family

ID=11581628

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1991613066 Expired - Fee Related DE69113066T2 (de) 1990-01-11 1991-01-02 Behälter für flüssigen Rohstoff.

Country Status (5)

Country Link
US (1) US5069244A (de)
EP (1) EP0437196B1 (de)
JP (1) JP2614338B2 (de)
KR (1) KR930007441B1 (de)
DE (1) DE69113066T2 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5174323A (en) * 1992-03-02 1992-12-29 Kent Haselden Liquid material reservoir
GB9206552D0 (en) * 1992-03-26 1992-05-06 Epichem Ltd Bubblers
IT1257434B (it) * 1992-12-04 1996-01-17 Cselt Centro Studi Lab Telecom Generatore di vapori per impianti di deposizione chimica da fase vapore
US5449294A (en) * 1993-03-26 1995-09-12 Texas Instruments Incorporated Multiple valve assembly and process
IL108992A (en) * 1993-03-29 1997-11-20 Johnson & Johnson Vision Prod Solution removal nozzle
US5465766A (en) * 1993-04-28 1995-11-14 Advanced Delivery & Chemical Systems, Inc. Chemical refill system for high purity chemicals
US5607002A (en) * 1993-04-28 1997-03-04 Advanced Delivery & Chemical Systems, Inc. Chemical refill system for high purity chemicals
US5964254A (en) * 1997-07-11 1999-10-12 Advanced Delivery & Chemical Systems, Ltd. Delivery system and manifold
US5878793A (en) * 1993-04-28 1999-03-09 Siegele; Stephen H. Refillable ampule and method re same
US6260588B1 (en) 1993-04-28 2001-07-17 Advanced Technology Materials, Inc. Bulk chemical delivery system
US5950693A (en) * 1993-04-28 1999-09-14 Advanced Delivery & Chemical Systems, Ltd. Bulk chemical delivery system
US6029717A (en) * 1993-04-28 2000-02-29 Advanced Delivery & Chemical Systems, Ltd. High aspect ratio containers for ultrahigh purity chemicals
US6557593B2 (en) 1993-04-28 2003-05-06 Advanced Technology Materials, Inc. Refillable ampule and method re same
JP2813856B2 (ja) * 1993-11-29 1998-10-22 日本エア・リキード株式会社 シリンダ付ガス供給装置
US5582366A (en) * 1995-01-19 1996-12-10 Motorola, Inc. Satellite fueling system and method therefor
US5531240A (en) * 1995-03-13 1996-07-02 Kelada; Maher I. Method and apparatus for spill free liquid transfer
US5878767A (en) * 1996-12-13 1999-03-09 Novus International, Inc. Fluid transfer system
US6536460B1 (en) * 1997-03-21 2003-03-25 Advanced Micro Devices, Inc. Process line purge system and method
US6199599B1 (en) 1997-07-11 2001-03-13 Advanced Delivery & Chemical Systems Ltd. Chemical delivery system having purge system utilizing multiple purge techniques
US6296026B1 (en) 1997-06-26 2001-10-02 Advanced Technology Materials, Inc. Chemical delivery system having purge system utilizing multiple purge techniques
US6296025B1 (en) 1997-07-11 2001-10-02 Advanced Technology Materials, Inc. Chemical delivery system having purge system utilizing multiple purge techniques
US6435229B1 (en) 1997-07-11 2002-08-20 Advanced Technology Materials, Inc. Bulk chemical delivery system
US6637475B2 (en) 1997-07-11 2003-10-28 Advanced Technology Materials, Inc. Bulk chemical delivery system
DE19735399C2 (de) * 1997-08-14 2002-01-17 Infineon Technologies Ag Gasleitungssystem für einen Prozeßreaktor, insbesondere Vertikalofen, zur Behandlung von Wafern und Verfahren zur Behandlung von Wafern in einem Prozeßreaktor
KR100625865B1 (ko) * 1998-06-08 2006-09-20 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 복합 정화 기법을 사용하는 정화 시스템이 구비된 화학물분배 시스템
JP2000205499A (ja) * 1999-01-18 2000-07-25 Air Liquide Japan Ltd 液体供給装置及び液体供給装置におけるパ―ジ方法
US6293430B1 (en) 1999-09-25 2001-09-25 Odell Kent Haselden, Jr. Apparatus and method for recovering beverage syrup
US6837251B1 (en) * 2000-06-21 2005-01-04 Air Products And Chemicals, Inc. Multiple contents container assembly for ultrapure solvent purging
US6604555B2 (en) 2000-08-04 2003-08-12 Arch Specialty Chemicals, Inc. Automatic refill system for ultra pure or contamination sensitive chemicals
EP1309820B1 (de) 2000-08-04 2007-09-26 FujiFilm Electronic Materials USA, Inc. Automatisches auffüllsystem für hochreine oder kontaminationsempfindliche chemikalien
DE50100049D1 (de) * 2001-03-29 2002-12-12 Cs Clean Systems Ag Vorratsbehälter für flüssige, hochreine Substanzen mit einer Einrichtung zur Reinigung der Anschlussstücke und Rohrleitungen des Vorratsbehälters
US7334708B2 (en) * 2001-07-16 2008-02-26 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Integral blocks, chemical delivery systems and methods for delivering an ultrapure chemical
US7077388B2 (en) * 2002-07-19 2006-07-18 Asm America, Inc. Bubbler for substrate processing
US6921062B2 (en) * 2002-07-23 2005-07-26 Advanced Technology Materials, Inc. Vaporizer delivery ampoule
JP2005131632A (ja) * 2003-10-08 2005-05-26 Adeka Engineering & Consutruction Co Ltd 流体供給装置
US20060107898A1 (en) * 2004-11-19 2006-05-25 Blomberg Tom E Method and apparatus for measuring consumption of reactants
US7828004B2 (en) * 2007-08-27 2010-11-09 Rohde Uwe Method and device for storing chemical products in a container
US8158530B2 (en) * 2008-09-10 2012-04-17 Globalfoundries Inc. Methods for retaining metal-comprising materials using liquid chemistry dispense systems from which oxygen has been removed
US8151814B2 (en) * 2009-01-13 2012-04-10 Asm Japan K.K. Method for controlling flow and concentration of liquid precursor
US9598766B2 (en) * 2012-05-27 2017-03-21 Air Products And Chemicals, Inc. Vessel with filter
KR101497420B1 (ko) * 2013-07-05 2015-03-03 삼성중공업 주식회사 증발가스 저감용 액화천연가스 수송장치
US20150259797A1 (en) * 2014-03-17 2015-09-17 Jiangsu Nata Opto-electronic Material Co., Ltd. Liquid-Metal Organic Compound Supply System
KR101585054B1 (ko) * 2014-05-09 2016-01-14 한국생산기술연구원 액상 전구체 공급장치
US20180033614A1 (en) 2016-07-27 2018-02-01 Versum Materials Us, Llc Compositions and Methods Using Same for Carbon Doped Silicon Containing Films
US10822458B2 (en) 2017-02-08 2020-11-03 Versum Materials Us, Llc Organoamino-functionalized linear and cyclic oligosiloxanes for deposition of silicon-containing films
SG10201903201XA (en) 2018-04-11 2019-11-28 Versum Materials Us Llc Organoamino-functionalized cyclic oligosiloxanes for deposition of silicon-containing films
US10985010B2 (en) 2018-08-29 2021-04-20 Versum Materials Us, Llc Methods for making silicon and nitrogen containing films
US20200071819A1 (en) 2018-08-29 2020-03-05 Versum Materials Us, Llc Methods For Making Silicon Containing Films That Have High Carbon Content
CN112969818A (zh) 2018-10-03 2021-06-15 弗萨姆材料美国有限责任公司 用于制备含硅和氮的膜的方法
US11649547B2 (en) 2019-02-05 2023-05-16 Versum Materials Us, Llc Deposition of carbon doped silicon oxide
WO2021201910A1 (en) 2020-04-02 2021-10-07 Versum Materials Us, Llc Organoamino-functionalized cyclic oligosiloxanes for deposition of silicon-containing films

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60244333A (ja) * 1984-05-21 1985-12-04 Sumitomo Electric Ind Ltd 原料液補給装置
JP2585296B2 (ja) * 1987-09-25 1997-02-26 株式会社東芝 有機金属熱分解法気相成長装置
JPH01156742U (de) * 1988-04-21 1989-10-27
US4941593A (en) * 1989-01-11 1990-07-17 Hicks Robert C Cleaning system for beverage delivery conduits
EP0382987A1 (de) * 1989-02-13 1990-08-22 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Gasversorgungsanlage

Also Published As

Publication number Publication date
EP0437196B1 (de) 1995-09-20
DE69113066D1 (de) 1995-10-26
US5069244A (en) 1991-12-03
KR930007441B1 (ko) 1993-08-10
KR910015018A (ko) 1991-08-31
JP2614338B2 (ja) 1997-05-28
EP0437196A1 (de) 1991-07-17
JPH03208889A (ja) 1991-09-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee